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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 71V3556S133PFGI | Integrated Device Technology (IDT) | $8.94 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3556s133pfgi-datasheets-5490.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | No | 1 | 310mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 17b | 0.045A | 36b | Synchronous | COMMON | ||||||||||||||||||||||
| 71321LA45J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71321la45j8-datasheets-5486.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | 3.63mm | 2 | No | 2kB | RAM, SDR, SRAM | 45 ns | 11b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| IDT71T75802S100PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2015 | /files/integrateddevicetechnology-idt71t75802s100pf8-datasheets-5481.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 2.5V | 0.65mm | 100 | COMMERCIAL | 2.625V | 2.375V | 20 | SRAMs | 2.5V | 0.175mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 1MX18 | 18 | 18874368 bit | 0.04A | 5 ns | COMMON | 2.38V | ||||||||||||||||||||||||
| 70V08S20PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v08s20pf-datasheets-5466.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | No | 1 | 255mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 64kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 16b | 64KX8 | 0.006A | 8b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||
| 71V3556SA166BGG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 2.36mm | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3556sa166bgg-datasheets-5447.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | yes | 2.15mm | 1 | No | 1 | 350mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 119 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.5 ns | 17b | 0.04A | 36b | Synchronous | COMMON | |||||||||||||||||||||||
| 71V416S12BEG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v416s12beg8-datasheets-5441.pdf | TFBGA | 9mm | 9mm | 3.3V | Lead Free | 48 | 12 Weeks | 3.6V | 3V | 48 | Parallel | 4 Mb | yes | 1.2mm | 1 | No | 1 | 180mA | e1 | TIN SILVER COPPER | BOTTOM | BALL | 260 | 3.3V | 0.75mm | 48 | COMMERCIAL | SRAMs | 512kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 12 ns | 18b | 0.02A | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||
| 71342LA20PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71342la20pf8-datasheets-5416.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 32 kb | no | 1.4mm | 2 | EAR99 | SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP | No | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 24b | 4KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||
| IDT71V424YL12PH | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v424yl12ph-datasheets-5407.pdf | TSOP | 18.41mm | 10.16mm | 44 | Parallel | yes | 3A991.B.2.A | unknown | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | GULL WING | 260 | 3.3V | 0.8mm | 44 | COMMERCIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.155mA | Not Qualified | R-PDSO-G44 | RAM, SRAM - Asynchronous | 3-STATE | 512KX8 | 8 | 4194304 bit | 0.01A | 12 ns | COMMON | 3V | |||||||||||||||||||||||||||
| 7052S35G | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 70°C | 0°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7052s35g-datasheets-5384.pdf | 30.48mm | 30.48mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 108 | Parallel | 16 kb | 3.68mm | 4 | No | 300mA | RAM, SRAM | 35 ns | 11b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||
| 7006S55PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7006s55pf-datasheets-5335.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 128 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 28b | 16KX8 | 0.015A | 8b | Asynchronous | COMMON | ||||||||||||||||||||
| 71V3556SA150BGGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | 150MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3556sa150bggi8-datasheets-5327.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 7 Weeks | 119 | Parallel | 4 Mb | yes | 2.15mm | 1 | No | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 260 | 119 | RAM, SRAM | 17b | ||||||||||||||||||||||||||||||||||||||||||||
| 70V3589S166BCG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3589s166bcg-datasheets-5328.pdf | 17mm | 17mm | 3.3V | Lead Free | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 2.3 Mb | yes | 1.4mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 500mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | 256kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 20 ns | 32b | 64KX36 | 0.03A | 36b | Synchronous | COMMON | ||||||||||||||||||||||
| 71V65803S133BQI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65803s133bqi8-datasheets-5320.pdf | 15mm | 13mm | 3.3V | Contains Lead | 165 | 7 Weeks | 3.465V | 3.135V | 165 | Parallel | 9 Mb | no | 1.2mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 320mA | e0 | TIN LEAD | BOTTOM | BALL | 225 | 3.3V | 165 | INDUSTRIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 4.2 ns | 19b | 0.06A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||
| 70T3589S200BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3589s200bc-datasheets-5317.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 2.3 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 525mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 10 ns | 32b | 64KX36 | 0.015A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| 70T3589S166BF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3589s166bf-datasheets-5318.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 2.3 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 450mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 32b | 64KX36 | 0.015A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| IDT71V424YL10PHI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 85°C | -40°C | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v424yl10phi8-datasheets-5283.pdf | TSOP | Parallel | RAM, SRAM - Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7005S20PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2016 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005s20pf-datasheets-5281.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 64 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 26b | 8KX8 | 0.155A | COMMON | |||||||||||||||||||||||
| IDT71T75602S100PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75602s100pf8-datasheets-5272.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 2.5V | 0.65mm | 100 | COMMERCIAL | 2.625V | 2.375V | 20 | SRAMs | 2.5V | 0.175mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 512KX36 | 36 | 18874368 bit | 0.04A | 5 ns | COMMON | 2.38V | ||||||||||||||||||||||||
| IDT71T75802S200PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 200MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75802s200pfi8-datasheets-5250.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 2.5V | 0.65mm | 100 | INDUSTRIAL | 2.625V | 2.375V | 20 | SRAMs | 2.5V | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 1MX18 | 18 | 18874368 bit | 3.2 ns | COMMON | 2.38V | ||||||||||||||||||||||||||
| 71V3579S80PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3579s80pfg-datasheets-5204.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | FLOW THROUGH ARCHITECTURE | No | 1 | 200mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 100MHz | 3-STATE | 8 ns | 18b | 0.03A | 18b | Synchronous | COMMON | ||||||||||||||||||||||
| 7005L55PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005l55pf-datasheets-5195.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 64 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP | No | 1 | 210mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 26b | 8KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||
| 7140SA35J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7140sa35j-datasheets-5177.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 8 kb | yes | 3.63mm | 2 | EAR99 | No | 1 | 165mA | e3 | Matte Tin (Sn) - annealed | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | 20 | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 20b | 1KX8 | 0.03A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||
| IDT71V67602S133BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67602s133bg8-datasheets-5159.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | COMMERCIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 2.53.3V | 0.28mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.07A | 4.2 ns | COMMON | 3.14V | |||||||||||||||||||||||||
| 7142SA35P | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 70°C | 0°C | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7142sa35p-datasheets-5148.pdf | PDIP | 61.7mm | 15.24mm | 5V | Contains Lead | 5.5V | 4.5V | 48 | Parallel | 16 kb | 3.8mm | 2 | No | 165mA | 2kB | RAM, SDR, SRAM | 35 ns | 22b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||
| IDT71V424YL10PHI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v424yl10phi-datasheets-5146.pdf | TSOP | Parallel | RAM, SRAM - Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71T75802S200PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 200MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75802s200pfi-datasheets-5142.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 2.5V | 0.65mm | 100 | INDUSTRIAL | 2.625V | 2.375V | 20 | SRAMs | 2.5V | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 1MX18 | 18 | 18874368 bit | 3.2 ns | COMMON | 2.38V | |||||||||||||||||||||||||||
| 6116SA55DB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | 4.826mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-6116sa55db-datasheets-5140.pdf | CDIP | 32mm | 15.24mm | 5V | Contains Lead | 24 | 10 Weeks | 5.5V | 4.5V | 24 | Parallel | 16 kb | no | 2.9mm | 1 | No | 1 | e0 | Tin/Lead (Sn63Pb37) | NO | DUAL | THROUGH-HOLE | 240 | 5V | 2.54mm | 24 | MILITARY | SRAMs | 5V | MIL-STD-883 Class B | 2kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 55 ns | 11b | 2KX8 | COMMON | |||||||||||||||||||||||||
| 71V3556SA150BGG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | 150MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3556sa150bgg8-datasheets-5092.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 7 Weeks | 119 | Parallel | 4.5 Mb | yes | 2.15mm | 1 | No | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 260 | 119 | RAM, SRAM | 17b | ||||||||||||||||||||||||||||||||||||||||||||
| 7005L35PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005l35pf-datasheets-5086.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 64 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 26b | 8KX8 | 0.0015A | COMMON | 2V | ||||||||||||||||||||||
| IDT71V424YL10PH8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v424yl10ph8-datasheets-5026.pdf | TSOP | Parallel | RAM, SRAM - Asynchronous |
