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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Radiation Hardening | Max Frequency | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Data Rate | Memory Size | Number of I/O | Peripherals | Core Architecture | RAM Size | Speed Grade | Architecture | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Registers | Number of Inputs | RAM (words) | Bus Compatibility | Boundary Scan | Organization | Number of Gates | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Flash Size | Number of Equivalent Gates |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| A2F060M3E-1FG256I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 100MHz | Non-RoHS Compliant | 2009 | /files/microsemicorporation-a2f060m3etq144-datasheets-5555.pdf | 256-LBGA | 1.5V | 256 | 256 | EBI/EMI, I2C, SPI, UART, USART | No | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | 225 | 1.5V | A2F060M3E | 20 | Field Programmable Gate Arrays | MCU - 26, FPGA - 66 | DMA, POR, WDT | ARM | 16KB | 1 | MCU, FPGA | 66 | 1536 | ARM® Cortex®-M3 | EBI/EMI, I2C, SPI, UART/USART | 8 | FIELD PROGRAMMABLE GATE ARRAY | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | 60000 | |||||||||||||||||||||||||||||||||||
| A2F500M3G-FG256I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 80MHz | 2mA | 1.7mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-a2f500m3gfgg484i-datasheets-0641.pdf | 256-LBGA | 17mm | 17mm | 256 | 12 Weeks | 256 | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | 225 | 1.5V | 1mm | A2F500M3G | 1.575V | 1.425V | 20 | Field Programmable Gate Arrays | 1.51.82.53.3V | Not Qualified | MCU - 25, FPGA - 66 | DMA, POR, WDT | ARM | 64KB | MCU, FPGA | 66 | 500000 | ARM® Cortex®-M3 | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 24 | FIELD PROGRAMMABLE GATE ARRAY | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | ||||||||||||||||||||||||||||
| 1SX280HU1F50E1VGS3 | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Stratix® 10 SX | 0°C~100°C TJ | 3 (168 Hours) | /files/intel-1sx165hn1f43i2vg-datasheets-4374.pdf | 2397-BBGA, FCBGA | 8 Weeks | DMA, WDT | 256KB | MCU, FPGA | 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FPGA - 2800K Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-1FBG676CES | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq®-7000 | 0°C~85°C TJ | Tray | 4 (72 Hours) | CMOS | 667MHz | 2.54mm | RoHS Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 27mm | 27mm | 676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | YES | BOTTOM | BALL | 1V | 1mm | XC7Z045 | 1.05V | 0.95V | S-PBGA-B676 | 130 | DMA | ARM | 256KB | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 350K Logic Cells | ||||||||||||||||||||||||||||||||||||||||
| A2F060M3E-1CS288 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | 85°C | 0°C | 100MHz | Non-RoHS Compliant | 2015 | /files/microsemicorporation-a2f060m3etq144-datasheets-5555.pdf | 288-TFBGA, CSPBGA | 1.5V | 1.575V | 1.425V | 288 | EBI/EMI, I2C, SPI, UART, USART | 100MHz | A2F060M3E | 288-CSP (11x11) | MCU - 28, FPGA - 68 | DMA, POR, WDT | ARM | 16KB | MCU, FPGA | 100MHz | ARM® Cortex®-M3 | EBI/EMI, I2C, SPI, UART/USART | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | ||||||||||||||||||||||||||||||||||||||||||||
| A2F060M3E-1CSG288 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | 0°C~85°C TJ | Tray | 3 (168 Hours) | 85°C | 0°C | 100MHz | RoHS Compliant | 2015 | /files/microsemicorporation-a2f060m3etq144-datasheets-5555.pdf | 288-TFBGA, CSPBGA | 1.5V | 1.575V | 1.425V | EBI/EMI, I2C, SPI, UART, USART | 100MHz | A2F060M3E | 288-CSP (11x11) | MCU - 28, FPGA - 68 | DMA, POR, WDT | ARM | 16KB | MCU, FPGA | 100MHz | ARM® Cortex®-M3 | EBI/EMI, I2C, SPI, UART/USART | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||
| A2F060M3E-FGG256I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 80MHz | 3mA | RoHS Compliant | 2015 | /files/microsemicorporation-a2f060m3etq144-datasheets-5555.pdf | 256-LBGA | 1.5V | 12 Weeks | 1.575V | 1.425V | 256 | EBI/EMI, I2C, SPI, UART, USART | 100MHz | A2F060M3E | 256-FPBGA (17x17) | 400 kbps | 4.5kB | MCU - 26, FPGA - 66 | DMA, POR, WDT | ARM | 16KB | MCU, FPGA | 80MHz | 60000 | ARM® Cortex®-M3 | EBI/EMI, I2C, SPI, UART/USART | 660 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | ||||||||||||||||||||||||||||||||||||||||
| M2S050T-FGG896ES | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | 85°C | 0°C | 166MHz | RoHS Compliant | 2016 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 896-BGA | Lead Free | CAN, Ethernet, I2C, SPI, UART, USART, USB | M2S050 | 896-FBGA (31x31) | 377 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 50K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||
| 1SX250HN1F43I2VG | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Stratix® 10 SX | -40°C~100°C TJ | 3 (168 Hours) | /files/intel-1sx165hn1f43i2vg-datasheets-4374.pdf | 1760-BBGA, FCBGA | 12 Weeks | compliant | DMA, WDT | 256KB | MCU, FPGA | 1.5GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FPGA - 2500K Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F060M3E-CSG288I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 80MHz | 1.05mm | RoHS Compliant | /files/microsemicorporation-a2f060m3etq144-datasheets-5555.pdf | 288-TFBGA, CSPBGA | 11mm | 11mm | 1.5V | 288 | 1.575V | 1.425V | EBI/EMI, I2C, SPI, UART, USART | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 1.5V | 0.5mm | A2F060M3E | 30 | Field Programmable Gate Arrays | Not Qualified | MCU - 28, FPGA - 68 | DMA, POR, WDT | ARM | 16KB | MCU, FPGA | 68 | 68 | 1536 CLBS, 60000 GATES | ARM® Cortex®-M3 | EBI/EMI, I2C, SPI, UART/USART | 8 | FIELD PROGRAMMABLE GATE ARRAY | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | 60000 | |||||||||||||||||||||||||||||||
| A2F500M3G-PQ208 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 80MHz | 4.1mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-a2f500m3gfgg484i-datasheets-0641.pdf | 208-BFQFP | 28mm | 28mm | 208 | 12 Weeks | 208 | Ethernet, I2C, SPI, UART, USART | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | QUAD | GULL WING | 225 | 1.5V | 0.5mm | A2F500M3G | 1.575V | 1.425V | 20 | MCU - 22, FPGA - 66 | DMA, POR, WDT | ARM | 64KB | MCU, FPGA | 11520 CLBS, 500000 GATES | ARM® Cortex®-M3 | Ethernet, I2C, SPI, UART/USART | 24 | FIELD PROGRAMMABLE GATE ARRAY | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | 500000 | ||||||||||||||||||||||||||||||||
| A2F060M3E-FGG256 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 80MHz | 3mA | 1.7mm | RoHS Compliant | 2015 | /files/microsemicorporation-a2f060m3etq144-datasheets-5555.pdf | 256-LBGA | 17mm | 17mm | 1.5V | 256 | 2 Weeks | 1.575V | 1.425V | 256 | EBI/EMI, I2C, SPI, UART, USART | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 1.5V | 1mm | A2F060M3E | 30 | 400 kbps | 4.5kB | MCU - 26, FPGA - 66 | DMA, POR, WDT | ARM | 16KB | MCU, FPGA | 60000 | ARM® Cortex®-M3 | EBI/EMI, I2C, SPI, UART/USART | 660 | FIELD PROGRAMMABLE GATE ARRAY | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | |||||||||||||||||||||||||||||
| 1SX280HH2F55E1VGS3 | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Stratix® 10 SX | 0°C~100°C TJ | 3 (168 Hours) | /files/intel-1sx165hn1f43i2vg-datasheets-4374.pdf | 2912-BBGA, FCBGA | DMA, WDT | 256KB | MCU, FPGA | 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FPGA - 2800K Logic Elements | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-2FBG676CES | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq®-7000 | 0°C~85°C TJ | Tray | 4 (72 Hours) | 85°C | 0°C | 800MHz | RoHS Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 7 Weeks | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | XC7Z045 | 676-FCBGA (27x27) | 130 | DMA | ARM | 256KB | MCU, FPGA | 800MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 350K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 1SX280HH1F55I2LG | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Stratix® 10 SX | -40°C~100°C TJ | 3 (168 Hours) | /files/intel-1sx165hn1f43i2vg-datasheets-4374.pdf | 2912-BBGA, FCBGA | 12 Weeks | compliant | DMA, WDT | 256KB | MCU, FPGA | 1.5GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FPGA - 2800K Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F060M3E-1TQ144I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 100MHz | Non-RoHS Compliant | 2015 | /files/microsemicorporation-a2f060m3etq144-datasheets-5555.pdf | 144-LQFP | EBI/EMI, I2C, SPI, UART, USART | A2F060M3E | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | DMA, POR, WDT | ARM | 16KB | MCU, FPGA | 100MHz | ARM® Cortex®-M3 | EBI/EMI, I2C, SPI, UART/USART | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 1SX280HU1F50I2LG | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Stratix® 10 SX | -40°C~100°C TJ | 3 (168 Hours) | https://pdf.utmel.com/r/datasheets/intel-1sx165hn1f43i2vg-datasheets-4374.pdf | 2397-BBGA, FCBGA | 12 Weeks | compliant | DMA, WDT | 256KB | MCU, FPGA | 1.5GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FPGA - 2800K Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F060M3E-FG256 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | 85°C | 0°C | 80MHz | Non-RoHS Compliant | 2015 | /files/microsemicorporation-a2f060m3etq144-datasheets-5555.pdf | 256-LBGA | 1.5V | 2 Weeks | 1.575V | 1.425V | 256 | EBI/EMI, I2C, SPI, UART, USART | 100MHz | A2F060M3E | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | DMA, POR, WDT | ARM | 16KB | MCU, FPGA | 80MHz | ARM® Cortex®-M3 | EBI/EMI, I2C, SPI, UART/USART | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | |||||||||||||||||||||||||||||||||||||||||||
| 1SX280HU1F50E1VG | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Stratix® 10 SX | 0°C~100°C TJ | 3 (168 Hours) | /files/intel-1sx165hn1f43i2vg-datasheets-4374.pdf | 2397-BBGA, FCBGA | 12 Weeks | compliant | DMA, WDT | 256KB | MCU, FPGA | 1.5GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FPGA - 2800K Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F060M3E-FG256I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 80MHz | Non-RoHS Compliant | /files/microsemicorporation-a2f060m3etq144-datasheets-5555.pdf | 256-LBGA | 1.5V | 1.575V | 1.425V | 256 | EBI/EMI, I2C, SPI, UART, USART | 100MHz | A2F060M3E | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | DMA, POR, WDT | ARM | 16KB | MCU, FPGA | 80MHz | ARM® Cortex®-M3 | EBI/EMI, I2C, SPI, UART/USART | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||
| A2F060M3E-TQ144 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 80MHz | 1.6mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-a2f060m3etq144-datasheets-5555.pdf | 144-LQFP | 20mm | 20mm | 144 | 2 Weeks | EBI/EMI, I2C, SPI, UART, USART | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | QUAD | GULL WING | 225 | 1.5V | 0.5mm | A2F060M3E | 1.575V | 1.425V | 20 | Field Programmable Gate Arrays | 1.51.82.53.3V | Not Qualified | S-PQFP-G144 | MCU - 21, FPGA - 33 | DMA, POR, WDT | ARM | 16KB | MCU, FPGA | 33 | 33 | 1536 CLBS, 60000 GATES | ARM® Cortex®-M3 | EBI/EMI, I2C, SPI, UART/USART | FIELD PROGRAMMABLE GATE ARRAY | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | 60000 | ||||||||||||||||||||||||||||
| A2F060M3E-1CSG288I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 100MHz | RoHS Compliant | 2015 | /files/microsemicorporation-a2f060m3etq144-datasheets-5555.pdf | 288-TFBGA, CSPBGA | 1.5V | 288 | EBI/EMI, I2C, SPI, UART, USART | No | 100MHz | A2F060M3E | 288-CSP (11x11) | MCU - 28, FPGA - 68 | DMA, POR, WDT | ARM | 16KB | 1 | MCU, FPGA | 100MHz | 1536 | ARM® Cortex®-M3 | EBI/EMI, I2C, SPI, UART/USART | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | ||||||||||||||||||||||||||||||||||||||||||||
| 1SX280HN1F43I1VG | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Stratix® 10 SX | -40°C~100°C TJ | 3 (168 Hours) | https://pdf.utmel.com/r/datasheets/intel-1sx165hn1f43i2vg-datasheets-4374.pdf | 1760-BBGA, FCBGA | 12 Weeks | compliant | DMA, WDT | 256KB | MCU, FPGA | 1.5GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FPGA - 2800K Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F060M3E-1CS288I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 100MHz | Non-RoHS Compliant | 2015 | /files/microsemicorporation-a2f060m3etq144-datasheets-5555.pdf | 288-TFBGA, CSPBGA | 99 Weeks | EBI/EMI, I2C, SPI, UART, USART | 100MHz | A2F060M3E | 288-CSP (11x11) | MCU - 28, FPGA - 68 | DMA, POR, WDT | ARM | 16KB | MCU, FPGA | 100MHz | ARM® Cortex®-M3 | EBI/EMI, I2C, SPI, UART/USART | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||
| A2F060M3E-1TQ144 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | 0°C~85°C TJ | Tray | 3 (168 Hours) | 85°C | 0°C | 100MHz | Non-RoHS Compliant | 2015 | /files/microsemicorporation-a2f060m3etq144-datasheets-5555.pdf | 144-LQFP | EBI/EMI, I2C, SPI, UART, USART | A2F060M3E | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | DMA, POR, WDT | ARM | 16KB | MCU, FPGA | 100MHz | ARM® Cortex®-M3 | EBI/EMI, I2C, SPI, UART/USART | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F060M3E-TQG144I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 80MHz | RoHS Compliant | 2011 | /files/microsemicorporation-a2f060m3etq144-datasheets-5555.pdf | 144-LQFP | 12 Weeks | EBI/EMI, I2C, SPI, UART, USART | A2F060M3E | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | DMA, POR, WDT | ARM | 16KB | MCU, FPGA | 80MHz | ARM® Cortex®-M3 | EBI/EMI, I2C, SPI, UART/USART | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F200M3F-1PQ208I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 100MHz | Non-RoHS Compliant | 2015 | /files/microsemicorporation-a2f500m3gfgg484i-datasheets-0641.pdf | 208-BFQFP | 208 | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 100MHz | A2F200 | 208-PQFP (28x28) | MCU - 22, FPGA - 66 | DMA, POR, WDT | ARM | 64KB | MCU, FPGA | 100MHz | ARM® Cortex®-M3 | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 8 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||
| 1SX280HU1F50E2VGS3 | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Stratix® 10 SX | 0°C~100°C TJ | 3 (168 Hours) | /files/intel-1sx165hn1f43i2vg-datasheets-4374.pdf | 2397-BBGA, FCBGA | 8 Weeks | DMA, WDT | 256KB | MCU, FPGA | 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FPGA - 2800K Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 1SX250HN1F43E2LG | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Stratix® 10 SX | 0°C~100°C TJ | 3 (168 Hours) | /files/intel-1sx165hn1f43i2vg-datasheets-4374.pdf | 1760-BBGA, FCBGA | 12 Weeks | compliant | DMA, WDT | 256KB | MCU, FPGA | 1.5GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FPGA - 2500K Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F060M3E-TQG144 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion® | 0°C~85°C TJ | Tray | 3 (168 Hours) | 85°C | 0°C | 80MHz | RoHS Compliant | 2000 | /files/microsemicorporation-a2f060m3etq144-datasheets-5555.pdf | 144-LQFP | 12 Weeks | EBI/EMI, I2C, SPI, UART, USART | A2F060M3E | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | DMA, POR, WDT | ARM | 16KB | MCU, FPGA | 80MHz | ARM® Cortex®-M3 | EBI/EMI, I2C, SPI, UART/USART | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB |
