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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Data Bus Width | Frequency (Max) | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Alternate Memory Width | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | Data Polling | Toggle Bit | Number of Sectors/Size | Sector Size | Ready/Busy | Boot Block | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| IDT71P72604S167BQG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 167MHz | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p72604s167bqg-datasheets-6941.pdf | 15mm | 1.8V | 165 | 1.9V | 1.7V | 165 | Parallel | 18 Mb | 2 | PIPELINED ARCHITECTURE | 1 | 850mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 1mm | 165 | COMMERCIAL | 30 | SRAMs | Not Qualified | QDR, RAM, SRAM | 3-STATE | 500 ps | 18b | 36 | 36b | Synchronous | SEPARATE | ||||||||||||||||||||||||||||||||||||||||
| IDT71V67603S133PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67603s133pfi-datasheets-6940.pdf | TQFP | 20mm | 3.3V | 100 | 3.465V | 3.135V | 100 | Parallel | 9 Mb | 1 | PIPELINED ARCHITECTURE | not_compliant | 1 | 280mA | e0 | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 20 | SRAMs | Not Qualified | RAM, SRAM | 3-STATE | 4.2 ns | 18b | 256KX36 | 36 | 0.07A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||||||||||||
| TC58NVG0S3HBAI6 | Toshiba |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 85°C | -40°C | CMOS | ASYNCHRONOUS | 1mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/toshiba-tc58nvg0s3hbai6-datasheets-6910.pdf | BGA | 8mm | 6.5mm | 67 | 67 | Parallel | 1 | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 0.8mm | 67 | INDUSTRIAL | 3.6V | 2.7V | NOT SPECIFIED | EEPROM, NAND | 3.3V | 128MX8 | 8 | 1073741824 bit | |||||||||||||||||||||||||||||||||||||||||||||||||
| 71V016SA12PHGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v016sa12phgi8-datasheets-6901.pdf | TSOP | 18.41mm | 10.16mm | 3.3V | Lead Free | 44 | 12 Weeks | 3.6V | 3V | 44 | Parallel | 1 Mb | yes | 1mm | 1 | No | 1 | 160mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 0.8mm | 44 | INDUSTRIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 12 ns | 16b | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||||||||
| 71V3557S80PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 95MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3557s80pfg-datasheets-6883.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | FLOW-THROUGH ARCHITECHTURE | No | 1 | 250mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 100MHz | 3-STATE | 8 ns | 17b | 0.04A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||||||
| 70V9089L9PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | 40MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9089l9pf-datasheets-6876.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 7 Weeks | 3.6V | 3V | 100 | Parallel | 512 kb | 1.4mm | 2 | No | 225mA | RAM, SRAM | 20 ns | 16b | 8b | Synchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7007L20J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7007l20j8-datasheets-6873.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 256 kb | 3.63mm | 2 | No | 275mA | 32kB | RAM, SDR, SRAM | 20 ns | 15b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7054L35PRF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2001 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7054l35prf8-datasheets-6859.pdf | TQFP | 20mm | 14mm | 5V | Contains Lead | 128 | 7 Weeks | 5.5V | 4.5V | 128 | Parallel | 32 kb | no | 1.4mm | 4 | EAR99 | AUTOMATIC POWER DOWN; LOW POWER STANDBY MODE | No | 1 | 250mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 5V | 0.5mm | 128 | COMMERCIAL | SRAMs | 5V | RAM, SRAM | 3-STATE | 35 ns | 12b | 0.0015A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||||||||
| IDT71T75902S80BGG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 2.36mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75902s80bgg8-datasheets-6849.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | 8542.32.00.41 | 1 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 2.5V | 1.27mm | 119 | COMMERCIAL | 2.625V | 2.375V | 30 | Not Qualified | RAM, SRAM | 1MX18 | 18 | 18874368 bit | 8 ns | |||||||||||||||||||||||||||||||||||||||||||
| IDT71V424YS12PH | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v424ys12ph-datasheets-6829.pdf | TSOP | 18.41mm | 10.16mm | 44 | Parallel | yes | 3A991.B.2.A | unknown | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | GULL WING | 260 | 3.3V | 0.8mm | 44 | INDUSTRIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.17mA | Not Qualified | R-PDSO-G44 | RAM, SRAM - Asynchronous | 3-STATE | 512KX8 | 8 | 4194304 bit | 0.02A | 12 ns | COMMON | 3V | ||||||||||||||||||||||||||||||||||||
| 70V9359L6PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 52.6MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9359l6pf8-datasheets-6823.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 144 kb | no | 1.4mm | 2 | EAR99 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 330mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 18kB | RAM, SDR, SRAM | 3-STATE | 6 ns | 26b | 8KX18 | 0.003A | 18b | Synchronous | COMMON | 3V | ||||||||||||||||||||||||||||
| 7014S20PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7014s20pf-datasheets-6825.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 36 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 245mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 4.5kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 24b | 4KX9 | 9b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||
| 7132SA55J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7132sa55j8-datasheets-6815.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | 3.63mm | 2 | No | 155mA | 2kB | RAM, SDR, SRAM | 55 ns | 22b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70121L25JG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | 70°C | 0°C | CMOS | ASYNCHRONOUS | 4.57mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70121l25jg8-datasheets-6771.pdf | PLCC | 19mm | 19mm | 5V | Lead Free | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 18 kb | yes | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | J BEND | 260 | 5V | 52 | COMMERCIAL | NOT SPECIFIED | SRAMs | 5V | Not Qualified | 2.3kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 22b | 0.005A | COMMON | 2V | ||||||||||||||||||||||||||||||||
| TC58NVG0S3HBAI4 | Toshiba |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 85°C | -40°C | CMOS | ASYNCHRONOUS | 1mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/toshiba-tc58nvg0s3hbai4-datasheets-6759.pdf | TFBGA | 11mm | 9mm | 63 | 131 Weeks | 63 | Parallel | 1 | YES | BOTTOM | BALL | 3.3V | 0.8mm | 63 | INDUSTRIAL | 3.6V | 2.7V | EEPROM, NAND | 3.3V | 128MX8 | 8 | 1073741824 bit | ||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V424YS10PHI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 85°C | -40°C | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v424ys10phi8-datasheets-6747.pdf | TSOP | Parallel | RAM, SRAM - Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71T75902S80BGG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 70°C | 0°C | CMOS | SYNCHRONOUS | 2.36mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75902s80bgg-datasheets-6742.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | unknown | 8542.32.00.41 | 1 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 2.5V | 1.27mm | 119 | COMMERCIAL | 2.625V | 2.375V | Not Qualified | RAM, SRAM | 1MX18 | 18 | 18874368 bit | 8 ns | ||||||||||||||||||||||||||||||||||||||||||||||
| 7005S25G | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005s25g-datasheets-6730.pdf | 29.46mm | 29.46mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 64 kb | no | 3.68mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE | No | 1 | 265mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 240 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 26b | 8KX8 | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||||
| 7054L35PRF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7054l35prf-datasheets-6729.pdf | TQFP | 20mm | 14mm | 5V | Contains Lead | 128 | 7 Weeks | 5.5V | 4.5V | 128 | Parallel | 32 kb | no | 1.4mm | 4 | EAR99 | AUTOMATIC POWER DOWN; LOW POWER STANDBY MODE | No | 1 | 250mA | e0 | Tin/Lead (Sn/Pb) | QUAD | FLAT | 225 | 5V | 0.5mm | 128 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 12b | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||||||
| IDT71V124SA15PHI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.2mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v124sa15phi8-datasheets-6722.pdf | SOIC | 20.95mm | 10.16mm | 32 | Parallel | no | 3A991.B.2.B | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | GULL WING | 225 | 3.3V | 1.27mm | 32 | INDUSTRIAL | 3.6V | 3.15V | 30 | SRAMs | 3.3V | 0.12mA | Not Qualified | R-PDSO-G32 | RAM, SRAM - Asynchronous | 3-STATE | 128KX8 | 8 | 1048576 bit | 0.01A | 15 ns | COMMON | 3V | |||||||||||||||||||||||||||||||||||
| IDT71V3557S85PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3557s85pf-datasheets-6719.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.225mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 90MHz | 128KX36 | 36 | 4718592 bit | 0.04A | 8.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||
| IDT71T75602S100PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape and Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75602s100pfg8-datasheets-6718.pdf | TQFP | 20mm | 2.5V | 100 | 2.625V | 2.375V | 100 | Parallel | 18 Mb | 1 | PIPELINED ARCHITECTURE | unknown | 1 | 175mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 2.5V | 0.65mm | 100 | COMMERCIAL | SRAMs | Not Qualified | RAM, SRAM | 3-STATE | 5 ns | 19b | 36 | 0.04A | 36b | Synchronous | COMMON | 2.38V | |||||||||||||||||||||||||||||||||||||
| MX29SL802CBXHI-90G | Macronix |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | CMOS | ASYNCHRONOUS | 0.75mm | RoHS Compliant | TFBGA | 6mm | 5mm | 1.8V | Lead Free | 48 | Parallel | 8 Mb | EAR99 | unknown | 8542.32.00.51 | 1 | YES | BOTTOM | BALL | NOT SPECIFIED | 1.8V | 0.5mm | 48 | INDUSTRIAL | 2.2V | 1.65V | NOT SPECIFIED | Flash Memories | 1.8/2V | 0.025mA | Not Qualified | R-PBGA-B48 | FLASH, NOR | 90 ns | 512KX16 | 16 | 8 | 0.000005A | YES | YES | 12115 | 16K8K32K64K | YES | BOTTOM | |||||||||||||||||||||||||||||||||||
| TC58BVG1S3HTAI0 | Toshiba |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 85°C | -40°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/toshiba-tc58bvg1s3htai0-datasheets-6675.pdf | TFSOP | 20mm | 12mm | 3.6V | 2.7V | 48 | Parallel | 256MB | EEPROM, NAND | 8b | 40 μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71V3557S75PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3557s75pfg8-datasheets-6669.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 275mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 100MHz | 3-STATE | 7.5 ns | 17b | 0.04A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||||||
| 70V3579S4BC8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3579s4bc8-datasheets-6665.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 1.1 Mb | no | 1.4mm | 2 | PIPELINED OUTPUT MODE, SELF-TIMED WRITE CYCLE | No | 1 | 460mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 4.2 ns | 30b | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||||||||
| IDT71V424YS10PHI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v424ys10phi-datasheets-6622.pdf | TSOP | Parallel | RAM, SRAM - Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71T75902S80BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75902s80bg8-datasheets-6603.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 2.5V | 1.27mm | 119 | COMMERCIAL | 2.625V | 2.375V | NOT SPECIFIED | SRAMs | 2.5V | 0.25mA | Not Qualified | RAM, SRAM | 3-STATE | 95MHz | 1MX18 | 18 | 18874368 bit | 0.04A | 8 ns | COMMON | 2.38V | ||||||||||||||||||||||||||||||||||
| IDT70824S35PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | ASYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt70824s35pf-datasheets-6599.pdf | LQFP | 14mm | 14mm | 80 | Parallel | EAR99 | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 5V | 0.65mm | 80 | COMMERCIAL | 5.5V | 4.5V | 20 | Other Memory ICs | 5V | 0.34mA | Not Qualified | S-PQFP-G80 | RAM | 4KX16 | 16 | 65536 bit | 0.015A | 35 ns | |||||||||||||||||||||||||||||||||||||||
| 70V06L20JGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | 4.57mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v06l20jgi-datasheets-6548.pdf | PLCC | 24mm | 24mm | 3.3V | Lead Free | 68 | 7 Weeks | 3.6V | 3V | 68 | Parallel | 128 kb | yes | 3.63mm | 2 | EAR99 | No | 1 | 195mA | e3 | MATTE TIN | QUAD | J BEND | 260 | 3.3V | 68 | INDUSTRIAL | RAM, SRAM | 20 ns | 28b | 16KX8 | 8b | Asynchronous |
