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Microprocessors(11306)

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Part Status Series Operating Temperature Packaging Moisture Sensitivity Level (MSL) Technology Height Seated (Max) RoHS Status Published Datasheet Package / Case Length Number of Terminations Factory Lead Time ECCN Code HTS Code JESD-609 Code Terminal Finish Surface Mount Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Terminal Pitch Base Part Number Supply Voltage-Max (Vsup) Supply Voltage-Min (Vsup) Time@Peak Reflow Temperature-Max (s) Subcategory Power Supplies JESD-30 Code Number of I/O Speed uPs/uCs/Peripheral ICs Type Bit Size Has ADC DMA Channels PWM Channels Bus Compatibility Boundary Scan Low Power Mode Format Integrated Cache Clock Frequency Data Transfer Rate-Max Address Bus Width External Data Bus Width Communication Protocol Data Encoding/Decoding Method USB Core Processor Voltage - I/O Ethernet Number of Cores/Bus Width Graphics Acceleration RAM Controllers Additional Interfaces Co-Processors/DSP Security Features Display & Interface Controllers SATA
MPC860ENVR80D4 MPC860ENVR80D4 NXP USA Inc.
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 0 0x0x0 download MPC8xx 0°C~95°C TA Tray 3 (168 Hours) CMOS 2.52mm ROHS3 Compliant 1995 /files/nxpusainc-mpc855tczq50d4-datasheets-5903.pdf 357-BBGA 25mm 357 12 Weeks 3A991.A.2 8542.31.00.01 e1 TIN SILVER COPPER YES BOTTOM BALL 245 3.3V 1.27mm MPC860 3.465V 3.135V 30 Microprocessors 3.3V S-PBGA-B357 80MHz MICROPROCESSOR, RISC 32 YES YES FIXED POINT YES 50MHz 32 32 3.3V 10Mbps (4) 1 Core 32-Bit No DRAM I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Communications; CPM
MC68EN360VR25L MC68EN360VR25L NXP USA Inc.
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 0 0x0x0 download M683xx 0°C~70°C TA Tray 3 (168 Hours) CMOS 1.86mm ROHS3 Compliant 1995 /files/nxpusainc-mc68360cai25l-datasheets-3855.pdf 357-BBGA 25mm 357 8 Weeks 3A991.A.2 8542.31.00.01 e1 Tin/Silver/Copper (Sn/Ag/Cu) YES BOTTOM BALL 260 5V 1.27mm MC68EN360 5.25V 4.75V 40 S-PBGA-B357 46 25MHz MICROCONTROLLER, RISC 32 NO YES NO 6MHz 32 32 CPU32+ 5.0V 10Mbps (1) 1 Core 32-Bit No DRAM SCC, SMC, SPI Communications; CPM
MPC8349VVAGDB MPC8349VVAGDB NXP USA Inc.
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 0 0x0x0 download MPC83xx 0°C~105°C TA Tray 3 (168 Hours) CMOS 1.69mm ROHS3 Compliant 2002 672-LBGA 35mm 672 12 Weeks 3A991.A.2 8542.31.00.01 e2 TIN COPPER/TIN SILVER YES BOTTOM BALL 260 1.2V 1mm MPC8349 1.26V 1.14V 40 Microprocessors 1.21.8/2.52.5/3.3V S-PBGA-B672 400MHz MICROPROCESSOR 32 YES YES FLOATING POINT YES 66MHz 32 32 USB 2.0 + PHY (2) PowerPC e300 1.8V 2.5V 3.3V 10/100/1000Mbps (2) 1 Core 32-Bit No DDR, DDR2 DUART, I2C, PCI, SPI
MPC8533VJALFA MPC8533VJALFA NXP USA Inc.
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 0 0x0x0 download MPC85xx 0°C~90°C TA Tray 3 (168 Hours) CMOS 2.8mm ROHS3 Compliant 2002 /files/nxpusainc-mpc8314vragda-datasheets-9330.pdf 783-BBGA, FCBGA 29mm 783 18 Weeks 3A991.A.2 8542.31.00.01 YES BOTTOM BALL 1V 1mm MPC8533 1.05V 0.95V S-PBGA-B783 667MHz MICROPROCESSOR, RISC 32 YES YES FIXED POINT YES 16 64 PowerPC e500v2 1.8V 2.5V 3.3V 10/100/1000Mbps (2) 1 Core 32-Bit No DDR, DDR2 DUART, HSSI, I2C, PCI
MC68EN360ZQ25L MC68EN360ZQ25L NXP USA Inc.
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 0 0x0x0 download M683xx 0°C~70°C TA Tray 3 (168 Hours) CMOS 1.86mm Non-RoHS Compliant 1995 /files/nxpusainc-mc68360cai25l-datasheets-3855.pdf 357-BBGA 25mm 357 3A991.A.2 8542.31.00.01 e0 Tin/Lead (Sn/Pb) YES BOTTOM BALL 260 5V 1.27mm MC68EN360 5.25V 4.75V 40 S-PBGA-B357 46 25MHz MICROCONTROLLER, RISC 32 NO YES NO 6MHz 32 32 CPU32+ 5.0V 10Mbps (1) 1 Core 32-Bit No DRAM SCC, SMC, SPI Communications; CPM
P2010NSE2KFC P2010NSE2KFC NXP USA Inc.
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 0 0x0x0 download QorIQ P2 0°C~125°C TA Tray 3 (168 Hours) ROHS3 Compliant 2013 /files/nxpusainc-mpc8314vragda-datasheets-9330.pdf 689-BBGA Exposed Pad 12 Weeks P2010 1.2GHz USB 2.0 + PHY (2) PowerPC e500v2 10/100/1000Mbps (3) 1 Core 32-Bit No DDR2, DDR3 DUART, I2C, MMC/SD, SPI Security; SEC 3.3 Cryptography, Random Number Generator
LS1084ASN7PTA LS1084ASN7PTA NXP USA Inc.
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 0 0x0x0 download QorlQ LS1 0°C~105°C TA 3 (168 Hours) ROHS3 Compliant 780-BFBGA 18 Weeks 250 30 1.4GHz USB 3.0 + PHY (2) ARM® Cortex®-A53 10GbE (2), 1GbE (8) 8 Core 64-Bit Yes DDR4 eMMC, I2C, IFC, PCI, SPI, UART Multimedia; NEON™ SIMD Secure Boot, TrustZone® LVDS SATA 6Gbps (1)
LS1084AXN7MQA LS1084AXN7MQA NXP USA Inc.
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 0 0x0x0 download QorlQ LS1 -40°C~105°C TA 3 (168 Hours) ROHS3 Compliant 780-BFBGA 18 Weeks 250 30 1.2GHz USB 3.0 + PHY (2) ARM® Cortex®-A53 10GbE (2), 1GbE (8) 8 Core 64-Bit Yes DDR4 eMMC, I2C, IFC, PCI, SPI, UART Multimedia; NEON™ SIMD Secure Boot, TrustZone® LVDS SATA 6Gbps (1)
MPC866PVR100A MPC866PVR100A NXP Semiconductors
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 0 0x0x0 download MPC8xx 0°C~95°C TA Tray 3 (168 Hours) CMOS 2.52mm ROHS3 Compliant 1999 /files/nxpusainc-mpc866pcvr100a-datasheets-1602.pdf 357-BBGA 25mm 357 12 Weeks 3A991.A.2 8542.31.00.01 e1 Tin/Silver/Copper (Sn/Ag/Cu) YES BOTTOM BALL 245 1.8V 1.27mm MPC866 1.9V 1.7V 30 Microprocessors 1.83.3V S-PBGA-B357 100MHz MICROPROCESSOR, RISC 32 YES YES FIXED POINT YES 32 32 3.3V 10Mbps (4), 10/100Mbps (1) 1 Core 32-Bit No DRAM HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Communications; CPM
MPC860SRCVR66D4 MPC860SRCVR66D4 NXP USA Inc.
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 0 0x0x0 download MPC8xx -40°C~95°C TA Tray 3 (168 Hours) CMOS 2.52mm ROHS3 Compliant 1995 /files/nxpusainc-mpc855tczq50d4-datasheets-5903.pdf 357-BBGA 25mm 357 12 Weeks 3A991.A.2 8542.31.00.01 e1 TIN SILVER COPPER YES BOTTOM BALL 245 3.3V 1.27mm MPC860 3.465V 3.135V 30 S-PBGA-B357 66MHz MICROPROCESSOR, RISC 32 YES YES FIXED POINT YES 50MHz 32 32 3.3V 10Mbps (4) 1 Core 32-Bit No DRAM HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Communications; CPM
LS1088ASN7MQA LS1088ASN7MQA NXP USA Inc.
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 0 0x0x0 download QorIQ® Layerscape 0°C~105°C 3 (168 Hours) ROHS3 Compliant /files/nxpusainc-ls1088axe7q1a-datasheets-1332.pdf 780-BFBGA, FCBGA 18 Weeks 8542.39.00.01 250 30 1.2GHz USB 3.0 (2) + PHY ARM® Cortex®-A53 10GbE (2), 1GbE (8) 8 Core 64-Bit DDR4 Secure Boot, TrustZone® SATA 6Gbps (1)
MC68360ZQ33L MC68360ZQ33L NXP USA Inc.
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 0 0x0x0 download M683xx 0°C~70°C TA Tray 3 (168 Hours) CMOS 1.86mm Non-RoHS Compliant 1995 /files/nxpusainc-mc68360cai25l-datasheets-3855.pdf 357-BBGA 25mm 357 3A991.A.2 8542.31.00.01 e0 Tin/Lead (Sn/Pb) YES BOTTOM BALL 260 5V 1.27mm MC68360 5.25V 4.75V 40 S-PBGA-B357 33MHz SERIAL IO/COMMUNICATION CONTROLLER, SERIAL MC68040; MC68030 YES YES 25MHz 1.25 MBps 32 32 BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL CPU32+ 5.0V 10Mbps (1) 1 Core 32-Bit No DRAM SCC, SMC, SPI Communications; CPM
MPC8360CVVAGDGA MPC8360CVVAGDGA NXP USA Inc.
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 0 0x0x0 download MPC83xx -40°C~105°C TA Tray 3 (168 Hours) CMOS 1.69mm ROHS3 Compliant 2002 /files/nxpusainc-mpc8360evvalfha-datasheets-0732.pdf 740-LBGA 37.5mm 740 12 Weeks 3A991.A.2 8542.31.00.01 e2 TIN COPPER/TIN SILVER YES BOTTOM BALL 260 1.2V 1mm MPC8360 1.26V 1.14V 40 Microprocessors 1.8/2.53.3V S-PBGA-B740 400MHz MICROPROCESSOR, RISC 32 YES YES FLOATING POINT YES 66.67MHz 32 32 USB 1.x (1) PowerPC e300 1.8V 2.5V 3.3V 10/100/1000Mbps (1) 1 Core 32-Bit No DDR, DDR2 DUART, HDLC, I2C, PCI, SPI, UART Communications; QUICC Engine
MPC860ENCZQ66D4 MPC860ENCZQ66D4 NXP USA Inc.
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 0 0x0x0 download MPC8xx -40°C~95°C TA Tray 3 (168 Hours) CMOS 2.52mm Non-RoHS Compliant 1995 /files/nxpusainc-mpc855tczq50d4-datasheets-5903.pdf 357-BBGA 25mm 357 12 Weeks 3A991.A.2 8542.31.00.01 e0 Tin/Lead/Silver (Sn/Pb/Ag) YES BOTTOM BALL 245 3.3V 1.27mm MPC860 3.465V 3.135V 30 Microprocessors 3.3V S-PBGA-B357 66MHz MICROPROCESSOR, RISC 32 YES YES FIXED POINT YES 50MHz 32 32 3.3V 10Mbps (4) 1 Core 32-Bit No DRAM I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Communications; CPM
P2020NSN2HHC P2020NSN2HHC NXP USA Inc.
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 0 0x0x0 download QorIQ P2 0°C~125°C TA Tray 3 (168 Hours) CMOS 2.46mm ROHS3 Compliant 2002 /files/nxpusainc-mpc8314vragda-datasheets-9330.pdf 689-BBGA Exposed Pad 31mm 689 12 Weeks 3A991.A.2 8542.31.00.01 e2 TIN COPPER/TIN SILVER YES BOTTOM BALL 260 1.05V 1mm P2020 1.1V 1V 40 Microprocessors 1.05V S-PBGA-B689 1.2GHz MICROPROCESSOR, RISC 32 YES YES FLOATING POINT YES 100MHz 32 16 USB 2.0 + PHY (2) PowerPC e500v2 10/100/1000Mbps (3) 2 Core 32-Bit No DDR2, DDR3 DUART, I2C, MMC/SD, SPI
MPC860DTZQ80D4 MPC860DTZQ80D4 NXP USA Inc.
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 0 0x0x0 download MPC8xx 0°C~95°C TA Tray 3 (168 Hours) CMOS 2.52mm Non-RoHS Compliant 1995 /files/nxpusainc-mpc855tczq50d4-datasheets-5903.pdf 357-BBGA 25mm 357 8 Weeks 3A991.A.2 8542.31.00.01 e0 Tin/Lead (Sn/Pb) YES BOTTOM BALL 245 3.3V 1.27mm MPC860 3.465V 3.135V 30 Microprocessors 3.3V S-PBGA-B357 80MHz MICROPROCESSOR, RISC 32 YES YES FIXED POINT YES 50MHz 32 32 3.3V 10Mbps (2), 10/100Mbps (1) 1 Core 32-Bit No DRAM HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Communications; CPM
MPC8358ECVVAGDGA MPC8358ECVVAGDGA NXP USA Inc.
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 0 0x0x0 download MPC83xx -40°C~105°C TA Tray 3 (168 Hours) CMOS 1.69mm ROHS3 Compliant 2002 /files/nxpusainc-mpc8360evvalfha-datasheets-0732.pdf 740-LBGA 37.5mm 740 12 Weeks 5A002.A.1 8542.31.00.01 e2 TIN COPPER/TIN SILVER YES BOTTOM BALL 260 1.2V 1mm MPC8358 1.26V 1.14V 40 Microprocessors 1.8/2.53.3V S-PBGA-B740 400MHz MICROPROCESSOR, RISC 32 YES YES FLOATING POINT YES 66.67MHz 32 32 USB 1.x (1) PowerPC e300 1.8V 2.5V 3.3V 10/100/1000Mbps (1) 1 Core 32-Bit No DDR, DDR2 DUART, HDLC, I2C, PCI, SPI, UART Communications; QUICC Engine, Security; SEC Cryptography, Random Number Generator
MPC8360VVAJDGA MPC8360VVAJDGA NXP USA Inc.
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 0 0x0x0 download MPC83xx 0°C~105°C TA Tray 3 (168 Hours) CMOS 1.69mm ROHS3 Compliant 2002 /files/nxpusainc-mpc8360evvalfha-datasheets-0732.pdf 740-LBGA 37.5mm 740 12 Weeks 3A991.A.2 8542.31.00.01 e2 TIN COPPER/TIN SILVER YES BOTTOM BALL 260 1.3V 1mm MPC8360 1.35V 1.15V 40 Microprocessors 1.8/2.53.3V S-PBGA-B740 533MHz MICROPROCESSOR, RISC 32 YES YES FLOATING POINT YES 66.67MHz 32 32 USB 1.x (1) PowerPC e300 1.8V 2.5V 3.3V 10/100/1000Mbps (1) 1 Core 32-Bit No DDR, DDR2 DUART, HDLC, I2C, PCI, SPI, UART Communications; QUICC Engine
MPC860SRVR50D4R2 MPC860SRVR50D4R2 NXP USA Inc.
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 0 0x0x0 download MPC8xx 0°C~95°C TA Tape & Reel (TR) 3 (168 Hours) CMOS 2.52mm ROHS3 Compliant 1995 /files/nxpusainc-mpc855tczq50d4-datasheets-5903.pdf 357-BBGA 25mm 357 12 Weeks 3A991.A.2 8542.31.00.01 e1 Tin/Silver/Copper (Sn/Ag/Cu) YES BOTTOM BALL 245 3.3V 1.27mm MPC860 3.465V 3.135V 30 Microprocessors 3.3V S-PBGA-B357 50MHz MICROPROCESSOR, RISC 32 YES YES FIXED POINT YES 50MHz 32 32 3.3V 10Mbps (4) 1 Core 32-Bit No DRAM HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Communications; CPM
LS1088ASE7MQA LS1088ASE7MQA NXP USA Inc.
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 0 0x0x0 download QorIQ® Layerscape 0°C~105°C 3 (168 Hours) ROHS3 Compliant /files/nxpusainc-ls1088axe7q1a-datasheets-1332.pdf 780-BFBGA, FCBGA 18 Weeks 8542.39.00.01 250 30 1.2GHz USB 3.0 (2) + PHY ARM® Cortex®-A53 10GbE (2), 1GbE (8) 8 Core 64-Bit DDR4 Secure Boot, TrustZone® SATA 6Gbps (1)
MC68360AI25VL MC68360AI25VL NXP USA Inc.
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 0 0x0x0 download M683xx 0°C~70°C TA Tray 3 (168 Hours) ROHS3 Compliant 1995 /files/nxpusainc-mc68360cai25l-datasheets-3854.pdf 240-BFQFP 8 Weeks MC68360 25MHz CPU32+ 3.3V 10Mbps (1) 1 Core 32-Bit No DRAM SCC, SMC, SPI Communications; CPM
MPC860DPZQ66D4 MPC860DPZQ66D4 NXP USA Inc.
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 0 0x0x0 download MPC8xx 0°C~95°C TA Tray 3 (168 Hours) CMOS 2.52mm Non-RoHS Compliant 1995 /files/nxpusainc-mpc855tczq50d4-datasheets-5903.pdf 357-BBGA 25mm 357 12 Weeks 3A991.A.2 8542.31.00.01 e0 Tin/Lead (Sn/Pb) YES BOTTOM BALL 245 3.3V 1.27mm MPC860 3.465V 3.135V 30 Microprocessors 3.3V S-PBGA-B357 66MHz MICROPROCESSOR, RISC 32 YES YES FIXED POINT YES 50MHz 32 32 3.3V 10Mbps (2), 10/100Mbps (1) 1 Core 32-Bit No DRAM HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Communications; CPM
MC68360CVR25L MC68360CVR25L NXP USA Inc.
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 0 0x0x0 download M683xx -40°C~85°C TA Tray 3 (168 Hours) CMOS 2.52mm ROHS3 Compliant 1995 /files/nxpusainc-mc68360cai25l-datasheets-3855.pdf 357-BBGA 25mm 357 8 Weeks 3A991.A.2 8542.31.00.01 e1 Tin/Silver/Copper (Sn/Ag/Cu) YES BOTTOM BALL 260 1.27mm MC68360 40 S-PBGA-B357 25MHz SERIAL IO/COMMUNICATION CONTROLLER, LAN MC68040; MC68030 YES YES 25MHz 32 32 BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP CPU32+ 5.0V 10Mbps (1) 1 Core 32-Bit No DRAM SCC, SMC, SPI Communications; CPM
T1022NXE7PQB T1022NXE7PQB NXP USA Inc.
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 0 0x0x0 download QorIQ T1 -40°C~105°C TA 3 (168 Hours) CMOS 2.07mm ROHS3 Compliant 2014 /files/nxpusainc-t1022nxn7mqb-datasheets-1509.pdf 780-FBGA, FCBGA 23mm 780 18 Weeks 5A002.A.1 8542.31.00.01 YES BOTTOM BALL 1V 0.8mm 1.03V 0.97V S-PBGA-B780 1.4GHz MICROPROCESSOR, RISC 32 YES YES FIXED POINT YES 133.3MHz 16 64 USB 2.0 + PHY (2) PowerPC e5500 1Gbps (5) 2 Core 64-Bit No DDR3L, DDR4 I2C, MMC/SD, PCIe, SPI, UART Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA 3Gbps (2)
MPC866TVR100A MPC866TVR100A NXP USA Inc.
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 0 0x0x0 download MPC8xx 0°C~95°C TA Tray 3 (168 Hours) CMOS 2.52mm ROHS3 Compliant 1999 /files/nxpusainc-mpc866pcvr100a-datasheets-1602.pdf 357-BBGA 25mm 357 12 Weeks 3A991.A.2 8542.31.00.01 e1 Tin/Silver/Copper (Sn/Ag/Cu) YES BOTTOM BALL 245 1.8V 1.27mm MPC866 1.9V 1.7V 30 Microprocessors 1.83.3V S-PBGA-B357 100MHz MICROPROCESSOR, RISC 32 YES YES FIXED POINT YES 32 32 3.3V 10Mbps (4), 10/100Mbps (1) 1 Core 32-Bit No DRAM HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Communications; CPM
MPC860SRCZQ66D4 MPC860SRCZQ66D4 NXP USA Inc.
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 0 0x0x0 download MPC8xx -40°C~95°C TA Tray 3 (168 Hours) CMOS 2.52mm Non-RoHS Compliant 1995 /files/nxpusainc-mpc855tczq50d4-datasheets-5903.pdf 357-BBGA 25mm 357 12 Weeks 3A991.A.2 8542.31.00.01 e0 Tin/Lead (Sn/Pb) YES BOTTOM BALL 245 3.3V 1.27mm MPC860 3.465V 3.135V 30 Microprocessors 3.3V S-PBGA-B357 66MHz MICROPROCESSOR, RISC 32 YES YES FIXED POINT YES 50MHz 32 32 3.3V 10Mbps (4) 1 Core 32-Bit No DRAM HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Communications; CPM
MPC860SRCZQ50D4 MPC860SRCZQ50D4 NXP USA Inc.
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 0 0x0x0 download MPC8xx -40°C~95°C TA Tray 3 (168 Hours) CMOS 2.52mm Non-RoHS Compliant 1995 /files/nxpusainc-mpc855tczq50d4-datasheets-5903.pdf 357-BBGA 25mm 357 12 Weeks 3A991.A.2 8542.31.00.01 e0 Tin/Lead/Silver (Sn/Pb/Ag) YES BOTTOM BALL 245 3.3V 1.27mm MPC860 3.465V 3.135V 30 Microprocessors 3.3V S-PBGA-B357 50MHz MICROPROCESSOR, RISC 32 YES YES FIXED POINT YES 50MHz 32 32 3.3V 10Mbps (4) 1 Core 32-Bit No DRAM HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Communications; CPM
MPC860TCVR66D4 MPC860TCVR66D4 NXP USA Inc.
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 0 0x0x0 download MPC8xx -40°C~95°C TA Tray 3 (168 Hours) CMOS 2.52mm ROHS3 Compliant 1995 /files/nxpusainc-mpc855tczq50d4-datasheets-5903.pdf 357-BBGA 25mm 357 12 Weeks 3A991.A.2 8542.31.00.01 e1 TIN SILVER COPPER YES BOTTOM BALL 245 3.3V 1.27mm MPC860 3.465V 3.135V 30 Microprocessors 3.3V S-PBGA-B357 66MHz MICROPROCESSOR, RISC 32 YES YES FIXED POINT YES 50MHz 32 32 3.3V 10Mbps (4), 10/100Mbps (1) 1 Core 32-Bit No DRAM HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Communications; CPM
MPC860ENCVR50D4 MPC860ENCVR50D4 NXP USA Inc.
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 0 0x0x0 download MPC8xx -40°C~95°C TA Tray 3 (168 Hours) CMOS 2.52mm ROHS3 Compliant 1995 /files/nxpusainc-mpc855tczq50d4-datasheets-5903.pdf 357-BBGA 25mm 357 3A991.A.2 8542.31.00.01 e1 TIN SILVER COPPER YES BOTTOM BALL 245 3.3V 1.27mm MPC860 3.465V 3.135V 30 Microprocessors 3.3V S-PBGA-B357 50MHz MICROPROCESSOR, RISC 32 YES YES FIXED POINT YES 50MHz 32 32 3.3V 10Mbps (4) 1 Core 32-Bit No DRAM I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Communications; CPM
T1022NXE7WQB T1022NXE7WQB NXP USA Inc.
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 0 0x0x0 download QorIQ T1 -40°C~105°C TA 3 (168 Hours) CMOS 2.07mm ROHS3 Compliant 2014 /files/nxpusainc-t1022nxn7mqb-datasheets-1509.pdf 780-FBGA, FCBGA 23mm 780 18 Weeks 5A002.A.1 8542.31.00.01 YES BOTTOM BALL 250 1V 0.8mm 1.03V 0.97V S-PBGA-B780 1.5GHz MICROPROCESSOR, RISC 32 YES YES FIXED POINT YES 133.3MHz 16 64 USB 2.0 + PHY (2) PowerPC e5500 1Gbps (5) 2 Core 64-Bit No DDR3L, DDR4 I2C, MMC/SD, PCIe, SPI, UART Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA 3Gbps (2)
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