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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Lifecycle Status | ECCN Code | Max Frequency | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Number of I/O | Peripherals | Core Architecture | RAM Size | Speed Grade | Architecture | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Inputs | Organization | Number of Gates | UV Erasable | Core Processor | Connectivity | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Flash Size | Number of Equivalent Gates |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCM33843VKFSBG | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BCM33843MVKFSBG | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BCM3384ZCSD01 | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150T-1FC1152M | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -55°C~125°C TJ | Tray | 4 (72 Hours) | CMOS | 2.9mm | Non-RoHS Compliant | /files/microsemicorporation-m2s150ts1fc1152m-datasheets-6169.pdf | 1152-BBGA, FCBGA | 35mm | 35mm | IN PRODUCTION (Last Updated: 3 weeks ago) | 3A001.A.2.C | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B1152 | 574 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 574 | 166MHz | 574 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | |||||||||||||||||||||||||||
| A2F060M3E-1FGG256I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 100MHz | 1.7mm | RoHS Compliant | 2015 | /files/microsemicorporation-a2f060m3etq144-datasheets-5555.pdf | 256-LBGA | 17mm | 17mm | 256 | 256 | EBI/EMI, I2C, SPI, UART, USART | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 250 | 1.5V | 1mm | A2F060M3E | 1.575V | 1.425V | 30 | Field Programmable Gate Arrays | Not Qualified | MCU - 26, FPGA - 66 | DMA, POR, WDT | ARM | 16KB | MCU, FPGA | 66 | 1536 CLBS, 60000 GATES | ARM® Cortex®-M3 | EBI/EMI, I2C, SPI, UART/USART | 8 | FIELD PROGRAMMABLE GATE ARRAY | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | 60000 | ||||||||||||||||||||||||||
| XCZU2EG-3SBVA484E | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 2013 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 484-BFBGA, FCBGA | 484 | compliant | YES | BOTTOM | BALL | 0.9V | S-PBGA-B484 | 82 | DMA, WDT | 256KB | MCU, FPGA | 600MHz, 667MHz, 1.5GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||
| M2S010-1TQ144 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 144-LQFP | 20mm | 20mm | 1.2V | 144 | 144 | OBSOLETE (Last Updated: 1 month ago) | not_compliant | e0 | Tin/Lead (Sn/Pb) | YES | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | NOT SPECIFIED | Field Programmable Gate Arrays | Not Qualified | 84 | DDR, PCIe, SERDES | 64KB | 1 | MCU, FPGA | 84 | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 256KB | |||||||||||||||||||||||||||||||
| M2S010S-1TQ144 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | Non-RoHS Compliant | /files/microsemicorporation-m2s005s1vfg400t2-datasheets-2817.pdf | 144-LQFP | OBSOLETE (Last Updated: 1 month ago) | 144-TQFP (20x20) | 84 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 10K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S100S-1FCG1152I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 166MHz | RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 1152-BBGA, FCBGA | CAN, Ethernet, I2C, SPI, UART, USART, USB | M2S100S | 1152-FCBGA (35x35) | 574 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 100K Logic Modules | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||
| M2S150TS-1FC1152M | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -55°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 2.9mm | Non-RoHS Compliant | 2016 | /files/microsemicorporation-m2s150ts1fc1152m-datasheets-6169.pdf | 1152-BBGA, FCBGA | 35mm | 35mm | IN PRODUCTION (Last Updated: 1 month ago) | 3A001.A.2.C | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B1152 | 574 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 574 | 166MHz | 574 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | ||||||||||||||||||||||||||
| M2S090-1FG676IX417 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | Non-RoHS Compliant | 2016 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 676-BGA | 8 Weeks | 676-FBGA (27x27) | 425 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 90K Logic Modules | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150T-1FCG1152M | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -55°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 2.9mm | RoHS Compliant | /files/microsemicorporation-m2s150ts1fc1152m-datasheets-6169.pdf | 1152-BBGA, FCBGA | 35mm | 35mm | IN PRODUCTION (Last Updated: 3 weeks ago) | 3A001.A.2.C | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B1152 | 574 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 574 | 166MHz | 574 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | ||||||||||||||||||||||||||||
| BCM33843MRKFSBG | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F500M3G-1FGG256I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 100MHz | 1.7mm | RoHS Compliant | 2013 | /files/microsemicorporation-a2f500m3gfgg484i-datasheets-0641.pdf | 256-LBGA | 17mm | 17mm | Lead Free | 256 | 256 | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 250 | 1.5V | 1mm | A2F500M3G | 1.575V | 1.425V | 30 | Field Programmable Gate Arrays | 1.51.82.53.3V | Not Qualified | MCU - 25, FPGA - 66 | DMA, POR, WDT | ARM | 64KB | MCU, FPGA | 66 | 500000 | ARM® Cortex®-M3 | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 24 | FIELD PROGRAMMABLE GATE ARRAY | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | ||||||||||||||||||||||||
| M2S010S-1TQ144I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | Non-RoHS Compliant | /files/microsemicorporation-m2s005s1vfg400t2-datasheets-2817.pdf | 144-LQFP | OBSOLETE (Last Updated: 1 month ago) | 144-TQFP (20x20) | 84 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 10K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| XA7Z030-1FBG484I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100, Zynq®-7000 XA | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 2.54mm | RoHS Compliant | 2010 | /files/xilinxinc-xa7z0201clg484q-datasheets-0818.pdf | 484-BBGA, FCBGA | 23mm | 23mm | 484 | EAR99 | not_compliant | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 250 | 1mm | 30 | Other uPs/uCs/Peripheral ICs | 11.8V | Not Qualified | S-PBGA-B484 | 130 | DMA | 256KB | MCU, FPGA | 667MHz | MICROPROCESSOR CIRCUIT | N | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | ||||||||||||||||||||||||||||||||
| M2S010-TQ144 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 144-LQFP | 20mm | 20mm | 144 | 8 Weeks | OBSOLETE (Last Updated: 1 month ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PQFP-G144 | 84 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 84 | 166MHz | 84 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 256KB | ||||||||||||||||||||||||||
| BCM3384GCSA01 | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S010-1TQ144I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 144-LQFP | 20mm | 20mm | 1.2V | 144 | 144 | OBSOLETE (Last Updated: 1 month ago) | not_compliant | e0 | Tin/Lead (Sn/Pb) | YES | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | NOT SPECIFIED | Field Programmable Gate Arrays | Not Qualified | 84 | DDR, PCIe, SERDES | 64KB | 1 | MCU, FPGA | 84 | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 256KB | |||||||||||||||||||||||||||||||
| M2S010-TQ144I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 144-LQFP | 20mm | 20mm | 144 | 8 Weeks | OBSOLETE (Last Updated: 2 days ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PQFP-G144 | 84 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 84 | 166MHz | 84 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 256KB | ||||||||||||||||||||||||||
| A2F060M3E-1FGG256 | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | 0°C~85°C TJ | Tray | 3 (168 Hours) | 85°C | 0°C | 100MHz | RoHS Compliant | /files/microsemicorporation-a2f060m3etq144-datasheets-5555.pdf | 256-LBGA | 1.5V | 1.575V | 1.425V | 256 | EBI/EMI, I2C, SPI, UART, USART | 100MHz | A2F060M3E | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | DMA, POR, WDT | ARM | 16KB | MCU, FPGA | 100MHz | ARM® Cortex®-M3 | EBI/EMI, I2C, SPI, UART/USART | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | |||||||||||||||||||||||||||||||||||||||||
| A2F500M3G-1PQ208I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 100MHz | Non-RoHS Compliant | 2015 | /files/microsemicorporation-a2f500m3gfgg484i-datasheets-0641.pdf | 208-BFQFP | 1.5V | 10 Weeks | 1.575V | 1.425V | 208 | Ethernet, I2C, SPI, UART, USART | 100MHz | A2F500M3G | 208-PQFP (28x28) | MCU - 22, FPGA - 66 | DMA, POR, WDT | ARM | 64KB | MCU, FPGA | 100MHz | ARM® Cortex®-M3 | Ethernet, I2C, SPI, UART/USART | 24 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | ||||||||||||||||||||||||||||||||||||||
| BCM33843GUIFSBG | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 1SX280HH1F55E2LGS3 | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Stratix® 10 SX | 0°C~100°C TJ | 3 (168 Hours) | /files/intel-1sx165hn1f43i2vg-datasheets-4374.pdf | 2912-BBGA, FCBGA | DMA, WDT | 256KB | MCU, FPGA | 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FPGA - 2800K Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F060M3E-1FG256M | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | -55°C~125°C TJ | Tray | 3 (168 Hours) | 100MHz | Non-RoHS Compliant | /files/microsemicorporation-a2f060m3efg256m-datasheets-5981.pdf | 256-LBGA | 256 | EBI/EMI, I2C, SPI, UART, USART | unknown | 8542.39.00.01 | A2F060M3E | MCU - 26, FPGA - 66 | DMA, POR, WDT | ARM | 16KB | MCU, FPGA | ARM® Cortex®-M3 | EBI/EMI, I2C, SPI, UART/USART | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090S-1FGG676I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 166MHz | RoHS Compliant | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 676-BGA | CAN, Ethernet, I2C, SPI, UART, USART, USB | M2S090S | 676-FBGA (27x27) | 425 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 90K Logic Modules | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||
| M2S100S-1FC1152I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 166MHz | Non-RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 1152-BBGA, FCBGA | 1.2V | 1.26V | 1.14V | 1152 | CAN, Ethernet, I2C, SPI, UART, USART, USB | M2S100S | 1152-FCBGA (35x35) | 574 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 100K Logic Modules | 512KB | ||||||||||||||||||||||||||||||||||||||||||
| M2S005S-1TQ144 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 144-LQFP | 20mm | 20mm | 144 | OBSOLETE (Last Updated: 1 month ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PQFP-G144 | 84 | DDR | 64KB | MCU, FPGA | 84 | 166MHz | 84 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | ||||||||||||||||||||||||||
| 1SX250HN2F43E1VG | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Stratix® 10 SX | 0°C~100°C TJ | 3 (168 Hours) | https://pdf.utmel.com/r/datasheets/intel-1sx165hn1f43i2vg-datasheets-4374.pdf | 1760-BBGA, FCBGA | 12 Weeks | compliant | DMA, WDT | 256KB | MCU, FPGA | 1.5GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FPGA - 2500K Logic Elements | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F060M3E-FGG256M | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | Surface Mount | -55°C~125°C TJ | Tray | 3 (168 Hours) | 80MHz | RoHS Compliant | /files/microsemicorporation-a2f060m3efg256m-datasheets-5981.pdf | 256-LBGA | 1.5V | 1.575V | 1.425V | 256 | EBI/EMI, I2C, SPI, UART, USART | 8542.39.00.01 | A2F060M3E | MCU - 26, FPGA - 66 | DMA, POR, WDT | ARM | 16KB | MCU, FPGA | ARM® Cortex®-M3 | EBI/EMI, I2C, SPI, UART/USART | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB |
