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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Number of Terminations | ECCN Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Supplier Device Package | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Bus Compatibility | Boundary Scan | Low Power Mode | Format | Integrated Cache | Clock Frequency | Data Transfer Rate-Max | Address Bus Width | External Data Bus Width | Communication Protocol | Data Encoding/Decoding Method | USB | Core Processor | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | Additional Interfaces | Co-Processors/DSP | Display & Interface Controllers |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XPC850DECVR66BU | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC8xx | -40°C~95°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2004 | /files/nxpusainc-mc850deczq50bur2-datasheets-6645.pdf | 256-BGA | PC850 | 66MHz | USB 1.x (1) | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | |||||||||||||||||||||||||||||||||||||
| XPC850DEVR80BU | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC8xx | 0°C~95°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2004 | /files/nxpusainc-mc850deczq50bur2-datasheets-6645.pdf | 256-BBGA | PC850 | 80MHz | USB 1.x (1) | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | |||||||||||||||||||||||||||||||||||||
| XPC8255CVVIFBC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC82xx | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2002 | /files/nxpusainc-kxpc8260cvvihbc-datasheets-6042.pdf | 480-LBGA Exposed Pad | PC8255 | 480-TBGA (37.5x37.5) | 200MHz | PowerPC G2 | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | ||||||||||||||||||||||||||||||||||||
| KMC68360VR33L | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | 0°C~70°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1995 | /files/nxpusainc-mc68360rc25l-datasheets-6189.pdf | 357-BBGA | MC68360 | 33MHz | CPU32+ | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | |||||||||||||||||||||||||||||||||||||
| XPC850VR66BU | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC8xx | 0°C~95°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2004 | /files/nxpusainc-mc850deczq50bur2-datasheets-6645.pdf | 256-BBGA | PC850 | 66MHz | USB 1.x (1) | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | |||||||||||||||||||||||||||||||||||||
| XPC850DECVR50BU | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC8xx | -40°C~95°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2004 | /files/nxpusainc-mc850deczq50bur2-datasheets-6645.pdf | 256-BBGA | PC850 | 50MHz | USB 1.x (1) | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | |||||||||||||||||||||||||||||||||||||
| MC68MH360VR33LR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 1995 | /files/nxpusainc-mc68mh360zp33lr2-datasheets-6437.pdf | 357-BBGA | MC68MH360 | 357-PBGA (25x25) | 33MHz | CPU32+ | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | ||||||||||||||||||||||||||||||||||||
| MC68MH360VR33L | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 1.86mm | ROHS3 Compliant | 1995 | /files/nxpusainc-mc68mh360zp33lr2-datasheets-6437.pdf | 357-BBGA | 25mm | 357 | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 5V | 1.27mm | MC68MH360 | 5.25V | 4.75V | 40 | S-PBGA-B357 | 33MHz | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | MC68040; MC68030 | YES | YES | 25MHz | 1.25 MBps | 32 | 32 | BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP | NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | CPU32+ | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | |||||||||
| MC68HC000EI20 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M680x0 | 0°C~70°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 1995 | /files/nxpusainc-mc68hc000ei16r2-datasheets-0189.pdf | 68-LCC (J-Lead) | MC68HC000 | 20MHz | EC000 | 5.0V | 1 Core 32-Bit | No | |||||||||||||||||||||||||||||||||||||||||
| MC68306AG20B | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | 0°C~70°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1995 | /files/nxpusainc-mc68306ceh16b-datasheets-0589.pdf | 144-LQFP | MC68306 | 20MHz | EC000 | 5.0V | 1 Core 32-Bit | No | DRAM | DUART | |||||||||||||||||||||||||||||||||||||||
| MC68MH360AI25L | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 4.15mm | ROHS3 Compliant | 1995 | /files/nxpusainc-mc68mh360zp33lr2-datasheets-6437.pdf | 240-BFQFP | 31.305mm | 240 | 3A991.A.2 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 5V | 0.5mm | MC68MH360 | 5.25V | 4.75V | 40 | S-PQFP-G240 | 25MHz | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | MC68040; MC68030 | YES | YES | 25MHz | 1.25 MBps | 32 | 32 | BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP | NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | CPU32+ | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | |||||||||
| XPC8260VVIHBC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC82xx | 0°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.65mm | ROHS3 Compliant | 2004 | /files/nxpusainc-kxpc8260cvvihbc-datasheets-6042.pdf | 480-LBGA Exposed Pad | 37.5mm | 480 | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1.8V | 1.27mm | PC8260 | 1.9V | 1.7V | 30 | S-PBGA-B480 | 200MHz | MICROPROCESSOR, RISC | 32 | YES | NO | FLOATING POINT | YES | 66.66MHz | 32 | 64 | PowerPC G2 | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | ||||||||||
| XPC823CVR66B2T | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC8xx | -40°C~95°C TA | Tray | 1 (Unlimited) | ROHS3 Compliant | 1999 | /files/nxpusainc-kxpc823zt81b2t-datasheets-6048.pdf | 256-BBGA | PC823 | 256-PBGA (23x23) | 66MHz | USB 1.x (1) | PowerPC | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | I2C, SMC, SCC, SPI, UART | Communications; RISC CPM | LCD, Video | ||||||||||||||||||||||||||||||||||
| XPC850CVR66BU | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC8xx | -40°C~95°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2004 | /files/nxpusainc-mc850deczq50bur2-datasheets-6645.pdf | 256-BBGA | PC850 | 66MHz | USB 1.x (1) | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | |||||||||||||||||||||||||||||||||||||
| MC68020EH16E | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M680x0 | 0°C~70°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1995 | /files/nxpusainc-mc68020rc20e-datasheets-6063.pdf | 132-BQFP Bumpered | MC68020 | 132-PQFP (46x46) | 166MHz | 68020 | 5.0V | 1 Core 32-Bit | No | ||||||||||||||||||||||||||||||||||||||||
| MC68HC001EI8 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M680x0 | 0°C~70°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 1995 | /files/nxpusainc-mc68hc000ei16r2-datasheets-0189.pdf | 68-LCC (J-Lead) | MC68HC001 | 8MHz | EC000 | 5.0V | 1 Core 32-Bit | No | |||||||||||||||||||||||||||||||||||||||||
| XPC8240RVV250E | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC82xx | 0°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2001 | /files/nxpusainc-xpc8240rvv250e-datasheets-0704.pdf | 352-LBGA | 8542.31.00.01 | PC8240 | 250MHz | MICROPROCESSOR, RISC | PowerPC 603e | 3.3V | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, I2O, PCI, UART | ||||||||||||||||||||||||||||||||||||
| XPC823VR75B2T | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC8xx | 0°C~95°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1999 | /files/nxpusainc-kxpc823zt81b2t-datasheets-6048.pdf | 256-BBGA | PC823 | 256-PBGA (23x23) | 75MHz | USB 1.x (1) | PowerPC | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | I2C, SMC, SCC, SPI, UART | Communications; RISC CPM | LCD, Video | ||||||||||||||||||||||||||||||||||
| MPC857TCVR66B | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC8xx | -40°C~115°C TA | Tray | 3 (168 Hours) | CMOS | 2.52mm | ROHS3 Compliant | 2004 | /files/nxpusainc-kmpc862pcvr66b-datasheets-5926.pdf | 357-BBGA | 25mm | 357 | 5A991 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 3.3V | 1.27mm | MPC857 | 3.465V | 3.135V | 30 | S-PBGA-B357 | 66MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FIXED POINT | YES | 32 | 32 | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | ||||||||||||
| MPC860PVR66D4R2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC8xx | 0°C~95°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 1998 | /files/nxpusainc-mpc855tczq50d4-datasheets-5903.pdf | 357-BBGA | MPC860 | 66MHz | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | ||||||||||||||||||||||||||||||||||||||
| XPC8260CVVIHBC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC82xx | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.65mm | ROHS3 Compliant | 2004 | /files/nxpusainc-kxpc8260cvvihbc-datasheets-6042.pdf | 480-LBGA Exposed Pad | 37.5mm | 480 | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1.8V | 1.27mm | PC8260 | 1.9V | 1.7V | 30 | S-PBGA-B480 | 200MHz | MICROPROCESSOR, RISC | 32 | YES | NO | FLOATING POINT | YES | 66.66MHz | 32 | 64 | PowerPC G2 | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | ||||||||||
| XPC8240LVV200E | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC82xx | 0°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2003 | /files/nxpusainc-kxpc8240rvv250e-datasheets-6094.pdf | 352-LBGA | 8542.31.00.01 | PC8240 | 200MHz | MICROPROCESSOR, RISC | PowerPC 603e | 3.3V | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, I2O, PCI, UART | ||||||||||||||||||||||||||||||||||||
| MPC860DEVR50D4R2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC8xx | 0°C~95°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2004 | /files/nxpusainc-mpc855tczq50d4-datasheets-5903.pdf | 357-BBGA | MPC860 | 50MHz | MICROPROCESSOR, RISC | 3.3V | 10Mbps (2) | 1 Core 32-Bit | No | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | |||||||||||||||||||||||||||||||||||||
| XPC8260VVIFBC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC82xx | 0°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.65mm | ROHS3 Compliant | 2004 | /files/nxpusainc-kxpc8260cvvihbc-datasheets-6042.pdf | 480-LBGA Exposed Pad | 37.5mm | 480 | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1.8V | 1.27mm | PC8260 | 1.9V | 1.7V | 30 | S-PBGA-B480 | 200MHz | MICROPROCESSOR, RISC | 32 | YES | NO | FLOATING POINT | YES | 66.66MHz | 32 | 64 | PowerPC G2 | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | ||||||||||
| XPC8255VVIFBC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC82xx | 0°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.65mm | ROHS3 Compliant | 2004 | /files/nxpusainc-kxpc8260cvvihbc-datasheets-6042.pdf | 480-LBGA Exposed Pad | 37.5mm | 480 | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1.8V | 1.27mm | PC8255 | 1.9V | 1.7V | 30 | S-PBGA-B480 | 200MHz | MICROPROCESSOR, RISC | 32 | YES | NO | FLOATING POINT | YES | 66.66MHz | 32 | 64 | PowerPC G2 | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | ||||||||||
| MPC860DPVR50D4R2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC8xx | 0°C~95°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2004 | /files/nxpusainc-mpc855tczq50d4-datasheets-5903.pdf | 357-BBGA | MPC860 | 50MHz | MICROPROCESSOR, RISC | 3.3V | 10Mbps (2), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | |||||||||||||||||||||||||||||||||||||
| XPC8260CVVIFBC | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC82xx | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.65mm | ROHS3 Compliant | 2004 | /files/nxpusainc-kxpc8260cvvihbc-datasheets-6042.pdf | 480-LBGA Exposed Pad | 37.5mm | 480 | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1.8V | 1.27mm | PC8260 | 1.9V | 1.7V | 30 | S-PBGA-B480 | 200MHz | MICROPROCESSOR, RISC | 32 | YES | NO | FLOATING POINT | YES | 66.66MHz | 32 | 64 | PowerPC G2 | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | ||||||||||
| MPC855TCVR50D4R2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC8xx | -40°C~95°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2004 | /files/nxpusainc-mpc855tczq50d4-datasheets-5903.pdf | 357-BBGA | MPC855 | 50MHz | MICROPROCESSOR, RISC | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | |||||||||||||||||||||||||||||||||||||
| MPC860SRVR66D4R2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC8xx | 0°C~95°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2001 | /files/nxpusainc-mpc855tczq50d4-datasheets-5903.pdf | 357-BBGA | MPC860 | 66MHz | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | ||||||||||||||||||||||||||||||||||||||
| MC68306EH16B | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | 0°C~70°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1995 | /files/nxpusainc-mc68306ceh16b-datasheets-0589.pdf | 132-BQFP Bumpered | MC68306 | 16MHz | EC000 | 5.0V | 1 Core 32-Bit | No | DRAM | DUART |
