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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Lifecycle Status | Pbfree Code | Thickness | ECCN Code | Contact Plating | Radiation Hardening | Manufacturer Package Identifier | HTS Code | JESD-609 Code | Terminal Finish | Voltage | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Oscillator Type | Number of I/O | Memory Type | Core Architecture | RAM Size | Data Bus Width | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | ROM Programmability | Number of Timers/Counters | CPU Family | Number of UART Channels | RAM (words) | Bus Compatibility | Boundary Scan | Low Power Mode | Format | Integrated Cache | Number of Timers | Clock Frequency | Address Bus Width | External Data Bus Width | Barrel Shifter | Internal Bus Architecture | Number of Cores | USB | Core Processor | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | Additional Interfaces | Co-Processors/DSP | Security Features | Display & Interface Controllers | SATA |
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| OMAPL137DZKBT3 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | OMAP-L1x | Surface Mount | -40°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 375MHz | ROHS3 Compliant | /files/texasinstruments-omapl137dzkb3-datasheets-2583.pdf | 256-BGA | 17mm | 2.05mm | 17mm | Lead Free | 256 | 6 Weeks | 1.32V | 1.14V | 256 | Ethernet, I2C, SPI, UART, USB | ACTIVE (Last Updated: 6 days ago) | yes | 1.36mm | Copper, Silver, Tin | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | OMAPL137 | Other Microprocessor ICs | 32kB | Cache, FLASH | ARM | 128kB | 16b | DIGITAL SIGNAL PROCESSOR, OTHER | 3 | YES | YES | FLOATING POINT | YES | 3 | NO | SINGLE | 1 | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | ARM926EJ-S | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | HPI, I2C, McASP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | LCD | |||||||||||||||||||||||||||||||||||||||||
| MIMX8MN1DVTJZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX8MN | 0°C~95°C TJ | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mimx8mn2dvtjzaa-datasheets-6389.pdf | 486-LFBGA | 2 Weeks | 1.5GHz | USB 2.0 + PHY (2) | ARM® Cortex®-A53 | GbE | 1 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | I2C, PCIe, SDHC, SPI, UART | ARM® Cortex®-M7 | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | LCD, MIPI-CSI, MIPI-DSI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX281AVM4B | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX28 | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.37mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx285avm4b-datasheets-6456.pdf | 289-LFBGA | 14mm | 289 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.5V | 0.8mm | MCIMX281 | 1.55V | 1.35V | 40 | Microprocessors | 1.41.8V | S-PBGA-B289 | AEC-Q100 | 454MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FIXED POINT | YES | 24MHz | USB 2.0 + PHY (2) | ARM926EJ-S | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LVDDR, LVDDR2, DDR2 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | Data; DCP | Boot Security, Cryptography, Hardware ID | Keypad | ||||||||||||||||||||||||||||||||||||||||||||||||
| OMAPL137DZKB4 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | OMAP-L1x | Surface Mount | 0°C~90°C TJ | Tray | 3 (168 Hours) | CMOS | 456MHz | ROHS3 Compliant | /files/texasinstruments-omapl137dzkb3-datasheets-2583.pdf | 256-BGA | 17mm | 2.05mm | 17mm | 1.32V | Lead Free | 256 | 6 Weeks | 1.35V | 1.14V | 256 | SPI, USB | ACTIVE (Last Updated: 6 days ago) | yes | 1.36mm | Copper, Silver, Tin | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.3V | OMAPL137 | Other Microprocessor ICs | 64kB | External | 28 | Cache, SRAM | ARM | 128kB | 16b | DIGITAL SIGNAL PROCESSOR, OTHER | 3 | YES | YES | FLOATING POINT | YES | 3 | NO | SINGLE | 1 | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | ARM926EJ-S | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | HPI, I2C, McASP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | LCD | ||||||||||||||||||||||||||||||||||||||
| MIMX8MN6DVTJZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX8MN | 0°C~95°C TJ | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mimx8mn2dvtjzaa-datasheets-6389.pdf | 486-LFBGA | 2 Weeks | 1.5GHz | USB 2.0 + PHY (2) | ARM® Cortex®-A53 | GbE | 1 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | I2C, PCIe, SDHC, SPI, UART | ARM® Cortex®-M7 | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | LCD, MIPI-CSI, MIPI-DSI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX257CJM4AR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX25 | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2008 | /files/nxpusainc-mcimx258cjm4a-datasheets-9543.pdf | 400-LFBGA | 17mm | 400 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.45V | 0.8mm | 1.52V | 1.38V | 40 | S-PBGA-B400 | 400MHz | MICROPROCESSOR | 32 | YES | YES | FIXED POINT | YES | 24MHz | 26 | 16 | USB 2.0 + PHY (2) | ARM926EJ-S | 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR, DDR2 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | Keypad, LCD, Touchscreen | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| LS1012AXN7EKB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QorIQ® Layerscape | -40°C~105°C | 3 (168 Hours) | ROHS3 Compliant | 2016 | /files/nxpusainc-ls1012ase7hkb-datasheets-9707.pdf | 211-VFLGA | 24 Weeks | 600MHz | USB 2.0 (1), USB 3.0 + PHY | ARM® Cortex®-A53 | GbE (2) | 1 Core 64-Bit | DDR3L | Secure Boot, TrustZone® | SATA 6Gbps (1) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LS1012ASN7HKA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QorIQ® Layerscape | 0°C~105°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2016 | /files/nxpusainc-ls1012ase7hkb-datasheets-9707.pdf | 211-VFLGA | 24 Weeks | 800MHz | USB 2.0 (1), USB 3.0 + PHY | ARM® Cortex®-A53 | GbE (2) | 1 Core 64-Bit | DDR3L | Secure Boot, TrustZone® | SATA 6Gbps (1) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MVF51NN151CMK50 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Vybrid, VF5xx | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | /files/nxpusainc-mvf51ns151cmk50-datasheets-0241.pdf&product=nxpusainc-mvf51nn151cmk50-4781765 | 364-LFBGA | 17mm | 364 | 15 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.23V | 0.8mm | MVF51NN151 | 1.26V | 1.16V | 40 | Microcontrollers | 3.3V | 850mA | Not Qualified | S-PBGA-B364 | 131 | 500MHz | MICROCONTROLLER, RISC | 16 | YES | YES | NO | YES | FLASH | CORTEX-A5 | 16 | 16 | USB 2.0 OTG + PHY (1) | ARM® Cortex®-A5 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | DCU, GPU, LCD, VideoADC, VIU | |||||||||||||||||||||||||||||||||||||||||||||
| MCIMX7D2DVM12SD | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX7D | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.42mm | ROHS3 Compliant | 2012 | /files/nxpusainc-mcimx7d3evk10sd-datasheets-0350.pdf | 541-LFBGA | 19mm | 541 | 16 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | 260 | 1.225V | 0.75mm | 1.25V | 1.2V | 40 | S-PBGA-B541 | 1.2GHz | MICROPROCESSOR, RISC | 32 | YES | YES | FLOATING POINT | YES | 16 | 32 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ARM® Cortex®-A7, ARM® Cortex®-M4 | 1.8V 3.3V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM3357BZCZA30 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | -40°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | 300MHz | ROHS3 Compliant | /files/texasinstruments-am3352bzczd60-datasheets-2023.pdf | 324-LFBGA | 15mm | 1.4mm | 15mm | 1.1V | Lead Free | 324 | 6 Weeks | 1.713814g | 324 | CAN, Ethernet, I2C, SPI, UART, USB | ACTIVE (Last Updated: 1 week ago) | yes | 900μm | 5A992.C | Copper, Silver, Tin | No | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.144V | YES | BOTTOM | BALL | 260 | 1.1V | 0.8mm | AM3357 | Microprocessors | 400mA | Cache, RAM, ROM | ARM | 64kB | 32b | MICROPROCESSOR, RISC | 32 | 6 | YES | YES | FIXED POINT | YES | 1 | USB 2.0 + PHY (2) | ARM® Cortex®-A8 | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | Cryptography, Random Number Generator | LCD, Touchscreen | ||||||||||||||||||||||||||||||||||||||
| MCIMX285AVM4B | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX28 | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.37mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx285avm4b-datasheets-6456.pdf | 289-LFBGA | 14mm | 289 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.5V | 0.8mm | MCIMX285 | 1.55V | 1.35V | 40 | Microprocessors | 1.41.8V | S-PBGA-B289 | AEC-Q100 | 454MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FIXED POINT | YES | 24MHz | USB 2.0 + PHY (2) | ARM926EJ-S | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LVDDR, LVDDR2, DDR2 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | Data; DCP | Boot Security, Cryptography, Hardware ID | Keypad, LCD, Touchscreen | ||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8347VVAGDB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC83xx | 0°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.69mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mpc8347vvajfb-datasheets-9350.pdf | 620-BBGA Exposed Pad | 35mm | 672 | 12 Weeks | 3A991.A.2 | 8542.31.00.01 | e2 | TIN COPPER/TIN SILVER | YES | BOTTOM | BALL | 260 | 1.2V | 1mm | MPC8347 | 1.26V | 1.14V | 40 | Microprocessors | 1.2V | S-PBGA-B672 | 400MHz | MICROPROCESSOR | 32 | YES | YES | FLOATING POINT | YES | 66MHz | 32 | 32 | USB 2.0 + PHY (2) | PowerPC e300 | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | DUART, I2C, PCI, SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||
| AM3356BZCZA80 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | -40°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | 800MHz | ROHS3 Compliant | /files/texasinstruments-am3352bzczd60-datasheets-2023.pdf | 324-LFBGA | 15mm | 1.4mm | 15mm | 1.26V | Lead Free | 324 | 6 Weeks | 1.713814g | 324 | CAN, Ethernet, I2C, SPI, UART, USB | ACTIVE (Last Updated: 3 days ago) | yes | 900μm | 5A992.C | No | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.144V | YES | BOTTOM | BALL | 260 | 1.26V | 0.8mm | AM3356 | Microprocessors | 400mA | L2 Cache, RAM, ROM | ARM | 64kB | 32b | MICROPROCESSOR, RISC | 32 | 6 | YES | YES | FIXED POINT | YES | 1 | USB 2.0 + PHY (2) | ARM® Cortex®-A8 | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | Cryptography, Random Number Generator | LCD, Touchscreen | |||||||||||||||||||||||||||||||||||||||
| MCIMX502CVM8B | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX50 | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2008 | /files/nxpusainc-mcimx502cvm8b-datasheets-6298.pdf | 400-LFBGA | 17mm | 400 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.225V | 0.8mm | MCIMX502 | 1.275V | 1.175V | 40 | 628mA | Not Qualified | S-PBGA-B400 | 800MHz | MICROPROCESSOR CIRCUIT | 131072 | YES | 800MHz | USB 2.0 + PHY (2) | ARM® Cortex®-A8 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, LPDDR2, DDR2 | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | Boot Security, Cryptography, Secure JTAG | LCD | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM4376BZDND80 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | Surface Mount | -40°C~90°C TJ | Tray | 3 (168 Hours) | CMOS | 800MHz | ROHS3 Compliant | 491-LFBGA | 17mm | 1.3mm | 17mm | Lead Free | 491 | 6 Weeks | 491 | CAN, I2C, SPI, UART | ACTIVE (Last Updated: 3 days ago) | yes | 900μm | 5A992.C | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.26V | AM4376 | 491 | ARM | 64kB | 32b | MICROPROCESSOR, RISC | 32 | 6 | YES | YES | FLOATING POINT | YES | 1 | USB 2.0 + PHY (2) | ARM® Cortex®-A9 | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | Crypto Accelerator | TSC, WXGA | ||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6G2CVK05AB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6UL | -40°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | 1.23mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6g3cvm05ab-datasheets-3328.pdf | 272-LFBGA | 9mm | 272 | 12 Weeks | 8542.39.00.01 | YES | BOTTOM | BALL | 260 | 0.5mm | 1.3V | 1.15V | 40 | S-PBGA-B272 | 10 | 528MHz | 128000 | I2C; USB | YES | 16 | 16 | USB 2.0 + PHY (2) | ARM® Cortex®-A7 | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LCD, LVDS | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX257CJN4A | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX25 | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.52mm | ROHS3 Compliant | 2005 | /files/nxpusainc-mcimx258cjm4a-datasheets-9543.pdf | 347-LFBGA | 12mm | 347 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.45V | 0.5mm | MCIMX257 | 1.52V | 1.38V | 40 | Microprocessors | 1.2/1.51.8/3.3V | S-PBGA-B347 | 6 | 400MHz | MICROPROCESSOR | 32 | 128000 | I2C; USB | YES | YES | FIXED POINT | YES | 24MHz | 26 | 16 | USB 2.0 + PHY (2) | ARM926EJ-S | 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR, DDR2 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | Keypad, LCD, Touchscreen | ||||||||||||||||||||||||||||||||||||||||||||||
| ATSAMA5D44B-CUR | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SAMA5D4 | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.2mm | ROHS3 Compliant | 2017 | 361-TFBGA | 16mm | 361 | 12 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | 1.26V | 0.8mm | ATSAMA5D44 | 1.32V | 1.16V | S-PBGA-B361 | TS 16949 | 600MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FLOATING POINT | YES | 26 | 32 | USB 2.0 (3) | ARM® Cortex®-A5 | 1.2V 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, LPDDR2, DDR2 | EBI, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART | Multimedia; NEON™ SIMD | AES, SHA, TDES, TRNG | LCD, Touchscreen | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM1808EZCE3 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | 0°C~90°C TJ | Tray | 3 (168 Hours) | CMOS | 375MHz | ROHS3 Compliant | /files/texasinstruments-am1808ezwtd4-datasheets-2590.pdf | 361-LFBGA | 13mm | 1.3mm | 13mm | Lead Free | 361 | 6 Weeks | 361 | I2C, SPI, UART, USB | ACTIVE (Last Updated: 1 week ago) | yes | 890μm | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.2V | 0.65mm | AM1808 | 64kB | ARM | 8kB | 32b | MICROPROCESSOR, RISC | 32 | 3 | YES | YES | FIXED POINT | YES | 1 | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | ARM926EJ-S | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | LCD | SATA 3Gbps (1) | ||||||||||||||||||||||||||||||||||||||||||||||
| AM3352BZCED60 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | -40°C~90°C TJ | Tube | 3 (168 Hours) | CMOS | 600MHz | ROHS3 Compliant | /files/texasinstruments-am3352bzczd60-datasheets-2023.pdf | 298-LFBGA | 13mm | 1.3mm | 13mm | 1.1V | Lead Free | 298 | 6 Weeks | 298 | CAN, Ethernet, I2C, SPI, UART, USB | ACTIVE (Last Updated: 5 days ago) | yes | 890μm | 5A992.C | Copper, Silver, Tin | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.144V | YES | BOTTOM | BALL | 260 | 1.1V | AM3352 | NOT SPECIFIED | Microprocessors | 400mA | Not Qualified | 64kB | ROM | ARM | 64kB | 32b | MICROPROCESSOR, RISC | 32 | 10 | 6 | YES | YES | FIXED POINT | YES | 1 | USB 2.0 + PHY (2) | ARM® Cortex®-A8 | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | Cryptography, Random Number Generator | LCD, Touchscreen | |||||||||||||||||||||||||||||||||||||
| AM4376BZDN80 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | Surface Mount | 0°C~90°C TJ | Tray | 3 (168 Hours) | CMOS | 800MHz | ROHS3 Compliant | 491-LFBGA | 17mm | 1.3mm | 17mm | Lead Free | 491 | 6 Weeks | 491 | CAN, I2C, SPI, UART | ACTIVE (Last Updated: 4 days ago) | yes | 900μm | 5A992.C | Copper, Silver, Tin | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.26V | AM4376 | 491 | ARM | 64kB | 32b | MICROPROCESSOR, RISC | 32 | 6 | YES | YES | FLOATING POINT | YES | 1 | USB 2.0 + PHY (2) | ARM® Cortex®-A9 | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | Crypto Accelerator | TSC, WXGA | |||||||||||||||||||||||||||||||||||||||||||||||
| MIMX8MN2DVTJZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX8MN | 0°C~95°C TJ | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mimx8mn2dvtjzaa-datasheets-6389.pdf | 486-LFBGA | 2 Weeks | 1.5GHz | USB 2.0 + PHY (2) | ARM® Cortex®-A53 | GbE | 1 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | I2C, PCIe, SDHC, SPI, UART | ARM® Cortex®-M7 | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | LCD, MIPI-CSI, MIPI-DSI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM3352BZCEA60 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | -40°C~105°C TJ | Tube | 3 (168 Hours) | CMOS | 600MHz | ROHS3 Compliant | /files/texasinstruments-am3352bzczd60-datasheets-2023.pdf | 298-LFBGA | 13mm | 1.3mm | 13mm | 1.1V | Lead Free | 298 | 6 Weeks | 298 | CAN, Ethernet, I2C, SPI, UART, USB | ACTIVE (Last Updated: 5 days ago) | yes | 890μm | 5A992.C | Copper, Silver, Tin | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.144V | YES | BOTTOM | BALL | 260 | 1.1V | AM3352 | NOT SPECIFIED | Microprocessors | 400mA | Not Qualified | 64kB | ROM | ARM | 64kB | 32b | MICROPROCESSOR, RISC | 32 | 10 | 6 | YES | YES | FIXED POINT | YES | 1 | USB 2.0 + PHY (2) | ARM® Cortex®-A8 | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | Cryptography, Random Number Generator | LCD, Touchscreen | |||||||||||||||||||||||||||||||||||||
| MCIMX7U5DVK07SC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX7ULP | 0°C~95°C | 3 (168 Hours) | /files/nxpusainc-mcimx7u3dvk07sc-datasheets-6184.pdf | 16 Weeks | 720MHz | USB 2.0 (2) | ARM® Cortex®-A7 | 1 Core 32-Bit | Yes | LPDDR2, LPDDR3 | FlexIO, GPIO, I2C, I2S, SPI, UART | ARM® Cortex®-M4 | Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot | MIPI-DSI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM4378BZDNA100 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | Surface Mount | -40°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | 1GHz | ROHS3 Compliant | 491-LFBGA | 17mm | 1.3mm | 17mm | Lead Free | 491 | 6 Weeks | 491 | CAN, I2C, SPI, UART | ACTIVE (Last Updated: 1 day ago) | yes | 900μm | 5A992.C | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.325V | AM4378 | 491 | ARM | 64kB | 32b | MICROPROCESSOR, RISC | 32 | 6 | YES | YES | FLOATING POINT | YES | 1 | USB 2.0 + PHY (2) | ARM® Cortex®-A9 | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DDR3L | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | Crypto Accelerator | TSC, WXGA | ||||||||||||||||||||||||||||||||||||||||||||||||
| AM1806EZWT4 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | 0°C~90°C TJ | Tray | 3 (168 Hours) | CMOS | 456MHz | ROHS3 Compliant | /files/texasinstruments-am1806ezce4-datasheets-6207.pdf | 361-LFBGA | 16mm | 1.4mm | 16mm | Lead Free | 361 | 6 Weeks | 361 | ACTIVE (Last Updated: 1 week ago) | yes | 900μm | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.3V | 0.8mm | AM1806 | ARM | MICROPROCESSOR, RISC | 32 | 3 | YES | YES | FIXED POINT | YES | 1 | USB 2.0 + PHY (1) | ARM926EJ-S | 1.8V 3.3V | 1 Core 32-Bit | No | LPDDR, DDR2 | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | LCD | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM3356BZCZA60 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | Surface Mount | -40°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | 600MHz | ROHS3 Compliant | /files/texasinstruments-am3352bzczd60-datasheets-2023.pdf | 324-LFBGA | 15mm | 1.4mm | 15mm | 1.1V | Lead Free | 324 | 8 Weeks | 1.713814g | 324 | CAN, Ethernet, I2C, SPI, UART, USB | ACTIVE (Last Updated: 1 week ago) | yes | 900μm | 5A992.C | Copper, Silver, Tin | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.144V | BOTTOM | BALL | 260 | 1.1V | 0.8mm | AM3356 | NOT SPECIFIED | Microprocessors | 400mA | Not Qualified | L2 Cache, RAM, ROM | ARM | 64kB | 32b | MICROPROCESSOR, RISC | 32 | 6 | YES | YES | FIXED POINT | YES | 1 | USB 2.0 + PHY (2) | ARM® Cortex®-A8 | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | Cryptography, Random Number Generator | LCD, Touchscreen | |||||||||||||||||||||||||||||||||||||
| AM1806EZCEA3 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | -40°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | 375MHz | ROHS3 Compliant | /files/texasinstruments-am1806ezce4-datasheets-6207.pdf | 361-LFBGA | 13mm | 1.3mm | 13mm | Lead Free | 361 | 12 Weeks | 361 | ACTIVE (Last Updated: 1 week ago) | yes | 890μm | LFBGA-361 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.2V | 0.65mm | AM1806 | ARM | MICROPROCESSOR, RISC | 32 | 3 | YES | YES | FIXED POINT | YES | 1 | USB 2.0 + PHY (1) | ARM926EJ-S | 1.8V 3.3V | 1 Core 32-Bit | No | LPDDR, DDR2 | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | LCD | |||||||||||||||||||||||||||||||||||||||||||||||||||
| AM3356BZCZA30 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | -40°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | 300MHz | ROHS3 Compliant | /files/texasinstruments-am3352bzczd60-datasheets-2023.pdf | 324-LFBGA | 15mm | 1.4mm | 15mm | 1.1V | Lead Free | 324 | 6 Weeks | 1.713814g | 324 | CAN, Ethernet, I2C, SPI, UART, USB | ACTIVE (Last Updated: 2 weeks ago) | yes | 900μm | 5A992.C | Copper, Silver, Tin | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.144V | YES | BOTTOM | BALL | 260 | 1.1V | 0.8mm | AM3356 | NOT SPECIFIED | Microprocessors | 400mA | Not Qualified | L2 Cache, RAM, ROM | ARM | 64kB | 32b | MICROPROCESSOR, RISC | 32 | 6 | YES | YES | FIXED POINT | YES | 1 | USB 2.0 + PHY (2) | ARM® Cortex®-A8 | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | Cryptography, Random Number Generator | LCD, Touchscreen |
