| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Lead Free | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Pbfree Code | ECCN Code | Additional Feature | Radiation Hardening | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Max Power Dissipation | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Memory Size | Oscillator Type | Number of I/O | Memory Type | Peripherals | RAM Size | Data Bus Width | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Watchdog Timer | Number of Timers/Counters | On Chip Program ROM Width | CPU Family | ROM (words) | RAM (words) | Boundary Scan | Low Power Mode | Format | Integrated Cache | RAM (bytes) | On Chip Data RAM Width | Access Time | Clock Frequency | Core Processor | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| S9S08SC4E0CTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 1999 | 16-TSSOP (0.173, 4.40mm Width) | 5mm | 4.4mm | 16 | 12 Weeks | EAR99 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 5V | 0.65mm | S9S08SC4 | 5.5V | 4.5V | 40 | Microcontrollers | 5V | 8.9mA | Not Qualified | R-PDSO-G16 | AEC-Q100 | Internal | 12 | LVD, POR, PWM, WDT | 256 x 8 | 40MHz | MICROCONTROLLER | 8 | YES | NO | YES | 4096 | 16MHz | 4.5V~5.5V | FLASH | 8-Bit | 4KB 4K x 8 | LINbus, SCI | A/D 8x10b | ||||||||||||||||||||||||||||||||||
| PIC16C621A-20E/SS | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 16C | Surface Mount | Surface Mount | -40°C~125°C TA | Tube | 1 (Unlimited) | CMOS | 20MHz | ROHS3 Compliant | 2001 | /files/microchiptechnology-pic16c620a04ip-datasheets-1594.pdf | 20-SSOP (0.209, 5.30mm Width) | 7.2mm | Lead Free | 20 | 11 Weeks | 20 | yes | No | e3 | Matte Tin (Sn) | 1W | DUAL | GULL WING | 260 | 5V | 0.65mm | PIC16C621A | 20 | 5.5V | 4.5V | 40 | Microcontrollers | 3.3/5V | 7mA | 1.8kB | External | 13 | EPROM | Brown-out Detect/Reset, POR, WDT | 96 x 8 | 8b | MICROCONTROLLER, RISC | 8 | NO | NO | NO | NO | Yes | 1 | 14 | PIC | 20 μs | PIC | 2.5V~5.5V | OTP | 8-Bit | 1.75KB 1K x 14 | |||||||||||||||||||||||||||
| MC9S08PT8VLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08pt8avtg-datasheets-5014.pdf | 32-LQFP | 32 | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 0.8mm | MC9S08PT8 | 40 | Microcontrollers | 3/5V | 14mA | Not Qualified | S-PQFP-G32 | Internal | 28 | LVD, POR, PWM, WDT | 2K x 8 | 20MHz | MICROPROCESSOR, RISC | 8 | 8192 | 2.7V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SPI, UART/USART | A/D 12x12b | 256 x 8 | |||||||||||||||||||||||||||||||||||||||||||
| MC9S08PA16VTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08pa8avtgr-datasheets-7924.pdf | 20-TSSOP (0.173, 4.40mm Width) | 6.5mm | 4.4mm | 20 | 10 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 5V | 0.65mm | 5.5V | 2.7V | 40 | Internal | 18 | LVD, POR, PWM, WDT | 2K x 8 | 20MHz | MICROCONTROLLER | 8 | YES | NO | YES | 20MHz | 2.7V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SPI, UART/USART | A/D 12x12b | 256 x 8 | ||||||||||||||||||||||||||||||||||||||||
| MC9S08QA4CFQER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08qa2cpae-datasheets-4332.pdf | 8-VDFN Exposed Pad | 10 Weeks | NOT SPECIFIED | NOT SPECIFIED | Internal | 4 | LVD, POR, PWM, WDT | 256 x 8 | 20MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 4KB 4K x 8 | A/D 4x10b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9RS08KA4CWJR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RS08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2013 | 20-SOIC (0.295, 7.50mm Width) | 12.8mm | 7.5mm | 20 | 10 Weeks | 8542.31.00.01 | YES | DUAL | GULL WING | 3.3V | 1.27mm | MC9RS08KA4 | 5.5V | 2V | Microcontrollers | 2/5V | 5mA | Not Qualified | R-PDSO-G20 | Internal | 18 | LVD, POR, PWM, WDT | 126 x 8 | 20MHz | MICROCONTROLLER, RISC | 8 | YES | NO | YES | 4096 | 16MHz | 1.8V~5.5V | FLASH | 8-Bit | 4KB 4K x 8 | I2C | A/D 12x10b | ||||||||||||||||||||||||||||||||||||||||
| MKL03Z32VFK4R | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis KL03 | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 0.65mm | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mkl03z16vfk4r-datasheets-8033.pdf | 24-VFQFN Exposed Pad | 4mm | 4mm | 24 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | YES | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | 0.5mm | 3.6V | 1.71V | NOT SPECIFIED | Microcontrollers | 1.8/3.3V | 6.82mA | Not Qualified | S-XQCC-N24 | Internal | 22 | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 2K x 8 | 48MHz | MICROCONTROLLER, RISC | 32 | YES | NO | YES | YES | CORTEX-M0 | 32768 | 2048 | 24MHz | ARM® Cortex®-M0+ | 1.71V~3.6V | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | A/D 7x12b | ||||||||||||||||||||||||||||||||
| PIC16C57T-XTE/SS | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 16C | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 4MHz | Non-RoHS Compliant | 2002 | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic16c433iso-datasheets-1108.pdf | 28-SSOP (0.209, 5.30mm Width) | 10.2mm | 28 | RS-232 | yes | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 5V | 0.65mm | PIC16C57 | 28 | 6V | 3.25V | 40 | Microcontrollers | 2.5/6.25V | 3.3mA | Not Qualified | 2kB | External | 20 | EPROM | POR, WDT | 72 x 8 | 8b | MICROCONTROLLER, RISC | 8 | NO | NO | NO | NO | 8 | PIC | 4 μs | PIC | 3.25V~6V | OTP | 8-Bit | 3KB 2K x 12 | ||||||||||||||||||||||||||||||||
| MC9S08PA16VLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08pa8avtgr-datasheets-7924.pdf | 32-LQFP | 7mm | 7mm | 32 | 14 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 5V | 0.8mm | MC9S08PA16 | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | 14mA | Not Qualified | S-PQFP-G32 | Internal | 28 | LVD, POR, PWM, WDT | 2K x 8 | 20MHz | MICROCONTROLLER | 8 | YES | NO | YES | 16384 | 20MHz | 2.7V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SPI, UART/USART | A/D 12x12b | 256 x 8 | |||||||||||||||||||||||||||||||||
| MKE02Z32VLC2R | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis KE02 | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mke02z16vlc2r-datasheets-5659.pdf | 32-LQFP | 7mm | 7mm | 32 | 20 Weeks | 3A991.A.2 | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | e3 | Tin (Sn) | YES | QUAD | GULL WING | 260 | 3V | 0.8mm | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | 14.8mA | Not Qualified | S-PQFP-G32 | Internal | 28 | LVD, PWM, WDT | 4K x 8 | 20MHz | MICROCONTROLLER, RISC | 32 | YES | NO | YES | NO | 8 | CORTEX-M0 | 32768 | 4096 | 20MHz | ARM® Cortex®-M0+ | 2.7V~5.5V | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | A/D 16x12b; D/A 2x6b | 256 x 8 | ||||||||||||||||||||||||||||
| MC9S08FL8CLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08fl16clc-datasheets-6442.pdf | 32-LQFP | 7mm | 7mm | 32 | 10 Weeks | YES | QUAD | NO LEAD | 260 | 5V | 0.8mm | 5.5V | 4.5V | 40 | Internal | 30 | LVD, PWM, WDT | 768 x 8 | 20MHz | MICROCONTROLLER | 8 | YES | NO | YES | 16MHz | 4.5V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | SCI | A/D 12x8b | ||||||||||||||||||||||||||||||||||||||||||||||
| S9KEAZN32AVLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis KEA | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-s9keazn8acfkr-datasheets-7859.pdf | 32-LQFP | 20 Weeks | Internal | 28 | LVD, POR, PWM, WDT | 4K x 8 | 40MHz | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | 2.7V~5.5V | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | A/D 16x12b SAR | 256 x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9KEAZN32AMLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis KEA | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9keazn16amlcr-datasheets-7930.pdf | 32-LQFP | 7mm | 7mm | 32 | 20 Weeks | 3A991.A.2 | 8542.31.00.01 | YES | QUAD | GULL WING | 260 | 3V | 0.8mm | 5.5V | 2.7V | 40 | S-PQFP-G32 | Internal | 28 | LVD, POR, PWM, WDT | 4K x 8 | 40MHz | MICROCONTROLLER, RISC | YES | NO | YES | NO | 8 | 32768 | 4096 | 20MHz | ARM® Cortex®-M0+ | 2.7V~5.5V | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | A/D 16x12b | 256 x 8 | |||||||||||||||||||||||||||||||||||||
| MKL02Z32VFG4R | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis KL02 | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mkl02z32vfg4-datasheets-3044.pdf | 16-UFQFN Exposed Pad | 3mm | 3mm | 16 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | YES | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | 0.5mm | 3.6V | 1.71V | NOT SPECIFIED | Microcontrollers | 1.8/3.3V | 6.4mA | Not Qualified | S-PQCC-N16 | Internal | 14 | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 4K x 8 | 48MHz | MICROCONTROLLER, RISC | 32 | YES | NO | YES | CORTEX-M0 | 32768 | 4096 | 32MHz | ARM® Cortex®-M0+ | 1.71V~3.6V | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | A/D 6x12b | ||||||||||||||||||||||||||||||||||
| PIC16C620-20E/SO | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 16C | Surface Mount | -40°C~125°C TA | Tube | 1 (Unlimited) | CMOS | 20MHz | 2.64mm | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic16c433iso-datasheets-1108.pdf | 18-SOIC (0.295, 7.50mm Width) | 11.53mm | Lead Free | 18 | No | e3 | Matte Tin (Sn) | YES | 1W | DUAL | GULL WING | 260 | 5V | 1.27mm | PIC16C620 | 18 | 6V | 4.5V | 40 | Microcontrollers | 3.3/5V | 20mA | 512B | External | 13 | EPROM | Brown-out Detect/Reset, POR, WDT | 80 x 8 | 8b | MICROCONTROLLER, RISC | 8 | NO | NO | NO | NO | Yes | 8 | PIC | 512 | 20 μs | PIC | 3V~6V | OTP | 8-Bit | 896B 512 x 14 | |||||||||||||||||||||||||||||
| PIC16C57T-RC/SS | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 16C | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 4MHz | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic16c433iso-datasheets-1108.pdf | 28-SSOP (0.209, 5.30mm Width) | 10.2mm | Lead Free | 28 | 28 | yes | No | YES | 800mW | DUAL | GULL WING | 5V | 0.65mm | PIC16C57 | 28 | 6.25V | 3V | 2kB | External | 20 | EPROM | POR, WDT | 72 x 8 | 8b | 40 MHz | 8 | NO | NO | NO | NO | Yes | 8 | 72 | 8 | 4 μs | PIC | 3V~6.25V | OTP | 8-Bit | 3KB 2K x 12 | |||||||||||||||||||||||||||||||||||
| S9S08SG4E2VTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.2mm | ROHS3 Compliant | 1999 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08sg4e2mtj-datasheets-6362.pdf | 16-TSSOP (0.173, 4.40mm Width) | 5mm | 4.4mm | 16 | 12 Weeks | EAR99 | 8542.31.00.01 | e3 | MATTE TIN | YES | DUAL | GULL WING | 260 | 5V | 0.65mm | S9S08SG4 | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | Not Qualified | R-PDSO-G16 | AEC-Q100 | Internal | 12 | LVD, POR, PWM, WDT | 256 x 8 | 40MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 4096 | 16MHz | 2.7V~5.5V | FLASH | 8-Bit | 4KB 4K x 8 | I2C, LINbus, SCI, SPI | A/D 8x10b | ||||||||||||||||||||||||||||||||
| S9S08SG4E2VTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.2mm | ROHS3 Compliant | 1999 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08sg4e2mtj-datasheets-6362.pdf | 20-TSSOP (0.173, 4.40mm Width) | 6.5mm | 5mm | 20 | 12 Weeks | EAR99 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 5V | 0.65mm | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | 120mA | Not Qualified | R-PDSO-G20 | AEC-Q100 | Internal | 16 | LVD, POR, PWM, WDT | 512 x 8 | 40MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 4096 | 256 | 2.7V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | A/D 12x10b | ||||||||||||||||||||||||||||||||
| MC9S08PT8AVLD | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08pt16avlc-datasheets-7962.pdf | 44-LQFP | 10mm | 10mm | 44 | 20 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | Tin (Sn) | YES | QUAD | GULL WING | 260 | 3V | 0.8mm | 5.5V | 2.7V | 40 | Internal | 37 | LVD, POR, PWM, WDT | 2K x 8 | 20MHz | MICROCONTROLLER | 8 | YES | NO | YES | 20MHz | 2.7V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SPI, UART/USART | A/D 12x12b | 256 x 8 | ||||||||||||||||||||||||||||||||||||||||
| MKE02Z32VLC4R | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis KE02 | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/nxpusainc-mke02z64vlh4r-datasheets-7540.pdf | 32-LQFP | 7mm | 7mm | 32 | 20 Weeks | 3A991.A.2 | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 3V | 0.8mm | 5.5V | 2.7V | 40 | S-PQFP-G32 | Internal | 28 | LVD, PWM, WDT | 4K x 8 | 40MHz | MICROCONTROLLER, RISC | 32 | YES | NO | YES | NO | 8 | 32768 | 4096 | 20MHz | ARM® Cortex®-M0+ | 2.7V~5.5V | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | A/D 16x12b; D/A 2x6b | 256 x 8 | |||||||||||||||||||||||||||||||||
| MC9S08PL16CLD | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08pl8clc-datasheets-7858.pdf | 44-LQFP | 10mm | 10mm | 44 | 20 Weeks | YES | QUAD | GULL WING | 260 | 5V | 0.8mm | 5.5V | 2.7V | 40 | Internal | 37 | LVD, POR, PWM | 2K x 8 | 20MHz | MICROCONTROLLER | 8 | YES | NO | YES | 20MHz | 2.7V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | LINbus, SCI, UART/USART | A/D 12x10b | 256 x 8 | |||||||||||||||||||||||||||||||||||||||||||||||
| S9S08SG8E2CTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.2mm | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08sg4e2mtj-datasheets-6362.pdf | 16-TSSOP (0.173, 4.40mm Width) | 5mm | 4.4mm | 16 | 12 Weeks | EAR99 | 8542.31.00.01 | e3 | MATTE TIN | YES | DUAL | GULL WING | 260 | 5V | 0.65mm | S9S08SG8 | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | Not Qualified | R-PDSO-G16 | AEC-Q100 | Internal | 12 | LVD, POR, PWM, WDT | 512 x 8 | 40MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 8192 | 16MHz | 2.7V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | A/D 8x10b | ||||||||||||||||||||||||||||||||
| MC9S08SE4CTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2006 | 16-TSSOP (0.173, 4.40mm Width) | 5mm | 4.4mm | 16 | 10 Weeks | EAR99 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 3V | 0.635mm | MC9S08SE4 | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | Not Qualified | R-PDSO-G16 | Internal | 14 | LVD, POR, PWM | 256 x 8 | 20MHz | MICROCONTROLLER | 8 | YES | NO | YES | 4096 | 16MHz | 2.7V~5.5V | FLASH | 8-Bit | 4KB 4K x 8 | LINbus, SCI | A/D 8x10b | ||||||||||||||||||||||||||||||||||||
| MKL02Z32VFM4R | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis KL02 | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mkl02z32vfg4-datasheets-3044.pdf | 32-VFQFN Exposed Pad | 5mm | 5mm | 32 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | YES | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.3V | 6.4mA | Not Qualified | S-XQCC-N32 | Internal | 28 | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 4K x 8 | 48MHz | MICROCONTROLLER, RISC | 32 | YES | NO | YES | NO | CORTEX-M0 | 32768 | 4096 | 24MHz | ARM® Cortex®-M0+ | 1.71V~3.6V | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | A/D 14x12b | |||||||||||||||||||||||||||||||||
| S9S08RN8W2MTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08rna16w2mlcr-datasheets-5909.pdf | 16-TSSOP (0.173, 4.40mm Width) | 16 Weeks | 260 | 40 | Internal | 12 | LVD, POR, PWM, WDT | 2K x 8 | 20MHz | MICROPROCESSOR | 2.7V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SPI, UART/USART | A/D 8x10b | 256 x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S08QA4CFQE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1mm | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08qa2cpae-datasheets-4332.pdf | 8-VDFN Exposed Pad | 8 | 10 Weeks | 3A991.A.2 | YES | DUAL | NO LEAD | 260 | 3V | 0.8mm | MC9S08QA4 | 3.6V | 1.8V | 40 | Microcontrollers | 2/3.3V | 5mA | Not Qualified | S-PDSO-N8 | Internal | 4 | LVD, POR, PWM, WDT | 256 x 8 | 20MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 1.8V~3.6V | FLASH | 8-Bit | 4KB 4K x 8 | A/D 4x10b | ||||||||||||||||||||||||||||||||||||||||
| MC9S08QB4CWL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 2.65mm | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08qb4ctg-datasheets-4598.pdf | 28-SOIC (0.295, 7.50mm Width) | 17.925mm | 7.5mm | 28 | 10 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 3V | 1.27mm | MC9S08QB4 | 3.6V | 1.8V | 40 | Microcontrollers | 1.8/3.6V | Not Qualified | R-PDSO-G28 | External | 22 | LVD, PWM, WDT | 256 x 8 | 20MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 4096 | 16MHz | 1.8V~3.6V | FLASH | 8-Bit | 4KB 4K x 8 | LINbus, SCI | A/D 8x12b | |||||||||||||||||||||||||||||||||
| MC9S08PT16VTG | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08pt8avtg-datasheets-5014.pdf | 16-TSSOP (0.173, 4.40mm Width) | 16 | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 5V | 0.635mm | MC9S08PT16 | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | Not Qualified | R-PDSO-G16 | Internal | 14 | LVD, POR, PWM, WDT | 2K x 8 | 20MHz | MICROPROCESSOR, RISC | 8 | 16384 | NO | YES | FIXED POINT | NO | 20MHz | 2.7V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SPI, UART/USART | A/D 12x12b | 256 x 8 | ||||||||||||||||||||||||||||||||||||
| P89LPC917FDH,129 | Rochester Electronics, LLC | $29.92 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC900 | Surface Mount | -40°C~85°C TA | Tube | 1 (Unlimited) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/rochesterelectronicsllc-p89lpc915fdh129-datasheets-5557.pdf | 16-TSSOP (0.173, 4.40mm Width) | 16-TSSOP | Internal | 14 | Brown-out Detect/Reset, LED, POR, PWM, WDT | 256 x 8 | 18MHz | 8051 | 2.4V~3.6V | FLASH | 8-Bit | 2KB 2K x 8 | I2C, UART/USART | A/D 4x8b; D/A 1x8b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S08SG4E2CTJR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.2mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08sg4e2mtj-datasheets-6362.pdf | 20-TSSOP (0.173, 4.40mm Width) | 6.5mm | 5mm | 20 | 12 Weeks | EAR99 | 8542.31.00.01 | e3 | MATTE TIN | YES | DUAL | GULL WING | 260 | 5V | 0.65mm | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | 120mA | Not Qualified | R-PDSO-G20 | AEC-Q100 | Internal | 16 | LVD, POR, PWM, WDT | 256 x 8 | 40MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 4096 | 256 | 2.7V~5.5V | FLASH | 8-Bit | 4KB 4K x 8 | I2C, LINbus, SCI, SPI | A/D 12x10b |
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