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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Number of Terminations | Factory Lead Time | ECCN Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | JESD-30 Code | Supplier Device Package | Screening Level | Number of I/O | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | Boundary Scan | Low Power Mode | Format | Integrated Cache | Clock Frequency | Address Bus Width | External Data Bus Width | USB | Core Processor | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | Additional Interfaces | Co-Processors/DSP | Security Features | Display & Interface Controllers | SATA |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MIMX8DX5AVLFZAC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 2 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6D7CZK08AD | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6D | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.25mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6d7czk08ae-datasheets-5954.pdf | 569-LFBGA | 12mm | 569 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.4V | 0.4mm | 1.5V | 1.275V | 40 | S-PBGA-B569 | 800MHz | MICROPROCESSOR, RISC | YES | YES | FIXED POINT | YES | 26 | 32 | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | ||||||||||||||
| MCIMX6D6AVT08AE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6D | -40°C~125°C TJ | Tray | 3 (168 Hours) | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6d6avt10ae-datasheets-9372.pdf | 624-FBGA, FCBGA | 12 Weeks | 260 | 40 | 852MHz | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | |||||||||||||||||||||||||||||||||||||
| LS1027ASE7NQA | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QorIQ® Layerscape | -40°C~105°C TA | 3 (168 Hours) | 448-BFBGA | 18 Weeks | 1.3GHz | ARM® Cortex®-A72 | 1Gbps (1), 2.5Gbps (5) | 2 Core 64-Bit | DDR3L SDRAM, DDR4 SDRAM | CANbus, I2C, SPI, UART | SATA 6Gbps (1) | |||||||||||||||||||||||||||||||||||||||||||||||||
| LS1018AXN7HNA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QorIQ® Layerscape | -40°C~105°C TA | 3 (168 Hours) | 448-BFBGA | 18 Weeks | 800MHz | ARM® Cortex®-A72 | 1Gbps (1), 2.5Gbps (5) | 1 Core 64-Bit | DDR3L SDRAM, DDR4 SDRAM | CANbus, I2C, SPI, UART | SATA 6Gbps (1) | |||||||||||||||||||||||||||||||||||||||||||||||||
| P1010NXE5FFB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QorIQ P1 | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2002 | /files/nxpusainc-p1014nsn5dfb-datasheets-0040.pdf | 425-FBGA | 12 Weeks | P1010 | 1.0GHz | USB 2.0 + PHY (1) | PowerPC e500v2 | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR3, DDR3L | CAN, DUART, I2C, MMC/SD, SPI | Security; SEC 4.4 | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | SATA 3Gbps (2) | ||||||||||||||||||||||||||||||||||||||||
| MPC8272ZQMIBA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC82xx | 0°C~105°C TA | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 1994 | /files/nxpusainc-mpc8248cvrtiea-datasheets-9650.pdf | 516-BBGA | 27mm | 516 | 8 Weeks | 5A002.A.1 | 8542.31.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | 245 | 1.5V | 1mm | MPC8272 | 1.575V | 1.425V | 30 | Other uPs/uCs/Peripheral ICs | 1.53.3V | S-PBGA-B516 | 57 | 266MHz | MICROCONTROLLER, RISC | 32 | NO | YES | NO | 66.7MHz | 30 | 64 | USB 2.0 (1) | PowerPC G2_LE | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM, Security; SEC | Cryptography, Random Number Generator | ||||||||||||
| LS1023ASE7QQB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QorIQ® Layerscape | 0°C~105°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2014 | /files/nxpusainc-ls1043asn8qqb-datasheets-0750.pdf | 621-FBGA, FCBGA | 18 Weeks | 1.6GHz | USB 3.0 (2) + PHY | ARM® Cortex®-A53 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 2 Core 64-Bit | DDR3L, DDR4 | Secure Boot, TrustZone® | SATA 6Gbps (1) | ||||||||||||||||||||||||||||||||||||||||||||
| LS1017AXN7NQA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QorIQ® Layerscape | -40°C~105°C TA | 3 (168 Hours) | 448-BFBGA | 18 Weeks | 1.3GHz | ARM® Cortex®-A72 | 1Gbps (1), 2.5Gbps (5) | 1 Core 64-Bit | DDR3L SDRAM, DDR4 SDRAM | CANbus, I2C, SPI, UART | SATA 6Gbps (1) | |||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX31CJMN4CR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX31 | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2004 | /files/nxpusainc-mcimx31lcvmn4dr2-datasheets-7018.pdf | 473-LFBGA | 15 Weeks | MCIMX31 | 400MHz | USB 2.0 (3) | ARM1136JF-S | 1.8V 2.0V 2.5V 2.7V 3.0V | 1 Core 32-Bit | Yes | DDR | 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART | Multimedia; GPU, IPU, MPEG-4, VFP | Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory | Keyboard, Keypad, LCD | ||||||||||||||||||||||||||||||||||||||||
| MPC855TZQ50D4 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC8xx | 0°C~95°C TA | Tray | 3 (168 Hours) | CMOS | 2.52mm | Non-RoHS Compliant | 1997 | /files/nxpusainc-mpc855tczq50d4-datasheets-5903.pdf | 357-BBGA | 25mm | 357 | 12 Weeks | 3A991.A.2 | 8542.31.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | 245 | 3.3V | 1.27mm | MPC855 | 3.465V | 3.135V | 30 | Microprocessors | 3.3V | S-PBGA-B357 | 50MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FIXED POINT | YES | 50MHz | 32 | 32 | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | ||||||||||||||
| MC68302EH16CB1 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 1995 | /files/nxpusainc-mc68302eh20c-datasheets-9824.pdf | 132-BQFP Bumpered | 132 | 8 Weeks | 8542.31.00.01 | YES | QUAD | GULL WING | 0.635mm | MC68302 | Other uPs/uCs/Peripheral ICs | S-PQFP-G132 | 16MHz | M68000 | 5.0V | 1 Core 8/16-Bit | No | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | ||||||||||||||||||||||||||||||||||
| MCIMX6Q5EYM10AER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6Q | -20°C~105°C TJ | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6d5eym10ae-datasheets-9291.pdf | 624-LFBGA, FCBGA | 15 Weeks | 260 | 40 | 1.0GHz | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | |||||||||||||||||||||||||||||||||||||
| OMAP3530DCUSA | Rochester Electronics, LLC |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | OMAP-35xx | -40°C~105°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/rochesterelectronicsllc-omap3530dcbca-datasheets-1207.pdf | 423-LFBGA, FCBGA | 423-FCBGA (16x16) | 720MHz | USB 1.x (3), USB 2.0 (1) | ARM® Cortex®-A8 | 1.8V 3.0V | 1 Core 32-Bit | Yes | LPDDR | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | |||||||||||||||||||||||||||||||||||||||||||
| P1014NXN5HHB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QorIQ P1 | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.9mm | ROHS3 Compliant | 2002 | /files/nxpusainc-p1014nsn5dfb-datasheets-0040.pdf | 425-FBGA | 19mm | 425 | 12 Weeks | 3A991.A.2 | 8542.31.00.01 | e2 | TIN COPPER/TIN SILVER | YES | BOTTOM | BALL | 260 | 1V | 0.8mm | P1014 | 1.05V | 0.95V | 40 | S-PBGA-B425 | 800MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FLOATING POINT | YES | 100MHz | USB 2.0 + PHY (1) | PowerPC e500v2 | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR3, DDR3L | DUART, I2C, MMC/SD, SPI | SATA 3Gbps (2) | |||||||||||||||||
| LS1027AXN7KQA | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QorIQ® Layerscape | -40°C~105°C TA | 3 (168 Hours) | 448-BFBGA | 18 Weeks | 1GHz | ARM® Cortex®-A72 | 1Gbps (1), 2.5Gbps (5) | 2 Core 64-Bit | DDR3L SDRAM, DDR4 SDRAM | CANbus, I2C, SPI, UART | SATA 6Gbps (1) | |||||||||||||||||||||||||||||||||||||||||||||||||
| LS1023ASE7PQB | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QorIQ® Layerscape | 0°C~105°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2014 | /files/nxpusainc-ls1043asn8qqb-datasheets-0750.pdf | 621-FBGA, FCBGA | 18 Weeks | 1.4GHz | USB 3.0 (2) + PHY | ARM® Cortex®-A53 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 2 Core 64-Bit | DDR3L, DDR4 | Secure Boot, TrustZone® | SATA 6Gbps (1) | ||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6D5EYM10ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6D | -20°C~105°C TJ | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2011 | /files/nxpusainc-mcimx6q7cvt08ae-datasheets-9282.pdf | 624-LFBGA, FCBGA | 15 Weeks | 1.0GHz | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | |||||||||||||||||||||||||||||||||||||||
| MIMX8QX2AVOFZAC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 2 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SPC5200CBV400B | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC52xx | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 2.65mm | Non-RoHS Compliant | 2003 | /files/nxpusainc-mpc5200vr400b-datasheets-1972.pdf | 272-BBGA | 27mm | 272 | 12 Weeks | 3A991.A.2 | 8542.31.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | 245 | 1.5V | 1.27mm | PC5200 | 1.58V | 1.42V | 30 | Microprocessors | 1.53.3V | S-PBGA-B272 | AEC-Q100 | 400MHz | MICROPROCESSOR | 32 | YES | YES | FLOATING POINT | YES | 66MHz | 32 | 32 | USB 1.1 (2) | PowerPC G2_LE | 2.5V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | DDR, SDRAM | AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | ||||||||||||
| LS1023ASN7KQB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QorIQ® Layerscape | 0°C~105°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2014 | /files/nxpusainc-ls1043asn8qqb-datasheets-0750.pdf | 621-FBGA, FCBGA | 18 Weeks | 1.0GHz | USB 3.0 (2) + PHY | ARM® Cortex®-A53 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 2 Core 64-Bit | DDR3L, DDR4 | Secure Boot, TrustZone® | SATA 6Gbps (1) | ||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6D4AVT10AD | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6D | -40°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 2.16mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6q7cvt08ae-datasheets-9282.pdf | 624-FBGA, FCBGA | 21mm | 624 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 0.8mm | 1.5V | 1.35V | 40 | S-PBGA-B624 | 1.0GHz | MICROPROCESSOR | YES | YES | FIXED POINT | YES | 16 | 64 | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | |||||||||||||||
| LS1023AXE7KQB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QorIQ® Layerscape | -40°C~105°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2014 | /files/nxpusainc-ls1043asn8qqb-datasheets-0750.pdf | 621-FBGA, FCBGA | 18 Weeks | 1.0GHz | USB 3.0 (2) + PHY | ARM® Cortex®-A53 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 2 Core 64-Bit | DDR3L, DDR4 | Secure Boot, TrustZone® | SATA 6Gbps (1) | ||||||||||||||||||||||||||||||||||||||||||||
| P1014NXE5HHB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QorIQ P1 | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.9mm | ROHS3 Compliant | 2002 | /files/nxpusainc-p1014nsn5dfb-datasheets-0040.pdf | 425-FBGA | 19mm | 425 | 12 Weeks | 5A002.A.1 | 8542.31.00.01 | e2 | TIN COPPER/TIN SILVER | YES | BOTTOM | BALL | 260 | 1V | 0.8mm | P1014 | 1.05V | 0.95V | 40 | S-PBGA-B425 | 800MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FLOATING POINT | YES | 100MHz | USB 2.0 + PHY (1) | PowerPC e500v2 | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR3, DDR3L | DUART, I2C, MMC/SD, SPI | Security; SEC 4.4 | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | SATA 3Gbps (2) | |||||||||||||||
| MPC880CVR133 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC8xx | -40°C~100°C TA | Tray | 3 (168 Hours) | CMOS | 2.52mm | ROHS3 Compliant | 1999 | /files/nxpusainc-mpc885cvr133-datasheets-1301.pdf | 357-BBGA | 25mm | 357 | 12 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1.8V | 1.27mm | MPC880 | 1.9V | 1.7V | 30 | Microprocessors | 1.83.3V | S-PBGA-B357 | 133MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FIXED POINT | YES | 32 | 32 | USB 2.0 (1) | 3.3V | 10Mbps (2), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | ||||||||||||||
| LS1018ASE7KQA | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QorIQ® Layerscape | -40°C~105°C TA | 3 (168 Hours) | 448-BFBGA | 18 Weeks | 1GHz | ARM® Cortex®-A72 | 1Gbps (1), 2.5Gbps (5) | 1 Core 64-Bit | DDR3L SDRAM, DDR4 SDRAM | CANbus, I2C, SPI, UART | SATA 6Gbps (1) | |||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6D4AVT08AE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6D | -40°C~125°C TJ | Tray | 3 (168 Hours) | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6d6avt10ae-datasheets-9372.pdf | 624-FBGA, FCBGA | 12 Weeks | 260 | 40 | 852MHz | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | |||||||||||||||||||||||||||||||||||||
| LS1043ASE7MQB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QorIQ® Layerscape | 0°C~105°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2014 | /files/nxpusainc-ls1043asn8qqb-datasheets-0750.pdf | 621-FBGA, FCBGA | 18 Weeks | 1.2GHz | USB 3.0 (3) + PHY | ARM® Cortex®-A53 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | DDR3L, DDR4 | Secure Boot, TrustZone® | SATA 6Gbps (1) | ||||||||||||||||||||||||||||||||||||||||||||
| MPC8271ZQMIBA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC82xx | 0°C~105°C TA | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 1994 | /files/nxpusainc-mpc8248cvrtiea-datasheets-9650.pdf | 516-BBGA | 27mm | 516 | 8 Weeks | 3A991.A.2 | 8542.31.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | 245 | 1.5V | 1mm | MPC8271 | 1.575V | 1.425V | 30 | Other uPs/uCs/Peripheral ICs | 1.53.3V | S-PBGA-B516 | 57 | 266MHz | MICROCONTROLLER, RISC | 32 | NO | YES | NO | 66.7MHz | 30 | 64 | USB 2.0 (1) | PowerPC G2_LE | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | |||||||||||||
| MC68302AG16VC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | 0°C~70°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1995 | /files/nxpusainc-mc68302eh20c-datasheets-9824.pdf | 144-LQFP | 8 Weeks | MC68302 | 16MHz | M68000 | 3.3V | 1 Core 8/16-Bit | No | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM |
