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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | ECCN Code | Additional Feature | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Oscillator Type | Number of I/O | Peripherals | RAM Size | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | ROM Programmability | ROM (words) | Clock Frequency | Address Bus Width | External Data Bus Width | Core Processor | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MC9S08DV48MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08dv16aclc-datasheets-3459.pdf | 32-LQFP | unknown | 8542.31.00.01 | MC9S08DV48 | External | 25 | LVD, POR, PWM, WDT | 2K x 8 | 40MHz | MICROCONTROLLER | 2.7V~5.5V | FLASH | 8-Bit | 48KB 48K x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 10x12b | ||||||||||||||||||||||||||||||||||||||||
| MC9S08DN60CLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2008 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08dn48f2mlf-datasheets-0465.pdf | 48-LQFP | unknown | 8542.31.00.01 | MC9S08DN60 | External | 39 | LVD, POR, PWM, WDT | 2K x 8 | 40MHz | MICROCONTROLLER | 2.7V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SCI, SPI | A/D 16x12b | 2K x 8 | ||||||||||||||||||||||||||||||||||||||
| MC9S08DV32MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08dv16aclc-datasheets-3459.pdf | 48-LQFP | unknown | 8542.31.00.01 | MC9S08DV32 | External | 39 | LVD, POR, PWM, WDT | 2K x 8 | 40MHz | MICROCONTROLLER | 2.7V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 16x12b | ||||||||||||||||||||||||||||||||||||||||
| MC68HC705C9ACFNE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC05 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 1998 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc705c9acp-datasheets-9583.pdf | 44-LCC (J-Lead) | MC68HC705 | Internal | 24 | POR, WDT | 352 x 8 | 2.1MHz | 3V~5.5V | OTP | 8-Bit | 16KB 16K x 8 | SCI, SPI | ||||||||||||||||||||||||||||||||||||||||||||
| MC9S08QG84CFFER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08qg8cdter-datasheets-2818.pdf | 16-VQFN Exposed Pad | MC9S08QG84 | Internal | 12 | LVD, POR, PWM, WDT | 512 x 8 | 20MHz | 1.8V~3.6V | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||||||||||||
| MC9S08DN32CLH | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08dn48f2mlf-datasheets-0465.pdf | 64-LQFP | MC9S08DN32 | External | 53 | LVD, POR, PWM, WDT | 1.5K x 8 | 40MHz | MICROCONTROLLER | 2.7V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | A/D 16x12b | 1K x 8 | ||||||||||||||||||||||||||||||||||||||||
| MC9S08QG44CFFE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08qg8cdter-datasheets-2818.pdf | 16-VQFN Exposed Pad | MC9S08QG44 | Internal | 12 | LVD, POR, PWM, WDT | 256 x 8 | 20MHz | 1.8V~3.6V | FLASH | 8-Bit | 4KB 4K x 8 | I2C, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||||||||||||
| MC9S08DV60CLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08dv16aclc-datasheets-3459.pdf | 32-LQFP | unknown | 8542.31.00.01 | MC9S08DV60 | External | 25 | LVD, POR, PWM, WDT | 3K x 8 | 40MHz | MICROCONTROLLER | 2.7V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 10x12b | ||||||||||||||||||||||||||||||||||||||||
| LH79520N0Q000B1;55 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BlueStreak ; LH7 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | 1.6mm | ROHS3 Compliant | 1998 | https://pdf.utmel.com/r/datasheets/nxpusainc-lh79520n0q000b155-datasheets-2212.pdf | 176-LQFP | 20mm | 20mm | 176 | e2 | Tin/Silver (Sn/Ag) | YES | QUAD | GULL WING | 250 | 1.8V | 0.4mm | LH79520 | 176 | 1.98V | 1.62V | 40 | Other Microprocessor ICs | 1.83.3V | Not Qualified | S-PQFP-G176 | External | 64 | DMA, LCD, POR, PWM, WDT | 32K x 8 | 77.4MHz | MICROCONTROLLER, RISC | 32 | NO | YES | YES | NO | FLASH | 0.032MHz | ARM7® | 1.62V~3.6V | ROMless | 32-Bit | EBI/EMI, IrDA, Microwire, SPI, SSI, SSP, UART/USART | ||||||||||||||||
| LPC2917FBD144,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC2900 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1997 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc2919fbd144551-datasheets-2055.pdf | 144-LQFP | LPC291* | Internal | 108 | POR, PWM, WDT | 80K x 8 | 80MHz | ARM9® | 1.71V~3.6V | FLASH | 16/32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, LINbus, SPI, UART/USART | A/D 16x10b | ||||||||||||||||||||||||||||||||||||||||||
| MC9S08DZ60CLH | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2008 | 64-LQFP | MC9S08DZ60 | External | 53 | LVD, POR, PWM, WDT | 4K x 8 | 40MHz | MICROCONTROLLER | 2.7V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 24x12b | 2K x 8 | ||||||||||||||||||||||||||||||||||||||||||
| MCR908JK3ECPE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Through Hole | -40°C~85°C TA | Tube | Not Applicable | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908jl3ecdwe-datasheets-2915.pdf | 20-DIP (0.300, 7.62mm) | MCR908JK3 | 20-DIP | External | 15 | LED, LVD, POR, PWM | 128 x 8 | 8MHz | HC08 | 2.7V~3.3V | FLASH | 8-Bit | 4KB 4K x 8 | A/D 12x8b | ||||||||||||||||||||||||||||||||||||||||||
| MCF52213CAE50 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF5221x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf52211caf80-datasheets-5473.pdf | 64-LQFP | 10mm | 10mm | 64 | 3A991.A.2 | 8542.31.00.01 | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | MCF52213 | 3.6V | 3V | 40 | S-PQFP-G64 | Internal | 56 | DMA, LVD, POR, PWM, WDT | 8K x 8 | 50MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | NO | 50MHz | Coldfire V2 | 3V~3.6V | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART, USB OTG | A/D 8x12b | ||||||||||||||||||
| P89LPC920FN,112 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC900 | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/nxpusainc-p89lpc922fdh529-datasheets-0587.pdf | 20-DIP (0.300, 7.62mm) | P89LPC92* | 20-DIP | Internal | 18 | Brown-out Detect/Reset, LED, POR, PWM, WDT | 256 x 8 | 18MHz | 8051 | 2.4V~3.6V | FLASH | 8-Bit | 2KB 2K x 8 | I2C, UART/USART | ||||||||||||||||||||||||||||||||||||||||||
| MC9S08DV48CLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08dv16aclc-datasheets-3459.pdf | 32-LQFP | 8542.31.00.01 | MC9S08DV48 | External | 25 | LVD, POR, PWM, WDT | 2K x 8 | 40MHz | MICROCONTROLLER | 2.7V~5.5V | FLASH | 8-Bit | 48KB 48K x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 10x12b | |||||||||||||||||||||||||||||||||||||||||
| MC9S08DZ60MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2006 | 48-LQFP | unknown | MC9S08DZ60 | External | 39 | LVD, POR, PWM, WDT | 4K x 8 | 40MHz | MICROCONTROLLER | 2.7V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 16x12b | 2K x 8 | |||||||||||||||||||||||||||||||||||||||||
| MC9S08QG44CPAE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08qg8cdter-datasheets-2818.pdf | 8-DIP (0.300, 7.62mm) | MC9S08QG44 | Internal | 4 | LVD, POR, PWM, WDT | 256 x 8 | 20MHz | 1.8V~3.6V | FLASH | 8-Bit | 4KB 4K x 8 | I2C, SCI, SPI | A/D 4x10b | |||||||||||||||||||||||||||||||||||||||||||
| MC9S08DZ60CLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2008 | 48-LQFP | MC9S08DZ60 | External | 39 | LVD, POR, PWM, WDT | 4K x 8 | 40MHz | MICROCONTROLLER | 2.7V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 16x12b | 2K x 8 | ||||||||||||||||||||||||||||||||||||||||||
| MC908QY4AMDTER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908qy4acdwe-datasheets-0671.pdf | 16-TSSOP (0.173, 4.40mm Width) | MC908QY4 | Internal | 13 | LVD, POR, PWM | 128 x 8 | 8MHz | 2.7V~5.5V | FLASH | 8-Bit | 4KB 4K x 8 | A/D 6x10b | ||||||||||||||||||||||||||||||||||||||||||||
| MC9S08QG84CFFE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08qg8cdter-datasheets-2818.pdf | 16-VQFN Exposed Pad | MC9S08QG84 | Internal | 12 | LVD, POR, PWM, WDT | 512 x 8 | 20MHz | 1.8V~3.6V | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||||||||||||
| MC9S08DZ48CLH | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2008 | 64-LQFP | unknown | MC9S08DZ48 | External | 53 | LVD, POR, PWM, WDT | 3K x 8 | 40MHz | MICROCONTROLLER | 2.7V~5.5V | FLASH | 8-Bit | 48KB 48K x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 24x12b | 1.5K x 8 | |||||||||||||||||||||||||||||||||||||||||
| MC9S08RD32DWER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | 0°C~70°C TA | Tube | 1 (Unlimited) | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 28-SOIC (0.295, 7.50mm Width) | MC9S08RD32 | 28-SOIC | Internal | 23 | LVD, POR, PWM, WDT | 2K x 8 | 8MHz | S08 | 1.8V~3.6V | FLASH | 8-Bit | 32KB 32K x 8 | SCI | ||||||||||||||||||||||||||||||||||||||||||
| MC9S08DZ48CLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2008 | 48-LQFP | unknown | MC9S08DZ48 | External | 39 | LVD, POR, PWM, WDT | 3K x 8 | 40MHz | MICROCONTROLLER | 2.7V~5.5V | FLASH | 8-Bit | 48KB 48K x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 16x12b | 1.5K x 8 | |||||||||||||||||||||||||||||||||||||||||
| MC9S08QG44CDNE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tube | 1 (Unlimited) | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08qg8cdter-datasheets-2818.pdf | 8-SOIC (0.154, 3.90mm Width) | MC9S08QG44 | Internal | 4 | LVD, POR, PWM, WDT | 256 x 8 | 20MHz | 1.8V~3.6V | FLASH | 8-Bit | 4KB 4K x 8 | I2C, SCI, SPI | A/D 4x10b | |||||||||||||||||||||||||||||||||||||||||||
| MC9S12XEP768MAL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12X | Surface Mount | -40°C~125°C TA | Tray | 1 (Unlimited) | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12xep100cal-datasheets-5104.pdf | 112-LQFP | MC9S12XE768 | External | 91 | LVD, POR, PWM, WDT | 48K x 8 | 50MHz | 1.72V~5.5V | FLASH | 16-Bit | 768KB 768K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | A/D 16x12b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||||||
| MC9S08QG44CPBE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08qg8cdter-datasheets-2818.pdf | 16-DIP (0.300, 7.62mm) | MC9S08QG44 | Internal | 12 | LVD, POR, PWM, WDT | 256 x 8 | 20MHz | 1.8V~3.6V | FLASH | 8-Bit | 4KB 4K x 8 | I2C, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||||||||||||
| MC9S08QG84CFQE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08qg8cdter-datasheets-2818.pdf | 8-VDFN Exposed Pad | MC9S08QG84 | Internal | 4 | LVD, POR, PWM, WDT | 512 x 8 | 20MHz | 1.8V~3.6V | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | A/D 4x10b | |||||||||||||||||||||||||||||||||||||||||||
| MC9S08SH4MPJ | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Through Hole | -40°C~125°C TA | Tube | Not Applicable | CMOS | 5.08mm | ROHS3 Compliant | 2006 | 20-DIP (0.300, 7.62mm) | 24.69mm | 7.62mm | 20 | 10 Weeks | EAR99 | 8542.31.00.01 | e3 | Matte Tin (Sn) | NO | DUAL | NOT SPECIFIED | 3V | 2.54mm | MC9S08SH4 | 5.5V | 2.7V | NOT SPECIFIED | Microcontrollers | 3/5V | Not Qualified | R-PDIP-T20 | Internal | 17 | LVD, POR, PWM, WDT | 256 x 8 | 40MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 4096 | 16MHz | 2.7V~5.5V | FLASH | 8-Bit | 4KB 4K x 8 | I2C, LINbus, SCI, SPI | A/D 12x10b | ||||||||||||||
| MC9S12B256CPVE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12b64cfue-datasheets-8362.pdf | 112-LQFP | MC9S12B256 | 112-LQFP (20x20) | Internal | 91 | POR, PWM, WDT | 4K x 8 | 25MHz | HCS12 | 2.35V~5.5V | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, I2C, SCI, SPI | A/D 8x10b | 2K x 8 | ||||||||||||||||||||||||||||||||||||||||
| MC9S12XEP768CAG | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12X | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | CMOS | 1.6mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12xep100cal-datasheets-5104.pdf | 144-LQFP | 20mm | 20mm | 144 | 3A991.A.2 | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | YES | QUAD | GULL WING | 1.8V | 0.5mm | MC9S12XE768 | 1.98V | 1.72V | Not Qualified | S-PQFP-G144 | External | 119 | LVD, POR, PWM, WDT | 48K x 8 | 50MHz | MICROCONTROLLER, RISC | 32 | YES | NO | YES | NO | 40MHz | 23 | 16 | 1.72V~5.5V | FLASH | 16-Bit | 768KB 768K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | A/D 24x12b | 4K x 8 |
