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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | RoHS Status | Published | Datasheet | Package / Case | ECCN Code | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Peak Reflow Temperature (Cel) | Base Part Number | Time@Peak Reflow Temperature-Max (s) | Supplier Device Package | Oscillator Type | Number of I/O | Peripherals | RAM Size | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MC9S08GT60CFBE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08gt32cfb-datasheets-0048.pdf | 44-QFP | MC9S08GT60 | Internal | 36 | LVD, POR, PWM, WDT | 4K x 8 | 40MHz | 1.8V~3.6V | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | A/D 8x10b | ||||||||||||||||
| MC68336ACAB25 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68376bgmft20-datasheets-9714.pdf | 160-BQFP | MC68336 | External | 18 | POR, PWM, WDT | 7.5K x 8 | 25MHz | CPU32 | 4.75V~5.25V | ROMless | 32-Bit | CANbus, EBI/EMI, SCI, SPI | A/D 16x10b | |||||||||||||||
| MC68HC711D3CFNE2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC11 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc711d3cfne2r-datasheets-3880.pdf | 44-LCC (J-Lead) | MC68HC711 | Internal | 26 | POR, WDT | 192 x 8 | 2MHz | 4.5V~5.5V | OTP | 8-Bit | 4KB 4K x 8 | SCI, SPI | ||||||||||||||||
| MCHC908JK8MPE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Through Hole | -40°C~125°C TA | Tube | 1 (Unlimited) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908jl8cfaer2-datasheets-4848.pdf | 20-DIP (0.300, 7.62mm) | MCHC908JK8 | Internal | 15 | LED, LVD, POR, PWM | 256 x 8 | 8MHz | 4.5V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | SCI | A/D 13x8b | ||||||||||||||||
| MC68HC11A0CFNE3 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC11 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc11a1mfner-datasheets-4086.pdf | 52-LCC (J-Lead) | MC68HC11 | 52-PLCC (19.1x19.1) | External | 38 | POR, WDT | 256 x 8 | 3MHz | HC11 | 4.5V~5.5V | ROMless | 8-Bit | SCI, SPI | A/D 8x8b | ||||||||||||||
| MC68376BAVAB20 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68376bgmft20-datasheets-9714.pdf | 160-BQFP | MC68376 | External | 18 | POR, PWM, WDT | 7.5K x 8 | 20MHz | CPU32 | 4.75V~5.25V | ROMless | 32-Bit | CANbus, EBI/EMI, SCI, SPI | A/D 16x10b | |||||||||||||||
| MC68HC705C9AVFNE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC05 | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc705c9acp-datasheets-9583.pdf | 44-LCC (J-Lead) | MC68HC705 | Internal | 24 | POR, WDT | 352 x 8 | 2.1MHz | 3V~5.5V | OTP | 8-Bit | 16KB 16K x 8 | SCI, SPI | |||||||||||||||||
| MC68336GMAB20 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68376bgmft20-datasheets-9714.pdf | 160-BQFP | MC68336 | External | 18 | POR, PWM, WDT | 7.5K x 8 | 20MHz | CPU32 | 4.75V~5.25V | ROMless | 32-Bit | CANbus, EBI/EMI, SCI, SPI | A/D 16x10b | |||||||||||||||
| MC68HC711E9CFNE3 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC11 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 1999 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc11e0cfne2-datasheets-1468.pdf | 52-LCC (J-Lead) | MC68HC711 | 52-PLCC (19.1x19.1) | Internal | 38 | POR, WDT | 512 x 8 | 3MHz | HC11 | 4.5V~5.5V | OTP | 8-Bit | 12KB 12K x 8 | SCI, SPI | A/D 8x8b | 512 x 8 | ||||||||||||
| MCS12GC64MFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12gc32cpbe-datasheets-5545.pdf | 80-QFP | MCS12GC64 | Internal | 60 | POR, PWM, WDT | 4K x 8 | 25MHz | 2.35V~5.5V | FLASH | 16-Bit | 64KB 64K x 8 | EBI/EMI, SCI, SPI | A/D 8x10b | ||||||||||||||||
| MC68HC11D0CFNE3 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC11 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc711d3cfne2r-datasheets-3880.pdf | 44-LCC (J-Lead) | MC68HC11 | 44-PLCC (16.59x16.59) | Internal | 26 | POR, WDT | 192 x 8 | 3MHz | HC11 | 4.5V~5.5V | ROMless | 8-Bit | SCI, SPI | ||||||||||||||||
| MC68336GVAB25 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68376bgmft20-datasheets-9714.pdf | 160-BQFP | MC68336 | External | 18 | POR, PWM, WDT | 7.5K x 8 | 25MHz | CPU32 | 4.75V~5.25V | ROMless | 32-Bit | CANbus, EBI/EMI, SCI, SPI | A/D 16x10b | |||||||||||||||
| MC68334GEH16 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68334gcfc16-datasheets-9684.pdf | 132-BQFP Bumpered | MC68334 | 132-PQFP (24.13x24.13) | External | 47 | 1K x 8 | 16MHz | CPU32 | 3V~5.5V | ROMless | 32-Bit | EBI/EMI, UART/USART | A/D 8x8/10b | |||||||||||||||
| MCS12KG256CFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12kt256cpve-datasheets-1252.pdf | 80-QFP | MCS12KG256 | Internal | 59 | LVD, POR, PWM, WDT | 12K x 8 | 25MHz | 2.35V~5.5V | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, SCI, SPI | A/D 8x10b | 4K x 8 | ||||||||||||||
| MC68336GCAB25 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68376bgmft20-datasheets-9714.pdf | 160-BQFP | MC68336 | External | 18 | POR, PWM, WDT | 7.5K x 8 | 25MHz | CPU32 | 4.75V~5.25V | ROMless | 32-Bit | CANbus, EBI/EMI, SCI, SPI | A/D 16x10b | |||||||||||||||
| MC9S08GB60CFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08gt32cfb-datasheets-0048.pdf | 64-LQFP | MC9S08GB60 | Internal | 56 | LVD, POR, PWM, WDT | 4K x 8 | 40MHz | 1.8V~3.6V | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | A/D 8x10b | |||||||||||||||
| MC9S12B128VPVE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 1999 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12b64cfue-datasheets-8362.pdf | 112-LQFP | EAR99 | 8542.31.00.01 | e3 | Matte Tin (Sn) | 260 | MC9S12B128 | 40 | Internal | 91 | POR, PWM, WDT | 4K x 8 | 25MHz | MICROCONTROLLER | 2.35V~5.5V | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | A/D 16x10b | 1K x 8 | ||||||
| MC9S08RD16FJE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 32-LQFP | unknown | 8542.31.00.01 | MC9S08RD16 | Internal | 25 | LVD, POR, PWM, WDT | 1K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 16KB 16K x 8 | SCI | ||||||||||||
| MCHLC908QT4CPE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mcl908qt1cdwer-datasheets-3884.pdf | 8-DIP (0.300, 7.62mm) | MCHLC908QT4 | Internal | 5 | LVD, POR, PWM | 128 x 8 | 2MHz | 2.4V~3.6V | FLASH | 8-Bit | 4KB 4K x 8 | A/D 4x8b | |||||||||||||||||
| MC908KK3ECDWE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 20-SOIC (0.295, 7.50mm Width) | MC908KK3 | Internal | 23 | 128 x 8 | 8MHz | FLASH | 8-Bit | 4KB 4K x 8 | |||||||||||||||||||||
| MPC564CVR40 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC5xx | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2005 | /files/nxpusainc-mpc562czp40-datasheets-9791.pdf | 388-BBGA | MPC564 | External | 56 | POR, PWM, WDT | 32K x 8 | 40MHz | PowerPC | 2.5V~2.7V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, SCI, SPI, UART/USART | A/D 32x10b | ||||||||||||||
| MCHLC908QT1CPE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mcl908qt1cdwer-datasheets-3884.pdf | 8-DIP (0.300, 7.62mm) | MCHLC908QT1 | Internal | 5 | LVD, POR, PWM | 128 x 8 | 2MHz | 2.4V~3.6V | FLASH | 8-Bit | 1.5KB 1.5K x 8 | ||||||||||||||||||
| MCS12GC64VFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12gc32cpbe-datasheets-5545.pdf | 80-QFP | MCS12GC64 | Internal | 60 | POR, PWM, WDT | 4K x 8 | 25MHz | 2.35V~5.5V | FLASH | 16-Bit | 64KB 64K x 8 | EBI/EMI, SCI, SPI | A/D 8x10b | ||||||||||||||||
| MC9S08GT60CFDE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2004 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08gt32cfb-datasheets-0048.pdf | 48-VFQFN Exposed Pad | MC9S08GT60 | Internal | 39 | LVD, POR, PWM, WDT | 4K x 8 | 40MHz | 1.8V~3.6V | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | A/D 8x10b | |||||||||||||||
| MCHC908QT2VDWE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc908qy4cdte-datasheets-4172.pdf | 8-SOIC (0.209, 5.30mm Width) | MCHC908QT2 | Internal | 5 | LVD, POR, PWM | 128 x 8 | 8MHz | 2.7V~5.5V | FLASH | 8-Bit | 1.5KB 1.5K x 8 | A/D 4x8b | ||||||||||||||||
| MC9S12B128MFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12b64cfue-datasheets-8362.pdf | 80-QFP | EAR99 | 8542.31.00.01 | e3 | Matte Tin (Sn) | 260 | MC9S12B128 | 40 | Internal | 59 | POR, PWM, WDT | 4K x 8 | 25MHz | MICROCONTROLLER | 2.35V~5.5V | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | A/D 8x10b | 1K x 8 | ||||||
| MC68336GVAB20 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68376bgmft20-datasheets-9714.pdf | 160-BQFP | MC68336 | External | 18 | POR, PWM, WDT | 7.5K x 8 | 20MHz | CPU32 | 4.75V~5.25V | ROMless | 32-Bit | CANbus, EBI/EMI, SCI, SPI | A/D 16x10b | |||||||||||||||
| MC9S08RC32FJE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 32-LQFP | unknown | 8542.31.00.01 | MC9S08RC32 | Internal | 25 | LVD, POR, PWM, WDT | 2K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 32KB 32K x 8 | SCI | ||||||||||||
| MC68331VEH16 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1997 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68331cag16-datasheets-1717.pdf | 132-BQFP Bumpered | MC68331 | 132-PQFP (24.13x24.13) | Internal | 18 | POR, PWM, WDT | 16MHz | CPU32 | 4.5V~5.5V | ROMless | 32-Bit | EBI/EMI, SCI, SPI, UART/USART | ||||||||||||||||
| MCHC908RF2MFAE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2004 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc908rf2cfa-datasheets-0050.pdf | 32-LQFP | MCHC908RF2 | 32-LQFP (7x7) | Internal | 12 | LVD, POR, PWM, RF Mod | 128 x 8 | 4MHz | HC08 | 1.8V~3.6V | FLASH | 8-Bit | 2KB 2K x 8 |
