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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Lifecycle Status | Pbfree Code | Thickness | ECCN Code | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Voltage | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Memory Size | Number of Bits | Number of I/O | Memory Type | Core Architecture | RAM Size | Data Bus Width | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Number of UART Channels | RAM (words) | Bus Compatibility | Boundary Scan | Low Power Mode | Format | Integrated Cache | Number of Serial I/Os | Number of Timers | Access Time | Clock Frequency | Address Bus Width | External Data Bus Width | Number of Cores | USB | Core Processor | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | Additional Interfaces | Co-Processors/DSP | Security Features | Display & Interface Controllers | SATA |
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| MCIMX283CVM4C | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX28 | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mcimx283cvm4b-datasheets-2167.pdf | 289-LFBGA | 15 Weeks | 260 | MCIMX283 | 40 | 454MHz | USB 2.0 + PHY (2) | ARM926EJ-S | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LVDDR, LVDDR2, DDR2 | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | Data; DCP | Boot Security, Cryptography, Hardware ID | Keypad, LCD, Touchscreen | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX286DVM4C | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX28 | -20°C~70°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mcimx283cvm4b-datasheets-2167.pdf | 289-LFBGA | 15 Weeks | 260 | MCIMX286 | 40 | 454MHz | USB 2.0 + PHY (2) | ARM926EJ-S | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LVDDR, LVDDR2, DDR2 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | Data; DCP | Boot Security, Cryptography, Hardware ID | Keypad | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| OMAP3525ECBCA | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | OMAP-35xx | Surface Mount | -40°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | 600MHz | Non-RoHS Compliant | 515-VFBGA, FCBGA | 14mm | 950μm | 14mm | 1.35V | Lead Free | 515 | 16 Weeks | 515 | I2C, SPI, UART, USB | ACTIVE (Last Updated: 4 days ago) | 630μm | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.35V | BOTTOM | BALL | 260 | 0.5mm | OMAP3525 | 515 | NOT SPECIFIED | Graphics Processors | Not Qualified | 112kB | L2 Cache, ROM, SRAM | ARM | 64kB | 32b | MICROPROCESSOR, RISC | 3 | USB 1.x (3), USB 2.0 (1) | ARM® Cortex®-A8 | 1.8V 3.0V | 1 Core 32-Bit | Yes | LPDDR | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | ||||||||||||||||||||||||||||||||||||||||||||
| MIMX8MQ5CVAHZAB | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX8MQ | -40°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | 2.18mm | ROHS3 Compliant | /files/nxpusainc-mimx8md6cvahzaa-datasheets-9726.pdf | 621-FBGA, FCBGA | 17mm | 621 | 15 Weeks | YES | BOTTOM | BALL | 1V | 0.65mm | 1.05V | 0.9V | S-PBGA-B621 | 16 | 1.3GHz | 160K | ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB | YES | 40MHz | USB 3.0 (2) | ARM® Cortex®-A53 | GbE | 4 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | ARM® Cortex®-M4 | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 96MPCM-1.6-2M9T | Advantech Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sandy Bridge | Tray | 1 (Unlimited) | RoHS Compliant | https://pdf.utmel.com/r/datasheets/advantechcorp-96mpcm162m9t-datasheets-5397.pdf | 988-PGA Module | 13 Weeks | 988-PGA (37.5x37.5) | 1.6GHz | Celeron Mobile B810 | 2 Core 64-Bit | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Z0843006VSC | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tube | 3 (168 Hours) | NMOS | 4.57mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-z0843004vsc-datasheets-1038.pdf | 44-LCC (J-Lead) | 16.5862mm | 16.5862mm | 44 | no | e0 | TIN LEAD | YES | QUAD | J BEND | 240 | 5V | 1.27mm | 44 | COMMERCIAL | 70°C | 5.25V | 4.75V | NOT SPECIFIED | COMMERCIAL | S-PQCC-J44 | 8 | TIMER, PROGRAMMABLE | 1 | 6.17MHz | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6Y2DVK09AB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6 | 0°C~95°C TJ | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mcimx6y2dvm09ab-datasheets-1085.pdf | 272-LFBGA | 18 Weeks | 8542.39.00.01 | 260 | 40 | 900MHz | USB 2.0 OTG + PHY (2) | ARM® Cortex®-A7 | 1.8V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | CAN, I2C, SPI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 96MPI3-3.3-3M11T | Advantech Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sandy Bridge | Tray | 1 (Unlimited) | RoHS Compliant | https://pdf.utmel.com/r/datasheets/advantechcorp-96mpi3333m11t-datasheets-5347.pdf | 1155-LGA Module | 13 Weeks | 1155-FCLGA (37.5x37.5) | 3.3GHz | i3-2120 | 2 Core 64-Bit | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9328MXSVP10 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MXS | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 1994 | /files/nxpusainc-mc9328mxsvp10-datasheets-5400.pdf | 225-LFBGA | 13mm | 225 | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.8V | 0.8mm | MC9328MXS | 1.9V | 1.7V | 40 | S-PBGA-B225 | 100MHz | MICROPROCESSOR | 32 | YES | YES | FIXED POINT | NO | 16MHz | 25 | 32 | USB 1.x (1) | ARM920T | 1.8V 3.0V | 1 Core 32-Bit | No | SDRAM | I2C, I2S, SPI, SSI, UART | LCD | |||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6Y2CVM05AAR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6 | -40°C~105°C TJ | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.32mm | RoHS Compliant | 2015 | /files/nxpusainc-mcimx6y2cvm08ab-datasheets-3353.pdf | 289-LFBGA | 14mm | 289 | 52 Weeks | 5A992 | compliant | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 0.8mm | 1.5V | 1.275V | 40 | S-PBGA-B289 | 5 | 528MHz | 128000 | CAN; ETHERNET; I2C; I2S; IRDA; RS-232; RS-485; SPI; UART; USB | YES | 16 | 16 | USB 2.0 OTG + PHY (2) | ARM® Cortex®-A7 | 1.8V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | CAN, I2C, SPI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | |||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX257DJM4AR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX25 | -20°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2008 | /files/nxpusainc-mcimx258cjm4a-datasheets-9543.pdf | 400-LFBGA | 17mm | 400 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.45V | 0.8mm | 1.52V | 1.38V | 40 | Microprocessors | 1.2/1.51.8/3.3V | S-PBGA-B400 | 400MHz | MICROPROCESSOR | 32 | YES | YES | FIXED POINT | YES | 24MHz | 26 | 16 | USB 2.0 + PHY (2) | ARM926EJ-S | 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR, DDR2 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | Keypad, LCD, Touchscreen | ||||||||||||||||||||||||||||||||||||||||||||
| MCIMX283DVM4CR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX28 | -20°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mcimx280dvm4cr-datasheets-5304.pdf | 289-LFBGA | 2 Weeks | 454MHz | USB 2.0 + PHY (2) | ARM926EJ-S | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | DDR2, LVDDR, LVDDR2 | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | Data; DCP | Boot Security, Cryptography, Hardware ID | Keypad, LCD, Touchscreen | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MIMX8QM6AVUFFAB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | CMOS | 2.52mm | RoHS Compliant | 29mm | 29mm | 1313 | 8 Weeks | e3 | Tin (Sn) | YES | BOTTOM | BALL | 260 | 1.1V | 0.75mm | AUTOMOTIVE | 125°C | -40°C | 1.15V | 1.05V | 40 | S-PBGA-B1313 | 256000 | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | YES | 24MHz | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| OMAP3525ECUSA | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | OMAP-35xx | Surface Mount | -40°C~105°C TJ | Tray | 4 (72 Hours) | CMOS | 600MHz | ROHS3 Compliant | 423-LFBGA, FCBGA | 16mm | 1.4mm | 16mm | Lead Free | 423 | 6 Weeks | 1.35V | 985mV | 423 | I2C, SPI, UART, USB | ACTIVE (Last Updated: 1 week ago) | 960μm | No | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.35V | BOTTOM | BALL | 260 | 0.65mm | OMAP3525 | 423 | Graphics Processors | 112kB | L2 Cache, ROM, SRAM | ARM | 64kB | 32b | MICROPROCESSOR, RISC | 3 | USB 1.x (3), USB 2.0 (1) | ARM® Cortex®-A8 | 1.8V 3.0V | 1 Core 32-Bit | Yes | LPDDR | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | ||||||||||||||||||||||||||||||||||||||||||||
| GCIXP1240AB | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tray | 4 (72 Hours) | CMOS | 200MHz | 1.67mm | Non-RoHS Compliant | 2004 | /files/intel-gcixp1240aa-datasheets-5221.pdf | 432-LBGA | 40mm | 3.3V | 432 | 432 | 3A001.A.3 | 8542.31.00.01 | 3.3V | BOTTOM | BALL | 225 | 2V | 1.27mm | 432 | MICROPROCESSOR, RISC | 32 | YES | NO | FIXED POINT | YES | 200 μs | 32 | 32 | StrongARM | 1 Core 32-Bit | No | SDRAM | Data; Microengine | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM5K2E04XABDA25 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | Surface Mount | -40°C~100°C TC | Tray | 4 (72 Hours) | CMOS | 1.25GHz | 3.55mm | ROHS3 Compliant | /files/texasinstruments-am5k2e04xabda4-datasheets-1019.pdf | 1089-BFBGA, FCBGA | 27mm | 27mm | Lead Free | 12 Weeks | 1089 | Ethernet, I2C, SPI, UART, USB | ACTIVE (Last Updated: 3 days ago) | yes | 2.98mm | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1V | 0.8mm | AM5K2E04 | 1.05V | 0.95V | ARM | 2MB | 72b | MICROPROCESSOR, RISC | 2 | YES | YES | FLOATING POINT | YES | 4 | USB 3.0 (2) | ARM® Cortex®-A15 | 1.35V 1.5V 1.8V 3.3V | 1GBE (8), 10GBE (2) | 4 Core 32-Bit | No | DDR3, SRAM | EBI/EMI, I2C, PCIe, SPI, TSIP, UART, USIM | Network | ||||||||||||||||||||||||||||||||||||||||||||
| MCIMX280CVM4BR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX28 | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.37mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx283cvm4b-datasheets-2170.pdf | 289-LFBGA | 14mm | 289 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 0.8mm | MCIMX280 | 1.55V | 1.35V | 40 | Microprocessors | 1.41.8V | S-PBGA-B289 | 454MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FIXED POINT | YES | 24MHz | USB 2.0 + PHY (2) | ARM926EJ-S | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LVDDR, LVDDR2, DDR2 | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | Data; DCP | Boot Security, Cryptography, Hardware ID | Keypad | ||||||||||||||||||||||||||||||||||||||||||||
| OMAP3530ECBBLPD | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | OMAP-35xx | 0°C~90°C TJ | Tray | 3 (168 Hours) | CMOS | 600MHz | ROHS3 Compliant | /files/texasinstruments-omap3530ecbbalpd-datasheets-4976.pdf | 515-VFBGA, FCBGA | 12mm | 900μm | 12mm | Lead Free | 515 | 6 Weeks | 515 | ACTIVE (Last Updated: 1 week ago) | yes | 610μm | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.35V | 0.5mm | OMAP3530 | 515 | NOT SPECIFIED | ARM | MICROPROCESSOR, RISC | 3 | YES | YES | FIXED POINT | YES | 1 | USB 1.x (3), USB 2.0 (1) | ARM® Cortex®-A8 | 1.8V 3.0V | 1 Core 32-Bit | Yes | LPDDR | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | |||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6Y0CVM05AB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6 | -40°C~105°C TJ | Tray | 3 (168 Hours) | ROHS3 Compliant | 2015 | /files/nxpusainc-mcimx6y2cvm08ab-datasheets-3353.pdf | 289-LFBGA | 18 Weeks | 8542.39.00.01 | 260 | 528MHz | USB 2.0 OTG + PHY (1) | ARM® Cortex®-A7 | 1.8V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | I2C, SPI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6G0DVM05AB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6UL | 0°C~95°C TJ | Tray | 3 (168 Hours) | CMOS | 1.32mm | ROHS3 Compliant | 2016 | /files/nxpusainc-mcimx6g3cvm05ab-datasheets-3328.pdf | 289-LFBGA | 14mm | 289 | 15 Weeks | 5A992 | 8542.31.00.01 | YES | BOTTOM | BALL | 0.8mm | 1.3V | 1.15V | S-PBGA-B289 | 528MHz | MICROPROCESSOR | YES | YES | FIXED POINT | YES | 26 | 16 | USB 2.0 + PHY (1) | ARM® Cortex®-A7 | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LVDS | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX250DJM4AR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX25 | Tray | 3 (168 Hours) | ROHS3 Compliant | 400-LFBGA | 15 Weeks | 400MHz | ARM926EJ-S | 1 Core 32-Bit | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6Y0DVM05AA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6 | 0°C~95°C TJ | Tray | 3 (168 Hours) | CMOS | 1.32mm | RoHS Compliant | 2015 | 289-LFBGA | 14mm | 289 | 26 Weeks | 5A992 | compliant | 8542.31.00.01 | YES | BOTTOM | BALL | 0.8mm | 1.5V | 1.275V | 125mA | S-PBGA-B289 | 528MHz | MICROPROCESSOR, RISC | ETHERNET, I2C, PCI, SPI, UART, USB | YES | 4 | 528MHz | 16 | 16 | USB 2.0 OTG + PHY (1) | ARM® Cortex®-A7 | 1.8V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | I2C, SPI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6Y7DVM09AB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6 | 0°C~95°C TJ | Tray | 3 (168 Hours) | ROHS3 Compliant | 2015 | /files/nxpusainc-mcimx6y2dvm09ab-datasheets-1085.pdf | 289-LFBGA | 18 Weeks | 8542.39.00.01 | 260 | 40 | 900MHz | USB 2.0 OTG + PHY (2) | ARM® Cortex®-A7 | 1.8V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | CAN, I2C, SPI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM5718AABCXEQ1 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | -40°C~125°C TJ | 3 | CMOS | ROHS3 Compliant | 760-BFBGA, FCBGA | 23mm | 2.96mm | 23mm | 760 | 12 Weeks | 760 | ACTIVE (Last Updated: 1 week ago) | yes | 2.39mm | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 1.15V | 0.8mm | AM5718 | 1.2V | 1.11V | 1.5GHz | MICROPROCESSOR, RISC | 10 | 524288 | YES | YES | FIXED POINT | NO | 38.4MHz | USB 2.0 (1), USB 3.0 (1) | ARM® Cortex®-A15 | 1.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | DDR3, SRAM | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | Multimedia; GPU, IPU, VFP | HDMI, LCD | SATA 3Gbps (1) | |||||||||||||||||||||||||||||||||||||||||||||||
| AM5716AABCXEQ1 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | -40°C~125°C TJ | 3 | CMOS | ROHS3 Compliant | 760-BFBGA, FCBGA | 23mm | 2.96mm | 23mm | 760 | 12 Weeks | 760 | ACTIVE (Last Updated: 1 week ago) | yes | 2.39mm | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 1.15V | 0.8mm | AM5716 | 1.2V | 1.11V | 1.5GHz | MICROPROCESSOR, RISC | 10 | YES | YES | FIXED POINT | NO | 38.4MHz | USB 2.0 (1), USB 3.0 (1) | ARM® Cortex®-A15 | 1.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | DDR3, SRAM | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | Multimedia; GPU, IPU, VFP | SATA 3Gbps (1) | |||||||||||||||||||||||||||||||||||||||||||||||||
| 96MPXE-1.8-15M13T | Advantech Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sandy Bridge-EN | Tray | 1 (Unlimited) | RoHS Compliant | https://pdf.utmel.com/r/datasheets/advantechcorp-96mpxe1815m13t-datasheets-5297.pdf | 1356-LGA Module | 13 Weeks | 1356-LGA | 1.8GHz | Xeon E5-2428L | 6 Core 64-Bit | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CP80C88-2Z | Renesas Electronics America Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 0°C~70°C TA | Tube | 1 (Unlimited) | CMOS | 6.35mm | ROHS3 Compliant | /files/renesaselectronicsamericainc-cp80c882z-datasheets-5343.pdf&product=renesaselectronicsamericainc-cp80c882z-4783691 | 40-DIP (0.600, 15.24mm) | 51.75mm | 40 | 9 Weeks | 8542.31.00.01 | e3 | Matte Tin (Sn) - annealed | NO | DUAL | THROUGH-HOLE | 5V | 2.54mm | 40 | 5.5V | 4.5V | R-PDIP-T40 | 8MHz | MICROPROCESSOR | 16 | NO | YES | FIXED POINT | NO | 20 | 8 | 80C88 | 5.0V | 1 Core 16-Bit | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MIMXRT106CDVL6A | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 2 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| OMAP3525ECUS | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | OMAP-35xx | Surface Mount | 0°C~90°C TJ | Tray | 4 (72 Hours) | CMOS | 600MHz | ROHS3 Compliant | 423-LFBGA, FCBGA | 16mm | 1.4mm | 16mm | Lead Free | 423 | 6 Weeks | 1.35V | 985mV | 423 | I2C, SPI, UART, USB | ACTIVE (Last Updated: 2 weeks ago) | 960μm | No | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.35V | BOTTOM | BALL | 260 | 0.65mm | OMAP3525 | 423 | Graphics Processors | 112kB | L2 Cache, ROM, SRAM | ARM | 64kB | 32b | MICROPROCESSOR, RISC | 3 | USB 1.x (3), USB 2.0 (1) | ARM® Cortex®-A8 | 1.8V 3.0V | 1 Core 32-Bit | Yes | LPDDR | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | ||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6Y7DVK05AB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6 | 0°C~95°C TJ | Tray | 3 (168 Hours) | ROHS3 Compliant | 2015 | /files/nxpusainc-mcimx6y2dvm09ab-datasheets-1085.pdf | 272-LFBGA | 18 Weeks | 8542.39.00.01 | 260 | 40 | 528MHz | USB 2.0 OTG + PHY (2) | ARM® Cortex®-A7 | 1.8V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | CAN, I2C, SPI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD |
