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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Pbfree Code | ECCN Code | HTS Code | JESD-609 Code | Terminal Finish | Voltage | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | RAM Size | Data Bus Width | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Number of Timers/Counters | Boundary Scan | Low Power Mode | Format | Integrated Cache | Access Time | Clock Frequency | Address Bus Width | External Data Bus Width | USB | Core Processor | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | Additional Interfaces | Co-Processors/DSP | Security Features | Display & Interface Controllers | SATA |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MPC8315VRADDA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC83xx | 0°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 2.46mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mpc8315cvragda-datasheets-9453.pdf | 620-BBGA Exposed Pad | 29mm | 620 | 10 Weeks | 3A991.A.2 | 8542.31.00.01 | e2 | TIN COPPER/TIN SILVER | YES | BOTTOM | BALL | 260 | 1V | 1mm | MPC8315 | 1.05V | 0.95V | 40 | Microprocessors | 11.8/2.53.3V | S-PBGA-B620 | 266MHz | MICROPROCESSOR | 32 | YES | YES | FLOATING POINT | YES | 66.67MHz | 32 | 32 | USB 2.0 + PHY (1) | PowerPC e300c3 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | DUART, I2C, PCI, SPI, TDM | SATA 3Gbps (2) | ||||||||||||||||||||||
| SVF532R3K2CMK4 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Vybrid, VF5xxR | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-svf311r3k2cku2-datasheets-0263.pdf | 364-LFBGA | 15 Weeks | yes | 260 | 40 | 400MHz, 133MHz | MICROPROCESSOR, RISC | USB 2.0 OTG + PHY (1) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | |||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX537CVV8CR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX53 | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.9mm | ROHS3 Compliant | 2007 | 529-FBGA | 19mm | 529 | 15 Weeks | 5A992 | 8542.31.00.01 | e2 | TIN COPPER/TIN SILVER | YES | BOTTOM | BALL | 260 | 1.1V | 0.8mm | MCIMX537 | 1.15V | 1.05V | 40 | Graphics Processors | 1.11.3V | Not Qualified | S-PBGA-B529 | 800MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FLOATING POINT | YES | 27MHz | 16 | 32 | USB 2.0 (2), USB 2.0 + PHY (2) | ARM® Cortex®-A8 | 1.3V 1.8V 2.775V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, DDR2, DDR3 | 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 1.5Gbps (1) | |||||||||||||||||||
| MPC875VR80 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC8xx | 0°C~95°C TA | Tray | 3 (168 Hours) | CMOS | 2.54mm | ROHS3 Compliant | 1999 | /files/nxpusainc-mpc870cvr133-datasheets-8174.pdf | 256-BBGA | 23mm | 256 | 12 Weeks | 5A002.A.1 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1.8V | 1.27mm | MPC875 | 1.9V | 1.7V | 30 | Microprocessors | 1.83.3V | S-PBGA-B256 | 80MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FIXED POINT | YES | 32 | 32 | USB 2.0 (1) | 3.3V | 10Mbps (1), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | Cryptography | |||||||||||||||||||||||
| MCIMX6X2AVN08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6SX | -40°C~125°C TJ | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mcimx6x1avo08ab-datasheets-9686.pdf | 400-LFBGA | 14 Weeks | 8542.39.00.01 | 260 | 40 | 200MHz, 800MHz | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ARM® Cortex®-A9, ARM® Cortex®-M4 | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | |||||||||||||||||||||||||||||||||||||||||||||||
| MPC875VR66 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC8xx | 0°C~95°C TA | Tray | 3 (168 Hours) | CMOS | 2.54mm | ROHS3 Compliant | 1999 | /files/nxpusainc-mpc870cvr133-datasheets-8174.pdf | 256-BBGA | 23mm | 256 | 12 Weeks | 5A002.A.1 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1.8V | 1.27mm | MPC875 | 1.9V | 1.7V | 30 | Microprocessors | 1.83.3V | S-PBGA-B256 | 66MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FIXED POINT | YES | 32 | 32 | USB 2.0 (1) | 3.3V | 10Mbps (1), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | Cryptography | |||||||||||||||||||||||
| MCIMX535DVV2C2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX53 | -20°C~85°C TC | Tray | 3 (168 Hours) | ROHS3 Compliant | 2011 | 529-FBGA | 15 Weeks | 1.2GHz | USB 2.0 (2), USB 2.0 + PHY (2) | ARM® Cortex®-A8 | 1.3V 1.8V 2.775V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, DDR2, DDR3 | 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 1.5Gbps (1) | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6S1AVM08AD | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6S | -40°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | /files/nxpusainc-mcimx6u6avm10ac-datasheets-9968.pdf | 624-LFBGA | 21mm | 624 | 14 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | 260 | 0.8mm | 1.5V | 1.275V | 40 | S-PBGA-B624 | 800MHz | MICROPROCESSOR, RISC | YES | YES | FLOATING POINT | YES | 16 | 32 | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ||||||||||||||||||||||||||||||
| MCIMX6U4AVM08AD | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6DL | -40°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | /files/nxpusainc-mcimx6u6avm10ac-datasheets-9968.pdf | 624-LFBGA | 21mm | 624 | 12 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | 260 | 0.8mm | 1.5V | 1.275V | 40 | S-PBGA-B624 | 800MHz | MICROPROCESSOR, RISC | YES | YES | FLOATING POINT | YES | 16 | 64 | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ||||||||||||||||||||||||||||||
| MCIMX6U4AVM08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6DL | -40°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6s4avm08ac-datasheets-0412.pdf | 624-LFBGA | 21mm | 624 | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.35V | 0.8mm | MCIMX6 | 1.5V | 1.275V | 40 | S-PBGA-B624 | 800MHz | MICROPROCESSOR, RISC | 64 | YES | YES | FIXED POINT | YES | 24MHz | 16 | 64 | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | |||||||||||||||||||||||
| PLS1012ASE7HKA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QorIQ® | 0°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2016 | /files/nxpusainc-pls1012ase7hka-datasheets-4283.pdf | 211-VFLGA | 211-FCLGA (9.6x9.6) | 800MHz | USB 2.0 (1), USB 3.0 + PHY | ARM® Cortex®-A53 | 1 Core 64-Bit | DDR3L | eMMC/SD/SDIO, I2C, I2S, SPI, UART | ARM TZ | SATA 6Gbps (1) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6S1AVM08ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6S | -40°C~125°C TJ | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6s4avm08ac-datasheets-0412.pdf | 624-LFBGA | 15 Weeks | 800MHz | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ||||||||||||||||||||||||||||||||||||||||||||||||||
| SVF532R2K2CMK4R | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Vybrid, VF5xxR | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-svf532r2k1cmk4r-datasheets-6535.pdf | 364-LFBGA | 12 Weeks | 8542.31.00.01 | 260 | 40 | 400MHz, 133MHz | MICROPROCESSOR, RISC | USB 2.0 OTG + PHY (1) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | |||||||||||||||||||||||||||||||||||||||||||||||
| MC9328MX1DVM20R2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX1 | -30°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 1994 | /files/nxpusainc-mc9328mx1dvm15r2-datasheets-3599.pdf | 256-MAPBGA | 10 Weeks | MC9328MX1 | 200MHz | USB 1.x (1) | ARM920T | 1.8V 3.0V | 1 Core 32-Bit | No | SDRAM | I2C, I2S, SPI, SSI, MMC/SD, UART | LCD, Touch Panel | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX537CVV8C2R2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX53 | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2011 | 529-FBGA | 15 Weeks | 800MHz | USB 2.0 (2), USB 2.0 + PHY (2) | ARM® Cortex®-A8 | 1.3V 1.8V 2.775V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, DDR2, DDR3 | 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 1.5Gbps (1) | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9328MX21CVK | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX21 | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.49mm | ROHS3 Compliant | 2006 | 289-LFBGA | 14mm | 289 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.5V | 0.65mm | MC9328MX21 | 1.65V | 1.45V | 40 | S-PBGA-B289 | 266MHz | MICROPROCESSOR | 32 | YES | YES | FIXED POINT | YES | 32MHz | 26 | 32 | USB 1.x (2) | ARM926EJ-S | 1.8V 3.0V | 1 Core 32-Bit | No | SDRAM | 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART | Keypad, LCD | ||||||||||||||||||||||||||
| SVF522R3K2CMK4 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Vybrid, VF5xxR | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-svf311r3k2cku2-datasheets-0263.pdf | 364-LFBGA | 15 Weeks | yes | 260 | 40 | 400MHz, 133MHz | MICROPROCESSOR, RISC | USB 2.0 OTG + PHY (1) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | |||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6S5EVM10ABR | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6S | -20°C~105°C TJ | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6s5dvm10ad-datasheets-9762.pdf | 624-LFBGA | 624 | 15 Weeks | 8542.31.00.01 | YES | MCIMX6 | Graphics Processors | 1.05/1.5V | 2200mA | Not Qualified | 1.0GHz | GRAPHICS PROCESSOR | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ||||||||||||||||||||||||||||||||||||||||
| Z8018006FSC | Zilog |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Z180 | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 6MHz | 3.1mm | Non-RoHS Compliant | 2006 | 80-BQFP | 5V | Contains Lead | 80 | 80 | SCI, UART | no | e0 | Tin/Lead (Sn/Pb) | 5V | QUAD | GULL WING | 225 | 5V | 0.8mm | 80 | 30 | Microprocessors | 5V | 40mA | 64kB | 8b | MICROPROCESSOR | 8 | 2 | 6 μs | Z80180 | 5.0V | 1 Core 8-Bit | No | DRAM | ASCI, CSIO, UART | |||||||||||||||||||||||||||||
| MCIMX6S7CVM08ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6S | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mcimx6s7cvm08acr-datasheets-7099.pdf | 624-LFBGA | 15 Weeks | 800MHz | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6U1AVM08ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6DL | -40°C~125°C TJ | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mcimx6s5dvm10ad-datasheets-9762.pdf | 624-LFBGA | 12 Weeks | 800MHz | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8313ECZQADDC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC83xx | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 2.55mm | Non-RoHS Compliant | 2002 | /files/nxpusainc-mpc8314vragda-datasheets-9330.pdf | 516-BBGA Exposed Pad | 27mm | 516 | 8 Weeks | 5A002.A.1 | 8542.31.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | 260 | 1V | 1mm | MPC8313 | 1.05V | 0.95V | 40 | S-PBGA-B516 | 267MHz | MICROPROCESSOR, RISC | YES | YES | FLOATING POINT | YES | 15 | 32 | USB 2.0 + PHY (1) | PowerPC e300c3 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | DUART, HSSI, I2C, PCI, SPI | Security; SEC 2.2 | Cryptography | |||||||||||||||||||||||||
| MPC8313ECVRADDC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC83xx | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 2.55mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mpc8314vragda-datasheets-9330.pdf | 516-BBGA Exposed Pad | 27mm | 516 | 8 Weeks | 5A002.A.1 | 8542.31.00.01 | e2 | TIN COPPER/TIN SILVER | YES | BOTTOM | BALL | 260 | 1V | 1mm | MPC8313 | 1.05V | 0.95V | 40 | Microprocessors | 11.8/2.53.3V | S-PBGA-B516 | 267MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FLOATING POINT | YES | 15 | 32 | USB 2.0 + PHY (1) | PowerPC e300c3 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | DUART, HSSI, I2C, PCI, SPI | Security; SEC 2.2 | Cryptography | ||||||||||||||||||||||
| MCIMX515CJM6CR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX51 | -40°C~95°C TC | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2008 | 529-LFBGA | 19mm | 529 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1V | 0.8mm | MCIMX515 | 1.1V | 0.95V | 40 | Graphics Processors | 1.2V | Not Qualified | S-PBGA-B529 | 600MHz | MICROPROCESSOR CIRCUIT | USB 2.0 (3), USB 2.0 + PHY (1) | ARM® Cortex®-A8 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keypad, LCD | ||||||||||||||||||||||||||||
| MCIMX516AJM6CR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX51 | -40°C~125°C TJ | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2008 | /files/nxpusainc-mcimx514ajm6cr2-datasheets-4150.pdf | 529-LFBGA | 19mm | 529 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1V | 0.8mm | 1.1V | 0.95V | 40 | Graphics Processors | 1.2V | Not Qualified | S-PBGA-B529 | 600MHz | MICROPROCESSOR CIRCUIT | USB 2.0 (3), USB 2.0 + PHY (1) | ARM® Cortex®-A8 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keypad, LCD | ||||||||||||||||||||||||||||
| SVF532R2K1CMK4 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Vybrid, VF5xxR | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2014 | /files/nxpusainc-svf331r3k1cku2-datasheets-3892.pdf | 364-LFBGA | 364 | 15 Weeks | 5A002.A.1 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.23V | 1.26V | 1.16V | 40 | S-PBGA-B364 | 400MHz, 133MHz | MICROPROCESSOR, RISC | YES | YES | FLOATING POINT | YES | USB 2.0 OTG + PHY (1) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | ||||||||||||||||||||||||||||||
| SVF312R3K1CKU2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Vybrid, VF3xxR | -40°C~85°C TA | Bulk | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2014 | 176-LQFP Exposed Pad | 24mm | 176 | 15 Weeks | 5A002.A.1 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | SVF312 | 3.6V | 3V | 40 | S-PQFP-G176 | 266MHz | MICROPROCESSOR, RISC | YES | YES | FLOATING POINT | YES | USB 2.0 OTG + PHY (1) | ARM® Cortex®-A5 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | |||||||||||||||||||||||||||
| MCIMX6X1AVK08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6SX | -40°C~125°C TJ | Tray | 3 (168 Hours) | ROHS3 Compliant | 2017 | /files/nxpusainc-mcimx6x1avo08ab-datasheets-9686.pdf | 400-LFBGA | 14 Weeks | 8542.39.00.01 | 260 | 40 | 200MHz, 800MHz | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ARM® Cortex®-A9, ARM® Cortex®-M4 | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LVDDR3, DDR3 | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | |||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX536AVV8C2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX53 | -40°C~125°C TJ | Tray | 3 (168 Hours) | ROHS3 Compliant | 2009 | 529-FBGA | 15 Weeks | 800MHz | USB 2.0 (2), USB 2.0 + PHY (2) | ARM® Cortex®-A8 | 1.3V 1.8V 2.775V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, DDR2, DDR3 | 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 1.5Gbps (1) | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6U8DVM10AD | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6DL | 0°C~95°C TJ | Tray | 3 (168 Hours) | ROHS3 Compliant | 624-LFBGA | 15 Weeks | 8542.39.00.01 | 260 | 40 | 1.0GHz | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD |
