Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | REACH SVHC | Number of Pins | Interface | Density | Lifecycle Status | Pbfree Code | Thickness | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Max Power Dissipation | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Memory Size | Number of Bits | Number of ADC Channels | Oscillator Type | Number of I/O | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Watchdog Timer | Number of Timers/Counters | Number of Programmable I/O | On Chip Program ROM Width | CPU Family | ROM (words) | Number of UART Channels | RAM (words) | Boundary Scan | Low Power Mode | Format | Integrated Cache | Number of Serial I/Os | Number of A/D Converters | Number of PWM Channels | RAM (bytes) | Number of I2C Channels | Clock Frequency | Address Bus Width | External Data Bus Width | Barrel Shifter | Internal Bus Architecture | UV Erasable | Core Processor | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
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MC9S12XET256MAL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12X | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 1996 | /files/nxpusainc-mc9s12xep100cal-datasheets-5105.pdf | 112-LQFP | 20mm | 20mm | 112 | 16 Weeks | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 1.8V | 0.65mm | MC9S12XET256 | 1.98V | 1.72V | 40 | Microcontrollers | 3.3/5V | Not Qualified | S-PQFP-G112 | External | 91 | LVD, POR, PWM, WDT | 16K x 8 | 50MHz | MICROCONTROLLER, RISC | 32 | YES | NO | YES | NO | CPU12 | 262144 | 40MHz | 1.72V~5.5V | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | A/D 12x12b | 4K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
P87C51MC2BA/02,529 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 87C | Surface Mount | 0°C~70°C TA | Tube | 3 (168 Hours) | CMOS | 4.57mm | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/nxpusainc-p87c51mc2ba02529-datasheets-6576.pdf | 44-LCC (J-Lead) | 16.5862mm | 16.5862mm | 44 | 12 Weeks | EAR99 | ALSO OPERATES AT 2.7V MINIMUM SUPPLY | 8542.31.00.01 | e3 | TIN | YES | QUAD | J BEND | 245 | 5V | 1.27mm | P87C51 | 44 | 5.5V | 4.5V | 30 | Not Qualified | S-PQCC-J44 | Internal | 34 | POR, PWM, WDT | 3K x 8 | 24MHz | MICROCONTROLLER | 8 | NO | NO | YES | NO | 24MHz | 23 | 8 | 8051 | 2.7V~5.5V | OTP | 8-Bit | 96KB 96K x 8 | EBI/EMI, SPI, UART/USART | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY9AF314NABGL-GE1 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | FM3 MB9A310A | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.45mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/cypresssemiconductorcorp-cy9af316nabglge1-datasheets-5300.pdf | 112-LFBGA | 10mm | 10mm | 112 | 19 Weeks | YES | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | 5.5V | 2.7V | NOT SPECIFIED | S-PBGA-B112 | Internal | 83 | DMA, LVD, POR, PWM, WDT | 32K x 8 | 40MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | NO | 8 | 262144 | 32768 | 48MHz | 25 | 16 | ARM® Cortex®-M3 | 2.7V~5.5V | FLASH | 32-Bit | 256KB 256K x 8 | CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB | A/D 16x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
ATXMEGA256A3B-MH | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | AVR® XMEGA® A3B | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 32MHz | 1mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/microchiptechnology-atxmega256a3bmh-datasheets-6598.pdf | 64-VFQFN Exposed Pad | 9mm | Lead Free | 64 | 7 Weeks | No SVHC | 64 | 2-Wire, I2C, SPI, UART, USART | yes | Tin | QUAD | NO LEAD | NOT SPECIFIED | 2.7V | 0.5mm | ATXMEGA256 | 3.6V | 1.6V | NOT SPECIFIED | Not Qualified | 256kB | Internal | 49 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 16K x 8 | 8b | MICROCONTROLLER, RISC | 16 | YES | YES | YES | Yes | 7 | 22 | AVR | 1.6V~3.6V | FLASH | 8/16-Bit | 256KB 128K x 16 | I2C, IrDA, SPI, UART/USART | A/D 16x12b; D/A 2x12b | 4K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
ATSAMS70N21B-CN | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SAM S70 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.1mm | ROHS3 Compliant | 2018 | https://pdf.utmel.com/r/datasheets/microchiptechnology-atsame70n20bant-datasheets-9837.pdf | 100-TFBGA | 9mm | 9mm | 100 | 7 Weeks | YES | BOTTOM | BALL | 1.2V | 0.8mm | ATSAMS70N | 1.32V | 1.08V | S-PBGA-B100 | TS 16949 | Internal | 75 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 384K x 8 | 300MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 8 | 20MHz | 24 | 16 | ARM® Cortex®-M7 | 1.08V~3.6V | FLASH | 32-Bit | 2MB 2M x 8 | I2C, IrDA, LINbus, MMC/SD/SDIO, SPI, UART/USART, USB | A/D 10x12b; D/A 2x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
ATSAM4SD32CA-CFU | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SAM4S | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 120MHz | 1mm | ROHS3 Compliant | 2015 | https://pdf.utmel.com/r/datasheets/microchiptechnology-atsam4s4aamu-datasheets-1344.pdf | 100-VFBGA | 7mm | Lead Free | 100 | 7 Weeks | No SVHC | 100 | EBI/EMI, I2C, I2S, IrDA, SPI, UART, USART, USB | 3A991.A.2 | Copper, Silver, Tin | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.2V | ATSAM4SD32 | 1.32V | 1.08V | Microcontrollers | 1.2V | 25mA | Not Qualified | 2MB | Internal | 79 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | ARM | 160K x 8 | 32b | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | Yes | 6 | CORTEX-M4 | 2097152 | 24 | ARM® Cortex®-M4 | 1.62V~3.6V | FLASH | 32-Bit | 2MB 2M x 8 | EBI/EMI, I2C, IrDA, Memory Card, SPI, SSC, UART/USART, USB | A/D 16x12b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||||||
MSP430F2274MDATEP | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MSP430F2xx | Surface Mount | -55°C~125°C TA | Tape & Reel (TR) | 2 (1 Year) | CMOS | 16MHz | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/texasinstruments-msp430f235trgcr-datasheets-9498.pdf | 38-TSSOP (0.240, 6.10mm Width) | 12.5mm | 1.2mm | 6.2mm | Lead Free | 38 | 6 Weeks | 38 | I2C, IrDA, LIN, SCI, SPI, UART, USART | ACTIVE (Last Updated: 5 days ago) | yes | 1.15mm | No | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | YES | DUAL | GULL WING | 260 | 0.65mm | 38 | 3.6V | 3.3V | Microcontrollers | 0.55mA | 32kB | 10 | Internal | 32 | Brown-out Detect/Reset, POR, PWM, WDT | 1K x 8 | 16b | MICROCONTROLLER, RISC | 16 | YES | NO | YES | NO | Yes | 2 | 32 | 1 | 1 | YES | YES | FIXED-POINT | NO | 1 | 12 | MSP430 | 1.8V~3.6V | FLASH | 16-Bit | 32KB 32K x 8 + 256B | I2C, IrDA, LINbus, SCI, SPI, UART/USART | A/D 12x10b | ||||||||||||||||||||||||||||||||||||||||||
PIC32MX775F512L-80I/PF | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MX | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | SMD/SMT | CMOS | 80MHz | 1.2mm | ROHS3 Compliant | /files/microchiptechnology-pic32mx664f128hipt-datasheets-3615.pdf | 100-TQFP | 14mm | 100 | 13 Weeks | No SVHC | 100 | CAN, Ethernet, I2C, SPI, UART, USART, USB | 4 Mb | yes | 3A991.A.2 | No | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 3.3V | PIC32MX775F512L | 100 | 2.3V | 40 | Microcontrollers | 98mA | 512kB | Internal | 85 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | PIC | 64K x 8 | 32b | MICROCONTROLLER, RISC | 32 | YES | YES | NO | Yes | 83 | PIC | 6 | 5 | MIPS32® M4K™ | 2.3V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG | A/D 16x10b | ||||||||||||||||||||||||||||||||||||||||||||||||
MK20DN512ZVLQ10 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K20 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mk20dn512zvlq10-datasheets-6452.pdf&product=nxpusainc-mk20dn512zvlq10-4841674 | 144-LQFP | 20mm | 20mm | 144 | 15 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | MK20DN512 | 3.6V | 1.71V | 40 | Not Qualified | S-PQFP-G144 | Internal | 100 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 100MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 50MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 42x16b; D/A 2x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
C8051F580-IM | Silicon Labs |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | C8051F58x | Surface Mount | Surface Mount | -40°C~125°C TA | Tube | 2 (1 Year) | CMOS | 50MHz | RoHS Compliant | 2000 | https://pdf.utmel.com/r/datasheets/siliconlabs-c8051f585iq-datasheets-0959.pdf | 48-VFQFN Exposed Pad | 7mm | 1mm | 7mm | 48 | 8 Weeks | 48 | 2-Wire, CAN, EBI/EMI, I2C, LIN, SMBus, SPI, UART, USART | Tin | No | e3 | QUAD | 2.1V | 0.5mm | C8051F58 | 48 | 2V | 12 | Microcontrollers | 33mA | 128kB | 32 | Internal | 40 | POR, PWM, Temp Sensor, WDT | 8.25K x 8 | 8b | MICROCONTROLLER | 8 | YES | NO | YES | Yes | 6 | 2 | 1 | 8051 | 1.8V~5.25V | FLASH | 8-Bit | 128KB 128K x 8 | EBI/EMI, SMBus (2-Wire/I2C), CANbus, LINbus, SPI, UART/USART | A/D 32x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||
MK22FN512VMP12 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K20 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 1996 | 64-LFBGA | 5mm | 5mm | 64 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 3.3V | 0.5mm | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.3V | 36.93mA | Not Qualified | S-PBGA-B64 | Internal | 40 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 120MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4F | 524288 | 131072 | 50MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | A/D 22x16b; D/A 2x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
ATSAMV70N20B-AAB | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100, SAM V70 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | /files/microchiptechnology-atsame70n20bant-datasheets-9837.pdf | 100-LQFP | 14mm | 14mm | 100 | 1 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | 1.4V | 0.5mm | ATSAMV70N | 1.32V | 1.2V | S-PQFP-G100 | AEC-Q100; TS 16949 | Internal | 75 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 384K x 8 | 300MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 8 | 150MHz | 24 | 16 | ARM® Cortex®-M7 | 3V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB | A/D 10x12b; D/A 2x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
ATSAME70Q21B-CFN | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SAM E70 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 0.6mm | ROHS3 Compliant | 2018 | https://pdf.utmel.com/r/datasheets/microchiptechnology-atsame70n20bant-datasheets-9837.pdf | 144-UFBGA | 6mm | 6mm | 144 | 7 Weeks | YES | BOTTOM | BALL | 1.2V | 0.4mm | ATSAME70Q | 1.32V | 1.08V | S-PBGA-B144 | TS 16949 | Internal | 114 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 384K x 8 | 300MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | 8 | 20MHz | 24 | 16 | ARM® Cortex®-M7 | 1.62V~3.6V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SPI, UART/USART, USB | A/D 24x12b; D/A 2x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PIC32MZ1064DAB176-I/2J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DA | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | CMOS | 1.6mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dag176i2j-datasheets-7795.pdf | 176-LQFP Exposed Pad | 20mm | 20mm | 176 | 8 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | NOT SPECIFIED | 1.8V | 0.4mm | PIC32MZ1064DA | 1.9V | 1.7V | NOT SPECIFIED | S-PQFP-G176 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PIC32MZ1025DAG169-I/6J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DA | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.56mm | ROHS3 Compliant | 2017 | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dag176i2j-datasheets-7795.pdf | 169-LFBGA | 11mm | 11mm | 169 | 3 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 1.8V | 0.8mm | PIC32MZ1025DA | 1.9V | 1.7V | NOT SPECIFIED | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PIC32MZ2064DAA169-I/HF | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DA | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.4mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dag176i2j-datasheets-7795.pdf | 169-LFBGA | 11mm | 11mm | 169 | 7 Weeks | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 1.8V | 0.8mm | PIC32MZ2064DA | 1.9V | 1.7V | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~3.6V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PIC32MZ2025DAB176-I/2J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DA | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dag176i2j-datasheets-7795.pdf | 176-LQFP Exposed Pad | 8 Weeks | PIC32MZ2025DA | 176-LQFP (20x20) | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MIPS32® microAptiv™ | 1.7V~3.6V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PIC32MZ2048EFH144-E/JWX | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100, PIC® 32MZ | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | 1.02mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz0512efe064ipt-datasheets-9385.pdf | 144-TFBGA | 7mm | 7mm | 144 | 12 Weeks | unknown | YES | BOTTOM | BUTT | 3.3V | 0.5mm | PIC32MZ2048EF | 3.6V | 2.1V | S-PBGA-B144 | AEC-Q100; TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 512K x 8 | 180MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | MIPS32® M-Class | 2.1V~3.6V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG | A/D 48x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
R5F21238DFP#U0 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | R8C/2x/23 | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | SMD/SMT | CMOS | 20MHz | 1.7mm | ROHS3 Compliant | 2007 | /files/renesaselectronicsamerica-r5f21237dfpu0-datasheets-9358.pdf | 48-LQFP | 7mm | Lead Free | 48 | 20 Weeks | No SVHC | 48 | CAN, I2C, LIN, UART, USART | 512 kb | yes | No | 300mW | QUAD | GULL WING | 3.3V | R5F21238 | 48 | 3V | Microcontrollers | 64kB | 12 | Internal | 41 | POR, Voltage Detect, WDT | 3K x 8 | 16b | MICROCONTROLLER | 16 | YES | NO | YES | Yes | 5 | R8C | 2 | R8C | 2.7V~5.5V | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, I2C, LINbus, SIO, SSU, UART/USART | A/D 12x10b | 2K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||
MK82FN256VDC15 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K8x | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2014 | 121-XFBGA | 13 Weeks | 5A992 | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | Internal | 87 | DMA, I2S, LVD, POR, PWM | 256K x 8 | 150MHz | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 256KB 256K x 8 | EBI/EMI, I2C, SPI, UART/USART, USB OTG | A/D 18x16b; D/A 2x6b, 1x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY8C5867LTI-LP025 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PSOC® 5 CY8C58LP | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 67MHz | ROHS3 Compliant | 2012 | /files/cypresssemiconductorcorp-cy8c5868ltilp038-datasheets-6895.pdf | 68-VFQFN Exposed Pad | 8mm | 1mm | 1.8V | Lead Free | 68 | 15 Weeks | 810.002575mg | No SVHC | 68 | CAN, I2C, I2S, LIN, SPI, UART, USART, USB | 3A991.A.3 | Gold | No | e4 | YES | QUAD | 260 | 1.8V | CY8C5867 | 68 | 5.5V | 30 | Other uPs/uCs/Peripheral ICs | 128kB | 2 | Internal | 38 | CapSense, DMA, LCD, POR, PWM, WDT | ARM | 32K x 8 | 32b | Yes | 4 | 46 | YES | N | ARM® Cortex®-M3 | 1.71V~5.5V | FLASH | 32-Bit | 128KB 128K x 8 | I2C, LINbus, SPI, UART/USART | A/D 1x20b, 1x12b; D/A 4x8b | 2K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
CY8C3866AXI-208 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PSOC® 3 CY8C38xx | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 67MHz | 1.6mm | ROHS3 Compliant | 2011 | /files/cypresssemiconductorcorp-cy8c3866pvi070-datasheets-3552.pdf | 100-LQFP | Lead Free | 100 | 16 Weeks | 100 | CAN, EBI/EMI, I2C, LIN, SPI, UART, USART, USB | 3A991.A.3 | Gold | No | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | CY8C3866 | 100 | 5.5V | 1.71V | 40 | Other uPs/uCs/Peripheral ICs | 1.8/5V | 64kB | Internal | 72 | CapSense, DMA, LCD, POR, PWM, WDT | 8K x 8 | 8b | Yes | 4 | 62 | 8000 | YES | N | 8051 | 1.71V~5.5V | FLASH | 8-Bit | 64KB 64K x 8 | CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB | A/D 16x20b; D/A 2x8b | 2K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
MK20FX512VLQ12 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K20 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mk20fx512vlq12-datasheets-6227.pdf | 144-LQFP | 20mm | 20mm | 144 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | MK20FX512 | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.32.5/3.3V | 177mA | Not Qualified | S-PQFP-G144 | Internal | 100 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 120MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4F | 524288 | 50MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 58x16b; D/A 2x12b | 16K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||
MC9S08GT60ACFBE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 2.45mm | ROHS3 Compliant | 2008 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08gb60acfue-datasheets-0383.pdf | 44-QFP | 10mm | 10mm | 44 | EAR99 | OPERATES AT 1.8V MINIMUM SUPPLY | 8542.31.00.01 | e3 | Tin (Sn) | YES | QUAD | GULL WING | 260 | 3V | 0.8mm | MC9S08GT60 | 3.6V | 2.08V | 40 | Not Qualified | S-PQFP-G44 | Internal | 36 | LVD, POR, PWM, WDT | 4K x 8 | 40MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 40MHz | 1.8V~3.6V | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | A/D 8x10b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PIC32MZ2048EFH144-250I/JWX | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.02mm | ROHS3 Compliant | 2015 | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz0512efe064ipt-datasheets-9385.pdf | 144-TFBGA | 7mm | 7mm | 144 | 12 Weeks | YES | BOTTOM | BUTT | 3.3V | 0.5mm | PIC32MZ2048EF | 3.6V | 2.1V | S-PBGA-B144 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 512K x 8 | 252MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | MIPS32® M-Class | 2.1V~3.6V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG | A/D 48x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SPC5604BF2MLL6 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC56xx Qorivva | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2006 | 100-LQFP | 14mm | 14mm | 100 | 12 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | 3.3V | 0.5mm | SPC5604 | 3.6V | 3V | Microcontrollers | 3.3/5V | Not Qualified | S-PQFP-G100 | AEC-Q100 | Internal | 79 | DMA, POR, PWM, WDT | 32K x 8 | 64MHz | MICROCONTROLLER | 32 | YES | YES | YES | 524288 | 16MHz | 64 | e200z0h | 3V~5.5V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 28x10b | 64K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PIC32MZ1025DAH169-I/6J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DA | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | CMOS | 1.56mm | ROHS3 Compliant | 2017 | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dag176i2j-datasheets-7795.pdf | 169-LFBGA | 11mm | 11mm | 169 | 3 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 1.8V | 0.8mm | PIC32MZ1025DA | 1.9V | 1.7V | NOT SPECIFIED | S-PBGA-B169 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 256K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~3.6V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MK20FX512VMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Kinetis K20 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.7mm | ROHS3 Compliant | 2012 | /files/nxpusainc-mk20fx512vlq12-datasheets-6227.pdf | 144-LBGA | 13mm | 13mm | 144 | 13 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 1mm | MK20FX512 | 3.6V | 1.71V | 40 | Microcontrollers | 1.8/3.32.5/3.3V | 177mA | Not Qualified | S-PBGA-B144 | Internal | 100 | DMA, I2S, LVD, POR, PWM, WDT | 128K x 8 | 120MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | YES | CORTEX-M4F | 524288 | 50MHz | ARM® Cortex®-M4 | 1.71V~3.6V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | A/D 58x16b; D/A 2x12b | 16K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||
DSP56F801FA80E | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 56F8xx | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 1998 | https://pdf.utmel.com/r/datasheets/nxpusainc-dsp56f801fa80e-datasheets-6109.pdf | 48-LQFP | 7mm | 7mm | 48 | 12 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | DSP56F801 | 3.6V | 3V | 40 | Digital Signal Processors | 3.3V | 130mA | Not Qualified | S-PQFP-G48 | Internal | 11 | POR, PWM, WDT | 1K x 16 | 80MHz | DIGITAL SIGNAL PROCESSOR, OTHER | 16 | 1024 | YES | YES | FIXED POINT | 80MHz | YES | MULTIPLE | 56800 | 3V~3.6V | FLASH | 16-Bit | 16KB 8K x 16 | SCI, SPI | A/D 8x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||
PIC32MZ2064DAA288T-I/4J | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PIC® 32MZ DA | Surface Mount | -40°C~85°C TA | Cut Tape (CT) | 3 (168 Hours) | CMOS | 1.4mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-pic32mz2064dag176i2j-datasheets-7795.pdf | 288-LFBGA | 15mm | 15mm | 288 | 8 Weeks | unknown | YES | BOTTOM | BALL | 1.8V | 0.8mm | PIC32MZ2064DA | 1.9V | 1.7V | S-PBGA-B288 | TS 16949 | Internal | 120 | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 640K x 8 | 200MHz | MICROCONTROLLER | 32 | YES | YES | YES | NO | 8 | 64MHz | 24 | 16 | MIPS32® microAptiv™ | 1.7V~3.6V | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | A/D 45x12b |
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