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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | REACH SVHC | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Lifecycle Status | Pbfree Code | Thickness | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Voltage | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | Max Junction Temperature (Tj) | Ambient Temperature Range High | JESD-30 Code | Supplier Device Package | Memory Size | Number of ADC Channels | Oscillator Type | Number of I/O | Memory Type | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Watchdog Timer | Number of Timers/Counters | Number of SPI Channels | Number of UART Channels | RAM (words) | Bus Compatibility | Boundary Scan | Low Power Mode | Format | Integrated Cache | Number of External Interrupts | Number of Serial I/Os | Number of PWM Channels | On Chip Data RAM Width | Number of DMA Channels | Number of I2C Channels | Clock Frequency | Address Bus Width | External Data Bus Width | Barrel Shifter | Internal Bus Architecture | Number of Cores | USB | Core Processor | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | Additional Interfaces | Co-Processors/DSP | Security Features | Display & Interface Controllers | SATA | Number of Ethernet Channels |
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| MCIMX257DJM4A | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX25 | -20°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2005 | /files/nxpusainc-mcimx258cjm4a-datasheets-9543.pdf&product=nxpusainc-mcimx257djm4a-4781436 | 400-LFBGA | 17mm | 400 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.45V | 0.8mm | MCIMX257 | 1.52V | 1.38V | 40 | Microprocessors | 1.2/1.51.8/3.3V | S-PBGA-B400 | 400MHz | MICROPROCESSOR | 32 | YES | YES | FIXED POINT | YES | 24MHz | 26 | 16 | USB 2.0 + PHY (2) | ARM926EJ-S | 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR, DDR2 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | Keypad, LCD, Touchscreen | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6S7CVM08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6S | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6s4avm08ac-datasheets-0412.pdf | 624-LFBGA | 21mm | 624 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 0.8mm | MCIMX6 | 1.5V | 1.275V | 40 | S-PBGA-B624 | 800MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FLOATING POINT | YES | 26 | 32 | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM1808EZWTA3 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | Surface Mount | -40°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | 375MHz | ROHS3 Compliant | /files/texasinstruments-am1808ezwtd4-datasheets-2590.pdf&product=texasinstruments-am1808ezwta3-4781438 | 361-LFBGA | 16mm | 1.4mm | 16mm | 1.2V | Lead Free | 361 | 6 Weeks | 789.392471mg | 361 | Ethernet, I2C, SPI, UART, USB | ACTIVE (Last Updated: 1 week ago) | yes | 900μm | Copper, Silver, Tin | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 0.8mm | AM1808 | 64kB | L1 Cache, RAM, ROM | ARM | 128kB | 32b | MICROPROCESSOR, RISC | 32 | 3 | YES | YES | FIXED POINT | YES | 1 | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | ARM926EJ-S | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | LCD | SATA 3Gbps (1) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6X4AVM08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6SX | -40°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 1.52mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6x4evm10ab-datasheets-9562.pdf | 529-LFBGA | 19mm | 529 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 0.8mm | 1.5V | 1.275V | 1100mA | S-PBGA-B529 | 14 | 200MHz, 800MHz | MULTIFUNCTION PERIPHERAL | 144K | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | YES | 2 | 16 | 32 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ARM® Cortex®-A9, ARM® Cortex®-M4 | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | AC'97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD, LVDS | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6Y1CVM05AB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6 | -40°C~105°C TJ | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-mcimx6y2cvm08ab-datasheets-3353.pdf | 289-LFBGA | 18 Weeks | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 260 | 40 | 528MHz | USB 2.0 OTG + PHY (2) | ARM® Cortex®-A7 | 1.8V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | CAN, I2C, SPI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6L2EVN10AB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6SL | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.1mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6l2evn10ab-datasheets-3457.pdf | 432-TFBGA | 13mm | 576 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 0.5mm | MCIMX6 | 1.5V | 1.375V | 40 | 1100mA | Not Qualified | S-PBGA-B | 162 | 1.0GHz | MICROPROCESSOR, RISC | 32 | 32000 | CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB | YES | YES | FIXED POINT | YES | 16 | 32 | USB 2.0 + PHY (3) | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8308CVMAGDA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC83xx | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.54mm | ROHS3 Compliant | 2002 | 473-LFBGA | 19mm | 473 | 10 Weeks | 3A991.A.2 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1V | 0.8mm | MPC8308 | 1.05V | 0.95V | 40 | S-PBGA-B473 | 400MHz | MICROPROCESSOR, RISC | USB 2.0 (1) | PowerPC e300c3 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2 | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Z84C0020AEG | Zilog |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Z80 | Surface Mount | -40°C~100°C TA | Tray | 3 (168 Hours) | CMOS | 20MHz | ROHS3 Compliant | 1997 | 44-LQFP | 5V | Lead Free | 44 | 13 Weeks | 44 | yes | 5V | QUAD | GULL WING | 5V | 0.8mm | Z84C00 | Microprocessors | 5V | 100mA | 8b | MICROPROCESSOR, RISC | 8 | 5.0V | 1 Core 8-Bit | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATSAMA5D35A-CU | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SAMA5D3 | -40°C~85°C TA | Tray | 3 (168 Hours) | 536MHz | ROHS3 Compliant | 2014 | /files/microchiptechnology-atsama5d31acfu-datasheets-0194.pdf | 324-LFBGA | 15.05mm | 1.1mm | 15.05mm | 1.2V | Lead Free | 10 Weeks | No SVHC | 1.32V | 1.08V | 324 | CAN, Ethernet, LIN, SPI, UART, USB | yes | ATSAMA5D35 | 160kB | 12 | 160 | FLASH, ROM | DMA, POR, PWM, WDT | ARM | 128kB | 32b | Yes | 6 | 7 | 4 | 3 | USB 2.0 (3) | ARM® Cortex®-A5 | 1.2V 1.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | LPDDR, LPDDR2, DDR2 | CAN, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART | AES, SHA, TDES, TRNG | Touchscreen | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6Y2CVM08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6 | -40°C~105°C TJ | Tray | 3 (168 Hours) | ROHS3 Compliant | 2015 | /files/nxpusainc-mcimx6y2cvm08ab-datasheets-3353.pdf | 289-LFBGA | 18 Weeks | 8542.39.00.01 | 260 | 792MHz | USB 2.0 OTG + PHY (2) | ARM® Cortex®-A7 | 1.8V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | CAN, I2C, SPI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATSAMA5D27C-LD1G-CU | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SAMA5D2 | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.2mm | /files/microchiptechnology-atsama5d27cld2gcu-datasheets-1793.pdf | 289-LFBGA | 16mm | 361 | 10 Weeks | compliant | YES | BOTTOM | BALL | 1.2V | 0.8mm | ATSAMA5D27 | 1.3V | 1.14V | S-PBGA-G361 | 500MHz | MICROPROCESSOR, RISC | 32 | 32768 | YES | YES | FLOATING POINT | YES | 10 | 32 | 51 | 24MHz | USB 2.0 + HSIC | ARM® Cortex®-A5 | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6U7CVM08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6DL | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6u7cvm08ac-datasheets-3360.pdf | 624-LFBGA | 21mm | 624 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 0.8mm | 1.5V | 1.275V | NOT SPECIFIED | S-PBGA-B624 | 800MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FLOATING POINT | YES | 26 | 32 | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM5728BABCX | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | 0°C~90°C TJ | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | /files/texasinstruments-am5726babcxa-datasheets-0173.pdf | 760-BFBGA, FCBGA | 23mm | 2.96mm | 23mm | Lead Free | 760 | 6 Weeks | 760 | ACTIVE (Last Updated: 2 days ago) | 2.39mm | 5A992C | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 1.15V | 0.8mm | AM5728 | 1.2V | 1.11V | 1.5GHz | MICROPROCESSOR, RISC | 10 | YES | YES | FLOATING POINT | NO | 38.4MHz | USB 2.0 (1), USB 3.0 (1) | ARM® Cortex®-A15 | 1.8V 3.3V | GbE | 2 Core 32-Bit | Yes | DDR3, SRAM | DSP, BB2D, IPU, IVA, GPU, VPE | SATA 3Gbps (1) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| R7S721001VCBG#AC1 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RZ/A1H | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 324-BGA | 19mm | 324 | 20 Weeks | yes | YES | BOTTOM | BALL | 1.18V | 0.8mm | 324 | 1.26V | 1.1V | 169 | 400MHz | MICROCONTROLLER, RISC | YES | YES | YES | 48MHz | 26 | 32 | USB 2.0 (2) | ARM® Cortex®-A9 | 1.2V 3.3V | 10/100Mbps (1), 100Mbps (1) | 1 Core 32-Bit | Yes | SDRAM, SRAM | CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | Multimedia; NEON™ MPE | DVD, VDC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6Y2DVM05AB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6 | 0°C~95°C TJ | Tray | 3 (168 Hours) | ROHS3 Compliant | 2015 | /files/nxpusainc-mcimx6y2dvm09ab-datasheets-1085.pdf | 289-LFBGA | 18 Weeks | 8542.39.00.01 | 260 | 40 | 528MHz | USB 2.0 OTG + PHY (2) | ARM® Cortex®-A7 | 1.8V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | CAN, I2C, SPI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATSAMA5D36A-CN | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SAMA5D3 | -40°C~105°C TA | Tray | 3 (168 Hours) | 536MHz | ROHS3 Compliant | 2014 | /files/microchiptechnology-atsama5d31acfu-datasheets-0194.pdf | 324-LFBGA | 1.2V | 10 Weeks | 1.32V | 1.08V | 324 | 2-Wire, CAN, EBI/EMI, Ethernet, I2C, LIN, SPI, UART, USART, USB | yes | Copper, Silver, Tin | ATSAMA5D36 | 160kB | Internal | 160 | L1 Cache, ROM, SRAM | DMA, LCD, POR, PWM, WDT | ARM | 128kB | 32b | Yes | 2 | 1 | USB 2.0 (3) | ARM® Cortex®-A5 | 1.2V 1.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | LPDDR, LPDDR2, DDR2 | CAN, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART | AES, SHA, TDES, TRNG | LCD, Touchscreen | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Z84C0020VEG | Zilog |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Z80 | Surface Mount | -40°C~100°C TA | Tube | 3 (168 Hours) | CMOS | 20MHz | 4.57mm | ROHS3 Compliant | 2002 | 44-LCC (J-Lead) | 16.5862mm | 5V | Lead Free | 44 | 13 Weeks | 44 | yes | 3A001.A.2.C | DRAM MEMORY REFRESH COUNTER | 8542.31.00.01 | e3 | Matte Tin (Sn) | 5V | QUAD | J BEND | 260 | 5V | 1.27mm | Z84C00 | 44 | 40 | Microprocessors | 5V | 100mA | 64kB | ROMless | 8b | MICROPROCESSOR | 8 | NO | YES | FIXED POINT | NO | 2 | 16 | 5.0V | 1 Core 8-Bit | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM712GX04LF04-BA | Silicon Motion, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | /files/siliconmotioninc-sm712gx04lf04ba-datasheets-3268.pdf&product=siliconmotioninc-sm712gx04lf04ba-4781419 | 12 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6D7CVT08AD | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6D | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 2.16mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6q7cvt08ae-datasheets-9282.pdf | 624-FBGA, FCBGA | 21mm | 624 | 15 Weeks | 5A992 | 8542.31.00.01 | YES | BOTTOM | BALL | 260 | 0.8mm | 1.5V | 1.275V | NOT SPECIFIED | S-PBGA-B624 | 800MHz | MICROPROCESSOR, RISC | 64 | YES | YES | FIXED POINT | YES | 24MHz | 16 | 64 | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX7D5EVM10SD | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX7D | -20°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | 1.42mm | ROHS3 Compliant | 2012 | /files/nxpusainc-mcimx7d3evk10sd-datasheets-0350.pdf | 541-LFBGA | 19mm | 541 | 16 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | 260 | 1.1V | 0.75mm | 1.25V | 1.045V | 40 | S-PBGA-B541 | 1.0GHz | MICROPROCESSOR, RISC | 32 | YES | YES | FLOATING POINT | YES | 16 | 32 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ARM® Cortex®-A7, ARM® Cortex®-M4 | 1.8V 3.3V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6D5EYM10AD | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6D | -20°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6q7cvt08ae-datasheets-9282.pdf | 624-LFBGA, FCBGA | 21mm | 624 | 15 Weeks | 5A992 | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 0.8mm | 1.5V | 1.35V | 40 | S-PBGA-B624 | 1.0GHz | MICROPROCESSOR | 64 | YES | YES | FIXED POINT | YES | 24MHz | 16 | 64 | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6S5DVM10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6S | 0°C~95°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6s5dvm10ad-datasheets-9762.pdf | 624-LFBGA | 21mm | 624 | 15 Weeks | YES | BOTTOM | BALL | 260 | 0.8mm | 1.5V | 1.35V | NOT SPECIFIED | S-PBGA-B624 | 1.0GHz | MICROPROCESSOR, RISC | YES | YES | FIXED POINT | YES | 26 | 32 | USB 2.0 + PHY (4) | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8270CVRMIBA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC82xx | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 2.55mm | ROHS3 Compliant | 1997 | /files/nxpusainc-mpc8270zuupea-datasheets-9856.pdf | 516-BBGA | 27mm | 516 | 12 Weeks | 3A991.A.2 | 8542.31.00.01 | e2 | Tin/Silver (Sn/Ag) | YES | BOTTOM | BALL | 245 | 1.5V | 1mm | MPC8270 | 1.6V | 1.45V | 30 | Other uPs/uCs/Peripheral ICs | 1.53.3V | S-PBGA-B516 | 266MHz | MICROPROCESSOR, RISC | 32 | YES | NO | FLOATING POINT | YES | 266MHz | 32 | 64 | USB 2.0 (1) | PowerPC G2_LE | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8260AZUMHBB | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC82xx | 0°C~105°C TA | Tray | 3 (168 Hours) | Non-RoHS Compliant | /files/rochesterelectronicsllc-mpc8260azumhbb-datasheets-3325.pdf | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | 266MHz | PowerPC G2 | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6G3CVM05AB | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX6UL | -40°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | 1.32mm | ROHS3 Compliant | 2002 | /files/nxpusainc-mcimx6g2cvm05ab-datasheets-3104.pdf | 289-LFBGA | 14mm | 289 | 15 Weeks | 8542.39.00.01 | YES | BOTTOM | BALL | 260 | 0.8mm | 1.3V | 1.15V | 40 | S-PBGA-B289 | 131 | 528MHz | 128000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | 16 | 16 | USB 2.0 + PHY (2) | ARM® Cortex®-A7 | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LCD, LVDS | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM5728BABCXA | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | -40°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | /files/texasinstruments-am5726babcxa-datasheets-0173.pdf | 760-BFBGA, FCBGA | 23mm | 2.96mm | 23mm | Lead Free | 760 | 6 Weeks | 760 | ACTIVE (Last Updated: 2 days ago) | 2.39mm | 5A992C | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 1.15V | 0.8mm | AM5728 | 1.2V | 1.11V | 1.5GHz | MICROPROCESSOR, RISC | 10 | YES | YES | FLOATING POINT | NO | 38.4MHz | USB 2.0 (1), USB 3.0 (1) | ARM® Cortex®-A15 | 1.8V 3.3V | GbE | 2 Core 32-Bit | Yes | DDR3, SRAM | DSP, BB2D, IPU, IVA, GPU, VPE | SATA 3Gbps (1) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Z84C0010VEG | Zilog |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Z80 | Surface Mount | -40°C~100°C TA | Tube | 3 (168 Hours) | CMOS | 10MHz | 4.57mm | ROHS3 Compliant | 2002 | /files/zilog-z84c0010veg-datasheets-6991.pdf&product=zilog-z84c0010veg-4781428 | 44-LCC (J-Lead) | 16.5862mm | 5V | Lead Free | 44 | 13 Weeks | 44 | yes | 3A001.A.2.C | DRAM MEMORY REFRESH COUNTER | 8542.31.00.01 | e3 | Matte Tin (Sn) | 5V | QUAD | J BEND | 260 | 5V | 1.27mm | Z84C00 | 44 | 40 | Microprocessors | 5V | 50mA | 64kB | ROMless | 8b | MICROPROCESSOR | 8 | NO | YES | FIXED POINT | NO | 2 | 16 | 5.0V | 1 Core 8-Bit | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM3352BZCZ80 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Sitara™ | 0°C~90°C TJ | Tray | 3 (168 Hours) | CMOS | 800MHz | ROHS3 Compliant | /files/texasinstruments-am3352bzczd60-datasheets-2023.pdf | 324-LFBGA | 15mm | 1.4mm | 15mm | 1.1V | Lead Free | 324 | 6 Weeks | 324 | CAN, Ethernet, I2C, SPI, UART, USB | ACTIVE (Last Updated: 1 day ago) | yes | 900μm | 5A992.C | Copper, Silver, Tin | No | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.144V | YES | BOTTOM | BALL | 260 | 1.26V | 0.8mm | AM3352 | Microprocessors | 400mA | 64kB | ROM | ARM | 64kB | 32b | MICROPROCESSOR, RISC | 32 | 10 | 6 | YES | YES | FIXED POINT | YES | 1 | USB 2.0 + PHY (2) | ARM® Cortex®-A8 | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | Cryptography, Random Number Generator | LCD, Touchscreen | |||||||||||||||||||||||||||||||||||||||||||||||||
| R8A77800BDBGV | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 400MHz | 1.9mm | ROHS3 Compliant | 2008 | 449-FBGA | 3.3V | Lead Free | 449 | 20 Weeks | 3.6V | 3V | 449 | MMC, SCI, SPI, Serial, UART | No | BOTTOM | BALL | 3.3V | 0.8mm | R8A77800 | 449 | External | 75 | ROMless | DMA, POR, WDT | 16kB | MICROCONTROLLER, RISC | 32 | NO | YES | NO | NO | 2 | SH-4A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| OMAPL137DZKBA3 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | OMAP-L1x | Surface Mount | -40°C~105°C TJ | Tray | 3 (168 Hours) | CMOS | 375MHz | ROHS3 Compliant | /files/texasinstruments-omapl137dzkb3-datasheets-2583.pdf&product=texasinstruments-omapl137dzkba3-4781397 | 256-BGA | 17mm | 2.05mm | 17mm | Lead Free | 256 | 6 Weeks | 3.45V | 900mV | 256 | SPI, USB | ACTIVE (Last Updated: 6 days ago) | yes | 1.36mm | Copper, Silver, Tin | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | OMAPL137 | Other Microprocessor ICs | 105°C | 85°C | 32kB | 128 | Cache | ARM | 128kB | 32b | DIGITAL SIGNAL PROCESSOR, OTHER | 2 | YES | YES | FLOATING POINT | YES | 3 | NO | SINGLE | 1 | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | ARM926EJ-S | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | HPI, I2C, McASP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | LCD |
