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ContactMemory(55331)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Number of Pins | Density | ECCN Code | Additional Feature | Radiation Hardening | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Memory Size | Memory Type | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Memory Format | Memory Interface | Organization | Memory Width | Write Cycle Time - Word, Page | Memory Density | Alternate Memory Width | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Ready/Busy | Boot Block | Common Flash Interface | Page Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MT29F32G08CBADBWP-12:D TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | 2.7V~3.6V | 48-TSOP I | 32Gb 4G x 8 | Non-Volatile | 83MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S29CD016J1JDGH017 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | CD-J | Surface Mount | -40°C~145°C TA | Tray | 3 (168 Hours) | FLASH - NOR | ASYNCHRONOUS | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/cypresssemiconductorcorp-s29cd016j0mdgh114-datasheets-5427.pdf | Die | 74 | EAR99 | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK | 8542.32.00.51 | 1 | YES | 1.65V~2.75V | UPPER | NOT SPECIFIED | 2.6V | 2.75V | 2.5V | NOT SPECIFIED | Not Qualified | R-XUUC-N74 | 16Mb 512K x 32 | Non-Volatile | 54ns | 2.7V | 40MHz | FLASH | Parallel | 512KX32 | 32 | 60ns | 16777216 bit | |||||||||||||||||||||||||||||||||||
| MT29F4G16ABADAH4-AAT:D TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 63-VFBGA | 2.7V~3.6V | 63-VFBGA | 4Gb 256M x 16 | Non-Volatile | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S29CL016J0PQFM030 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | CL-J | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | FLASH - NOR | ASYNCHRONOUS | 3.35mm | ROHS3 Compliant | 80-BQFP | 20mm | 14mm | 80 | 50 Weeks | 80 | EAR99 | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) | YES | 1.65V~3.6V | QUAD | 260 | 3.3V | 0.8mm | 3.6V | 3V | 40 | 1.8/3.33.3V | 0.09mA | Not Qualified | 16Mb 512K x 32 | Non-Volatile | 54ns | 3.3V | 66MHz | FLASH | Parallel | 512KX32 | 32 | 60ns | 16777216 bit | 0.00006A | YES | YES | YES | 1630 | 2K16K | YES | BOTTOM | YES | ||||||||||||||||||
| S29GL032N90TAI030 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | GL-N | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NOR | ASYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2015 | 48-TFSOP (0.724, 18.40mm Width) | 18.4mm | 14mm | 48 | 3A991.B.1.A | 8542.32.00.51 | 1 | e0 | Tin/Lead (Sn/Pb) | YES | 2.7V~3.6V | DUAL | 240 | 3V | 0.5mm | 3.6V | 2.7V | 30 | 3/3.3V | 0.05mA | Not Qualified | R-PDSO-G48 | 32Mb 4M x 8 2M x 16 | Non-Volatile | 3V | FLASH | Parallel | 2MX16 | 16 | 90ns | 33554432 bit | 8 | 0.000005A | 90 ns | YES | YES | YES | 863 | 8K64K | YES | TOP | YES | 8/16words | ||||||||||||||||||
| MT29F256G08CMCABH2-12Z:A TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 100-TBGA | 2.7V~3.6V | 100-TBGA (12x18) | 256Gb 32G x 8 | Non-Volatile | 83MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S29CD032J0RFAM010 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | CD-J | Surface Mount | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | FLASH - NOR | 1.4mm | ROHS3 Compliant | 80-LBGA | 13mm | 2.6V | 80 | 80 | 32 Mb | 3A991.B.1.A | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK | 8542.32.00.51 | 1 | 55mA | e0 | Tin/Lead (Sn/Pb) | 1.65V~2.75V | BOTTOM | NOT SPECIFIED | 2.6V | 1mm | 2.75V | 2.5V | NOT SPECIFIED | Not Qualified | 32Mb 1M x 32 | Non-Volatile | 54ns | 2.7V | 75MHz | 20b | FLASH | Parallel | 1MX32 | 32 | 60ns | 0.00006A | 32b | Asynchronous | YES | YES | YES | 1662 | 2K16K | YES | BOTTOM | YES | ||||||||||||||||||
| MT29F384G08EBCBBJ4-37:B TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 132-VBGA | 2.7V~3.6V | 384Gb 48G x 8 | Non-Volatile | 267MHz | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29F256G08EECBBJ4-10ES:B TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 132-VBGA | 2.7V~3.6V | 132-VBGA (12x18) | 256Gb 32G x 8 | Non-Volatile | 100MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29F2T08CWCCBJ7-12:C TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 152-LBGA | 2.7V~3.6V | 152-LBGA (14x18) | 2Tb 256G x 8 | Non-Volatile | 83MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EDFP112A3PD-GD-F-D | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | -30°C~85°C TA | Tray | 3 (168 Hours) | SDRAM - Mobile LPDDR3 | ROHS3 Compliant | FBGA | 1.14V~1.95V | 24Gb 192M x 128 | Volatile | 800MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29F128G08CECDBJ4-6ITR:D TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 2.7V~3.6V | 128Gb 16G x 8 | Non-Volatile | 166MHz | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29F3T08EUCBBM4-37:B TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 12 Weeks | 2.7V~3.6V | 3Tb 384G x 8 | Non-Volatile | 267MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29F256G08EFCDBWP-10M:D TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | 12 Weeks | 2.7V~3.6V | 256Gb 32G x 8 | Non-Volatile | 100MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29F4G08ABADAWP-AT:D TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | 2.7V~3.6V | 4Gb 512M x 8 | Non-Volatile | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29F256G08EECDBJ4-5M:D TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 132-VBGA | 12 Weeks | 2.7V~3.6V | 256Gb 32G x 8 | Non-Volatile | 200MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S29CL032J0PQFM010 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | CL-J | Surface Mount | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | FLASH - NOR | 3.35mm | ROHS3 Compliant | 80-BQFP | 20mm | 3.3V | 80 | 80 | 32 Mb | 3A991.B.1.A | No | 8542.32.00.51 | 1 | 75mA | e3 | Matte Tin (Sn) | 1.65V~3.6V | QUAD | 3.3V | 0.8mm | 3.6V | 3V | 32Mb 1M x 32 | Non-Volatile | 54ns | 66MHz | 20b | FLASH | Parallel | 1MX32 | 32 | 60ns | 0.00006A | 32b | Asynchronous | YES | YES | YES | 1662 | 2K16K | YES | BOTTOM | YES | ||||||||||||||||||||||
| MT29F256G08EFEBBWP-M:B TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | 2.7V~3.6V | 48-TSOP I | 256Gb 32G x 8 | Non-Volatile | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29F3T08EUHBBM4-3RES:B TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 12 Weeks | 2.5V~3.6V | 3Tb 384G x 8 | Non-Volatile | 333MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29F32G08CBADAWP-M:D TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | 2.7V~3.6V | 32Gb 4G x 8 | Non-Volatile | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29F256G08CMCGBJ4-37ES:G TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 132-VBGA | 2.7V~3.6V | 132-VBGA (12x18) | 256Gb 32G x 8 | Non-Volatile | 267MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29F1T08CUEABH8-12IT:A TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 152-LBGA | 2.7V~3.6V | 152-LBGA (14x18) | 1Tb 128G x 8 | Non-Volatile | 83MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S29CL032J0JQAI000 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | CL-J | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NOR | ASYNCHRONOUS | 3.35mm | ROHS3 Compliant | 2017 | 80-BQFP | 20mm | 14mm | 80 | 8 Weeks | 80 | 3A991.B.1.A | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK | 8542.32.00.51 | 1 | e0 | Tin/Lead (Sn/Pb) | YES | 1.65V~3.6V | QUAD | 240 | 3.3V | 0.8mm | 3.6V | 3V | 30 | 1.8/3.33.3V | 0.09mA | Not Qualified | 32Mb 1M x 32 | Non-Volatile | 54ns | 3.3V | 40MHz | FLASH | Parallel | 1MX32 | 32 | 60ns | 33554432 bit | 0.00006A | YES | YES | YES | 1662 | 2K16K | YES | TOP | YES | |||||||||||||||||
| MT29F2T08CVCBBG6-6R:B TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 272-LFBGA | 2.7V~3.6V | 272-LFBGA (14x18) | 2Tb 256G x 8 | Non-Volatile | 167MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29F2T08CWCBBJ7-6R:B TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 152-LBGA | 2.7V~3.6V | 152-LBGA (14x18) | 2Tb 256G x 8 | Non-Volatile | 167MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29F2T08CUHBBM4-3RES:B TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 12 Weeks | 2.5V~3.6V | 2Tb 256G x 8 | Non-Volatile | 333MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29F2T08CTCBBJ7-6R:B TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 152-LBGA | 2.7V~3.6V | 152-LBGA (14x18) | 2Tb 256G x 8 | Non-Volatile | 167MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S29CD016J0MQAM010 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | CD-J | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | FLASH - NOR | ASYNCHRONOUS | 3.35mm | ROHS3 Compliant | 80-BQFP | 20mm | 14mm | 80 | 80 | EAR99 | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK | 8542.32.00.51 | 1 | e0 | Tin/Lead (Sn/Pb) | YES | 1.65V~2.75V | QUAD | 240 | 2.6V | 0.8mm | 2.75V | 2.5V | 30 | 1.8/2.62.6V | 0.09mA | Not Qualified | 16Mb 512K x 32 | Non-Volatile | 54ns | 2.7V | 56MHz | FLASH | Parallel | 512KX32 | 32 | 60ns | 16777216 bit | 0.00006A | YES | YES | YES | 1630 | 2K16K | YES | BOTTOM | YES | |||||||||||||||||||
| MT29F384G08EBHBBJ4-3RES:B TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 132-VBGA | 12 Weeks | 2.5V~3.6V | 384Gb 48G x 8 | Non-Volatile | 333MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29F3T08EUCBBM4-37ES:B TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 12 Weeks | 2.7V~3.6V | 3Tb 384G x 8 | Non-Volatile | 267MHz | FLASH | Parallel |
