| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Lead Free | Number of Terminations | Factory Lead Time | REACH SVHC | Number of Pins | Interface | Density | ECCN Code | Additional Feature | Radiation Hardening | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Memory Size | Number of ADC Channels | Oscillator Type | Number of I/O | Peripherals | RAM Size | Data Bus Width | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Number of Timers/Counters | On Chip Program ROM Width | CPU Family | ROM (words) | Number of UART Channels | RAM (bytes) | Access Time | Clock Frequency | Core Processor | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| S9S08RNA16W2VTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2012 | 20-TSSOP (0.173, 4.40mm Width) | 16 Weeks | 260 | 40 | Internal | 16 | LVD, POR, PWM, WDT | 2K x 8 | 20MHz | MICROPROCESSOR | 2.7V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SPI, UART/USART | A/D 10x10b | 256 x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S912ZVL64F0CLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S12 MagniV | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP | 12 Weeks | Internal | 34 | LVD, POR, PWM, WDT | 1K x 8 | 32MHz | S12Z | 5.5V~18V | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART | A/D 10x10b | 512 x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S12G64AVLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP | 12 Weeks | Internal | 40 | LVD, POR, PWM, WDT | 4K x 8 | 25MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, IrDA, LINbus, SCI, SPI | A/D 12x10b | 2K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC56F82323VFM | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 56F8xxx | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | 32-VFQFN Exposed Pad | 5mm | 5mm | 32 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | YES | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 3.6V | 2.7V | 40 | Microcontrollers | 3.3V | 43.5mA | Not Qualified | S-PQCC-N32 | Internal | 26 | DMA, POR, PWM, WDT | 6K x 8 | 50MHz | MICROCONTROLLER | 32 | YES | YES | YES | 32768 | 6144 | 16MHz | 56800EX | 2.7V~3.6V | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SCI, SPI | A/D 6x12b | |||||||||||||||||||||||||||||||
| S9S08RN8W2MTG | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08rna16w2mlcr-datasheets-5909.pdf | 16-TSSOP (0.173, 4.40mm Width) | 16 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | MATTE TIN | 260 | 40 | Internal | 12 | LVD, POR, PWM, WDT | 2K x 8 | 20MHz | MICROPROCESSOR | 2.7V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SPI, UART/USART | A/D 8x10b | 256 x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S08RN60W1VLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08rna32w1vlc-datasheets-0724.pdf | 64-LQFP | 16 Weeks | 260 | 40 | Internal | 55 | LVD, POR, PWM, WDT | 4K x 8 | 20MHz | MICROPROCESSOR | 2.7V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | A/D 16x12b | 256 x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S12GN32F0WLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~150°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2008 | 48-LQFP | 7mm | 7mm | 48 | 12 Weeks | 3A001.A.2.A | 8542.31.00.01 | YES | QUAD | GULL WING | 5V | 0.5mm | 5.5V | 3.13V | Microcontrollers | 3.3/5V | 17mA | Not Qualified | S-PQFP-G48 | AEC-Q100 | Internal | 40 | LVD, POR, PWM, WDT | 2K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | CPU12 | 32768 | 2048 | 16MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | A/D 8x10b | 1K x 8 | ||||||||||||||||||||||||||||||
| S9S12G48BMLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s12gn32bvlc-datasheets-3833.pdf | 32-LQFP | 12 Weeks | Internal | 26 | LVD, POR, PWM, WDT | 4K x 8 | 25MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 48KB 48K x 8 | CANbus, IrDA, LINbus, SCI, SPI | A/D 12x10b | 1.5K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC908QY8CDWER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908qb8cdwe-datasheets-8087.pdf | 16-SOIC (0.295, 7.50mm Width) | 260 | 40 | External | 13 | LVD, POR, PWM | 256 x 8 | 8MHz | MICROCONTROLLER | 2.7V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | A/D 4x10b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S08RNA16W2VTG | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2012 | 16-TSSOP (0.173, 4.40mm Width) | 16 Weeks | 260 | 40 | Internal | 12 | LVD, POR, PWM, WDT | 2K x 8 | 20MHz | MICROPROCESSOR | 2.7V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SPI, UART/USART | A/D 8x10b | 256 x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S12G48AVLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~105°C TA | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP | 2 Weeks | Internal | 40 | LVD, POR, PWM, WDT | 4K x 8 | 25MHz | CPU12V1 | 3.13V~5.5V | FLASH | 16-Bit | 48KB 48K x 8 | CANbus, IrDA, LINbus, SCI, SPI | A/D 12x10b | 1.5K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S12G48BVLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 32-LQFP | 12 Weeks | Internal | 26 | LVD, POR, PWM, WDT | 4K x 8 | 25MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 48KB 48K x 8 | CANbus, IrDA, LINbus, SCI, SPI | A/D 12x10b | 1.5K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S12GN48AMLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP | 12 Weeks | Internal | 40 | LVD, POR, PWM, WDT | 4K x 8 | 25MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 48KB 48K x 8 | IrDA, LINbus, SCI, SPI | A/D 12x10b | 1.5K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCHC908QT4VDWER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc908qy4cdte-datasheets-4172.pdf | 8-SOIC (0.209, 5.30mm Width) | 8 | 10 Weeks | 3A991.A.2 | OPERATES AT 3V NOMINAL SUPPLY AT 4 MHZ | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 5V | 1.27mm | MCHC908QT4 | 40 | R-PDSO-G8 | Internal | 5 | LVD, POR, PWM | 128 x 8 | 8MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 24MHz | 2.7V~5.5V | FLASH | 8-Bit | 4KB 4K x 8 | A/D 4x8b | ||||||||||||||||||||||||||||||||||||||
| DF70844AD80FPV | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SuperH® SH7080 | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | SMD/SMT | 80MHz | ROHS3 Compliant | 2007 | 112-LQFP | Lead Free | 20 Weeks | No SVHC | 112 | EBI/EMI, I2C, SCI, UART, USART | 2 Mb | No | DF70844 | 256kB | 8 | Internal | 76 | DMA, POR, PWM, WDT | 16K x 8 | 32b | 11 | 4 | 80 μs | SH-2 | 3V~5.5V | FLASH | 32-Bit | 256KB 256K x 8 | EBI/EMI, FIFO, I2C, SCI, SSU | A/D 8x10b | ||||||||||||||||||||||||||||||||||||||||||||
| MKE02Z64VQH2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis KE02 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | 64-QFP | 64 | 20 Weeks | 3A991.A.2 | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | 260 | 3V | 0.8mm | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | 14.8mA | Not Qualified | S-PQFP-G64 | Internal | 57 | LVD, PWM, WDT | 4K x 8 | 20MHz | MICROCONTROLLER, RISC | 32 | YES | NO | YES | NO | 8 | CORTEX-M0 | 65536 | 4096 | 20MHz | ARM® Cortex®-M0+ | 2.7V~5.5V | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | A/D 16x12b; D/A 2x6b | 256 x 8 | ||||||||||||||||||||||||||
| S9S12G48F0MLFR | NXP USA Inc. | $5.04 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2008 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s12g96f0clf-datasheets-4388.pdf | 48-LQFP | 7mm | 7mm | 48 | 12 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | 5V | 0.5mm | 5.5V | 3.13V | Microcontrollers | 3.3/5V | 20mA | Not Qualified | S-PQFP-G48 | AEC-Q100 | Internal | 40 | LVD, POR, PWM, WDT | 4K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | CPU12 | 49152 | 16MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 48KB 48K x 8 | CANbus, IrDA, LINbus, SCI, SPI | A/D 12x10b | 1.5K x 8 | ||||||||||||||||||||||||||||||
| MC9S08PT32AVQH | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08pt60avqh-datasheets-7416.pdf | 64-QFP | 14mm | 14mm | 64 | 20 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | Tin (Sn) | YES | QUAD | GULL WING | 260 | 5V | 0.8mm | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | 14.8mA | Not Qualified | S-PQFP-G64 | Internal | 57 | LVD, POR, PWM, WDT | 4K x 8 | 20MHz | MICROCONTROLLER | 8 | YES | NO | YES | 32768 | 4096 | 20MHz | 2.7V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | A/D 16x12b | 256 x 8 | ||||||||||||||||||||||||||||
| MB90F022CPF-GS-9040 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 14 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S912ZVL64F0CLC | NXP USA Inc. | $32.23 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S12 MagniV | Surface Mount | -40°C~85°C TA | Bulk | 3 (168 Hours) | ROHS3 Compliant | 2016 | 32-LQFP | 12 Weeks | Internal | 19 | LVD, POR, PWM, WDT | 1K x 8 | 32MHz | S12Z | 5.5V~18V | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART | A/D 6x10b | 512 x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LPC1114JHN33/333E | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC1100XL | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc1114fhn333335-datasheets-0622.pdf | 32-VQFN Exposed Pad | 7mm | 7mm | 33 | 16 Weeks | YES | QUAD | NO LEAD | 3.3V | 0.65mm | 32 | 3.6V | 1.8V | Microcontrollers | 3.3V | Not Qualified | S-PQCC-N32 | Internal | 28 | Brown-out Detect/Reset, POR, WDT | 8K x 8 | 50MHz | MICROCONTROLLER, RISC | 32 | YES | NO | NO | CORTEX-M0 | 57344 | 8192 | 25MHz | ARM® Cortex®-M0 | 1.8V~3.6V | FLASH | 32-Bit | 56KB 56K x 8 | I2C, SPI, UART/USART | A/D 8x10b | |||||||||||||||||||||||||||||||||
| LPC11A13JHI33/201E | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC11Axx | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2014 | 32-VFQFN Exposed Pad | 16 Weeks | NOT SPECIFIED | LPC11A13 | 32 | NOT SPECIFIED | Internal | 28 | Brown-out Detect/Reset, POR, WDT | 6K x 8 | 50MHz | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | 2.6V~3.6V | FLASH | 32-Bit | 24KB 24K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART | A/D 8x10b; D/A 1x10b | 2K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| MKL27Z64VDA4R | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis KL2 | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 0.5mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mkl27z64vda4-datasheets-5235.pdf | 36-XFBGA | 3.5mm | 3.5mm | 36 | 13 Weeks | 3A991.A.2 | DIFFERENTIAL ANALOG CHANNEL INPUTS: 3-CH 16-BIT | 8542.31.00.01 | YES | BOTTOM | BALL | 260 | 3V | 0.5mm | 3.6V | 1.71V | 40 | S-PBGA-B36 | Internal | 30 | DMA, I2S, PWM, WDT | 16K x 8 | 48MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | NO | 48MHz | ARM® Cortex®-M0+ | 1.71V~3.6V | FLASH | 32-Bit | 64KB 64K x 8 | I2C, FlexIO, SPI, UART/USART, USB | A/D 14x16b | ||||||||||||||||||||||||||||||||||
| S9S08RN60W1MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08rna32w1vlc-datasheets-0724.pdf | 48-LQFP | 16 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | MATTE TIN | 260 | 40 | Internal | 39 | LVD, POR, PWM, WDT | 4K x 8 | 20MHz | MICROPROCESSOR | 2.7V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | A/D 16x12b | 256 x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S12P32J0CFTR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2006 | 48-TFQFN Exposed Pad | 16 Weeks | 260 | 40 | Internal | 34 | LVD, POR, PWM, WDT | 2K x 8 | 32MHz | MICROCONTROLLER | 1.72V~5.5V | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, SCI, SPI | A/D 10x12b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S08RNA60W1MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08rna32w1vlc-datasheets-0724.pdf | 48-LQFP | 16 Weeks | 260 | 40 | Internal | 39 | LVD, POR, PWM, WDT | 4K x 8 | 20MHz | MICROPROCESSOR | 2.7V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | A/D 16x12b | 256 x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC908QT1AMDWE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~125°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908qy4acdwe-datasheets-0671.pdf | 8-SOIC (0.209, 5.30mm Width) | 8 | 3A991.A.2 | ALSO OPERATES AT 3V SUPPLY AT 4 MHZ | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 5V | 1.27mm | MC908QT1 | 40 | Not Qualified | R-PDSO-G8 | Internal | 5 | LVD, POR, PWM | 128 x 8 | 8MHz | MICROCONTROLLER | 8 | NO | NO | YES | NO | 32MHz | 2.7V~5.5V | FLASH | 8-Bit | 1.5KB 1.5K x 8 | |||||||||||||||||||||||||||||||||||||||
| MB90F020CPMT-GS-9136 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 120-LQFP | 13 Weeks | 120-LQFP (16x16) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S12G64ACLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP | 12 Weeks | Internal | 40 | LVD, POR, PWM, WDT | 4K x 8 | 25MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, IrDA, LINbus, SCI, SPI | A/D 12x10b | 2K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S08RN60W1MLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08rna32w1vlc-datasheets-0724.pdf | 48-LQFP | 16 Weeks | 260 | 40 | Internal | 39 | LVD, POR, PWM, WDT | 4K x 8 | 20MHz | MICROPROCESSOR | 2.7V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | A/D 16x12b | 256 x 8 |
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