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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Operating Supply Current | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | REACH SVHC | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Telecom IC Type | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Consumer IC Type | Data Rate | Interface IC Type | Data Bus Width | Frequency (Max) | uPs/uCs/Peripheral ICs Type | Bus Compatibility | Clock Frequency | Data Transfer Rate-Max | Drive Interface Standard |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 89H48H12G3ZAHLG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 | CMOS | 2.9mm | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h48h12g3zahlg-datasheets-2172.pdf | FCBGA | 27mm | 27mm | Lead Free | 676 | 676 | PCI Express | yes | 3.2mm | Copper, Silver, Tin | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 1mm | 676 | COMMERCIAL | 70°C | 1.1V | 0.95V | NOT SPECIFIED | BUS CONTROLLER, PCI | ISA; SMBUS; VGA | 96000 MBps | |||||||||||||||||||||||||||||||||||
| 89HPES12N3AZGBCI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 | CMOS | 1.5mm | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes12n3azgbci-datasheets-8070.pdf | 19mm | 19mm | 324 | no | EAR99 | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1V | 1mm | 324 | INDUSTRIAL | 85°C | -40°C | 1.1V | 0.9V | 20 | Bus Controllers | 13.3V | Not Qualified | S-PBGA-B324 | BUS CONTROLLER, PCI | PCI | 125MHz | |||||||||||||||||||||||||||||||||||
| ISL54106ACRZ | Intersil (Renesas Electronics America) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 | RoHS Compliant | QFN | 72 | 17 Weeks | I2C | EAR99 | 8542.39.00.01 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | NO LEAD | 0.5mm | COMMERCIAL | 70°C | Other Consumer ICs | 3.3V | 405mA | Not Qualified | S-PQCC-N72 | CONSUMER CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||||||
| 89HPES24T3G2ZBBL8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 4 | 70°C | 0°C | CMOS | 3.22mm | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes24t3g2zbbl8-datasheets-0241.pdf | FCBGA | 27mm | 27mm | Contains Lead | 676 | 10 Weeks | 676 | PCI Express | no | 3.4mm | EAR99 | HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. | Lead, Tin | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1V | 1mm | 676 | COMMERCIAL | 1.1V | 0.9V | NOT SPECIFIED | BUS CONTROLLER, PCI | SMBUS | 625 MBps | |||||||||||||||||||||||||||||
| 89HPES24T61ZCBXG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 3 | 70°C | 0°C | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes24t61zcbxg8-datasheets-9394.pdf | BGA | 420 | 420 | PCI Express | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 3.3V | 1mm | COMMERCIAL | Bus Controllers | 3.3V | Not Qualified | |||||||||||||||||||||||||||||||||||||||||||||
| 89H32NT8BG2ZCHLI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 | 85°C | -40°C | CMOS | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h32nt8bg2zchli-datasheets-9190.pdf | FCBGA | 23mm | 23mm | 3.3V | Contains Lead | 484 | 10 Weeks | 484 | PCI Express | no | 2.92mm | 8 | EAR99 | ALSO OPERATES AT 100 MHZ | Lead, Tin | not_compliant | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1V | 1mm | 484 | INDUSTRIAL | 1.1V | NOT SPECIFIED | Bus Controllers | 3400mA | Not Qualified | 256 Gbps | 125MHz | BUS CONTROLLER, PCI | I2C; ISA; VGA | |||||||||||||||||||||||||||
| 89HPES24T6ZGBX | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | CMOS | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes24t6zgbx-datasheets-8839.pdf | 27mm | 1.7mm | 27mm | Contains Lead | 420 | 10 Weeks | 420 | PCI Express | no | 1.7mm | EAR99 | ALSO REQUIRES 3.3V SUPPLY | Lead, Tin | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 420 | COMMERCIAL | 1.1V | 0.9V | 20 | Bus Controllers | 3.3V | Not Qualified | BUS CONTROLLER, PCI | PCI | 125MHz | ||||||||||||||||||||||||||||
| 89HPES24T61ZCBXG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 | 70°C | 0°C | CMOS | 1.7mm | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes24t61zcbxg-datasheets-8530.pdf | BGA | 27mm | 27mm | 420 | 10 Weeks | 420 | PCI Express | yes | EAR99 | ALSO REQUIRES 3.3V SUPPLY | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 1mm | 420 | COMMERCIAL | 1.1V | 0.9V | 30 | Bus Controllers | 3.3V | Not Qualified | BUS CONTROLLER, PCI | PCI | 125MHz | |||||||||||||||||||||||||||||||
| 89HPES16T4G2ZABXG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 | 70°C | 0°C | CMOS | 1.7mm | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes16t4g2zabxg8-datasheets-8330.pdf | 23mm | 23mm | Lead Free | 288 | 10 Weeks | 288 | PCI Express | yes | 1.1mm | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | e1 | TIN SILVER COPPER | BOTTOM | BALL | 260 | 1V | 288 | COMMERCIAL | 1.1V | 0.9V | NOT SPECIFIED | Bus Controllers | 1.22.53.3V | Not Qualified | BUS CONTROLLER, PCI | PCI; SMBUS | 125MHz | 16000 MBps | |||||||||||||||||||||||||||||
| 89HPES4T4ZBNQG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | CMOS | 0.9mm | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes4t4zbnqg-datasheets-8329.pdf | 10mm | 10mm | Lead Free | 132 | 10 Weeks | 132 | PCI Express | yes | 900μm | EAR99 | Tin | 8542.39.00.01 | e3 | QUAD | NO LEAD | 260 | 1V | 0.65mm | 132 | COMMERCIAL | 70°C | 1.1V | 0.9V | NOT SPECIFIED | Bus Controllers | 13.3V | Not Qualified | BUS CONTROLLER, PCI | PCI | 125MHz | ||||||||||||||||||||||||||||||||
| 89HPES4T4G2ZBAL8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 70°C | 0°C | Non-RoHS Compliant | 2009 | /files/integrateddevicetechnology-89hpes4t4g2zbal8-datasheets-7996.pdf | FCBGA | 19mm | 3.27mm | 19mm | Contains Lead | 10 Weeks | 324 | PCI Express | no | 3.27mm | EAR99 | Lead, Tin | not_compliant | 8542.39.00.01 | 324 | |||||||||||||||||||||||||||||||||||||||||||||||
| TSI107D-100JE | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 | 105°C | 0°C | CMOS | RoHS Compliant | 1999 | /files/integrateddevicetechnology-tsi107d100je-datasheets-7259.pdf | FCBGA | 33mm | 33mm | Contains Lead | 503 | 503 | no | 2.75mm | 3A001.A.3 | No | 8542.31.00.01 | e0 | TIN LEAD | YES | BOTTOM | BALL | 225 | 2.5V | 1.27mm | 503 | 2.625V | 2.375V | 30 | BUS CONTROLLER, PCI | POWERPC 60X | 66MHz | ||||||||||||||||||||||||||||||||||||
| QLX4300SIQSR | Intersil (Renesas Electronics America) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 | 70°C | 0°C | 260mA | 0.75mm | RoHS Compliant | 2009 | /files/intersil-qlx4300siqsr-datasheets-5936.pdf | QFN EP | 7mm | 4mm | 1.2V | 46 | 9 Weeks | 1.3V | 1.1V | 46 | 2-Wire, I2C, SMBus | 8542.39.00.01 | 1 | 260mA | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | NO LEAD | 260 | 1.2V | 0.4mm | 46 | COMMERCIAL | TELECOM CIRCUIT | 30 | Other Telecom ICs | Not Qualified | 3.125 Gbps | |||||||||||||||||||||||||||||||||
| 89H32NT8BG2ZCHLI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 85°C | -40°C | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h32nt8bg2zchli8-datasheets-5836.pdf | FCBGA | 23mm | 2.92mm | 23mm | 3.3V | Contains Lead | 10 Weeks | 484 | PCI Express | no | 2.92mm | 8 | Lead, Tin | 484 | 256 Gbps | 125MHz | BUS CONTROLLER, PCI | ||||||||||||||||||||||||||||||||||||||||||||||
| ISL35411DRZ-TS | Intersil (Renesas Electronics America) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 | 85°C | 0°C | 300mA | 0.75mm | RoHS Compliant | 2005 | /files/intersil-isl35411drzts-datasheets-5388.pdf | QFN | 7mm | 4mm | 1.2V | 46 | 9 Weeks | 1.3V | 1.1V | 46 | EAR99 | No | 8542.39.00.01 | 300mA | e3 | Matte Tin (Sn) - annealed | QUAD | 0.4mm | 46 | 11.1 Gbps | LINE TRANSCEIVER | ||||||||||||||||||||||||||||||||||||||||
| TSI109-200IL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 | CMOS | 2.76mm | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-tsi109200il-datasheets-5322.pdf | FCBGA | 33mm | 33mm | Contains Lead | 7 Weeks | 1023 | PCI | no | 2mm | EAR99 | No | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1.2V | 1mm | INDUSTRIAL | 85°C | -40°C | 1.26V | 1.14V | POWERPC 60X | 33.33MHz | ||||||||||||||||||||||||||||||||||||
| TSI381-66IL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 85°C | -40°C | CMOS | 1.8mm | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-tsi38166il-datasheets-4610.pdf | BGA | 13mm | 13mm | 3.3V | Contains Lead | 144 | 10 Weeks | 144 | PCI | no | 1.4mm | EAR99 | No | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1.2V | 1mm | 144 | INDUSTRIAL | 1.26V | 32b | 66MHz | PCI | |||||||||||||||||||||||||||||||||
| TSI381-66ILV | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 85°C | -40°C | CMOS | 1.8mm | RoHS Compliant | 1999 | /files/integrateddevicetechnology-tsi38166ilv-datasheets-5181.pdf | BGA | 13mm | 13mm | 3.3V | Lead Free | 144 | 10 Weeks | 144 | yes | 1.4mm | EAR99 | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 1mm | 144 | INDUSTRIAL | 1.26V | 30 | 32b | 66MHz | BUS CONTROLLER, PCI | PCI | IEEE 1149.6; IEEE 1149.1 | ||||||||||||||||||||||||||||||
| CA91C142D-33IE | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 85°C | -40°C | CMOS | 3.5mm | RoHS Compliant | 2004 | /files/integrateddevicetechnology-ca91c142d33ie-datasheets-3910.pdf | BGA | 35mm | 35mm | 5V | Contains Lead | 313 | 8 Weeks | 313 | no | 2.3mm | EAR99 | Lead, Tin | No | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 5V | 2.54mm | 313 | INDUSTRIAL | 20 | Bus Controllers | 5V | 560 Mbps | 33MHz | BUS CONTROLLER, VME | PCI | 70 MBps | |||||||||||||||||||||||||||||
| 89HPES24N3A2ZCBXG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes24n3a2zcbxg-datasheets-4973.pdf | BGA | 10 Weeks | 420 | PCI Express | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 89HPES16T4G2ZBBXG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | CMOS | 1.7mm | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes16t4g2zbbxg-datasheets-3387.pdf | 23mm | 23mm | Lead Free | 288 | 288 | PCI Express | yes | 1.1mm | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 288 | COMMERCIAL | 1.1V | 0.9V | 30 | Bus Controllers | 12.53.3V | 908mA | Not Qualified | BUS CONTROLLER, PCI | PCI | 125MHz | |||||||||||||||||||||||||||||||
| 89H32NT8BG2ZCHLGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 | 85°C | -40°C | CMOS | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h32nt8bg2zchlgi-datasheets-2982.pdf | FCBGA | 23mm | 23mm | 3.3V | Lead Free | 484 | 10 Weeks | 484 | PCI Express | yes | 2.92mm | 8 | EAR99 | ALSO OPERATES AT 100 MHZ | Copper, Silver, Tin | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 1V | 1mm | 484 | INDUSTRIAL | 1.1V | NOT SPECIFIED | Bus Controllers | 3400mA | Not Qualified | 256 Gbps | 125MHz | BUS CONTROLLER, PCI | I2C; ISA; VGA | ||||||||||||||||||||||||||||
| ISL54100CQZ | Intersil (Renesas Electronics America) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 2A | 70°C | 0°C | 3.4mm | RoHS Compliant | 2004 | /files/intersil-isl54100cqz-datasheets-2256.pdf | 20mm | 14mm | 128 | 17 Weeks | No SVHC | 3.3V | 128 | I2C | 8542.39.00.01 | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 0.5mm | 128 | COMMERCIAL | 3V | 30 | Not Qualified | CONSUMER CIRCUIT | ||||||||||||||||||||||||||||||||||||||||
| 89HPES12T3G2ZABC8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 | 70°C | 0°C | CMOS | 1.72mm | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes12t3g2zabc8-datasheets-2202.pdf | BGA | 19mm | 19mm | Contains Lead | 324 | 10 Weeks | 324 | PCI Express | no | 1.4mm | EAR99 | Lead, Tin | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 324 | COMMERCIAL | 1.1V | 0.9V | NOT SPECIFIED | Bus Controllers | 3.3V | Not Qualified | BUS CONTROLLER, PCI | PCI; SMBUS | 125MHz | 12000 MBps | ||||||||||||||||||||||||||
| 89H64H16G2ZCBL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 | CMOS | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h64h16g2zcbl-datasheets-1442.pdf | FCBGA | 35mm | 2.82mm | 35mm | Contains Lead | 10 Weeks | 1156 | PCI Express | no | 2.82mm | EAR99 | Lead, Tin | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1V | 1mm | COMMERCIAL | 70°C | 1.1V | 0.9V | NOT SPECIFIED | Bus Controllers | 12.5/3.3V | Not Qualified | BUS CONTROLLER, PCI | I2C; ISA; PCI; SMBUS; VGA | 125MHz | 64000 MBps | ||||||||||||||||||||||||||||||
| 89HPES48T12ZABL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 | CMOS | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes48t12zabl-datasheets-0863.pdf | FCBGA | 35mm | 2.82mm | 35mm | Contains Lead | 10 Weeks | 1156 | PCI Express | no | 2.82mm | EAR99 | ALSO REQUIRES 3.3V SUPPLY | Lead, Tin | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1V | 1mm | COMMERCIAL | 70°C | 1.1V | 0.9V | NOT SPECIFIED | Bus Controllers | 13.3V | 2635mA | Not Qualified | BUS CONTROLLER, PCI | PCI | 125MHz | |||||||||||||||||||||||||||||
| 89H48T12G2ZDBLG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h48t12g2zdblg-datasheets-3893.pdf | FCBGA | 10 Weeks | PCI Express | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 89HPES24T3G2ZBBLG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 4 | 70°C | 0°C | CMOS | 3.22mm | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes24t3g2zbblg8-datasheets-0365.pdf | FCBGA | 27mm | 27mm | Lead Free | 676 | 10 Weeks | 676 | PCI Express | yes | 3.4mm | EAR99 | HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 1mm | 676 | COMMERCIAL | 1.1V | 0.9V | NOT SPECIFIED | BUS CONTROLLER, PCI | SMBUS | 625 MBps | ||||||||||||||||||||||||||||||
| 89HPES8NT2ZBBCG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 | CMOS | 1.5mm | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes8nt2zbbcg-datasheets-3724.pdf | BGA | 19mm | 19mm | 324 | 10 Weeks | 324 | PCI Express | yes | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 1mm | 324 | COMMERCIAL | 70°C | 1.1V | 0.9V | 30 | Bus Controllers | 13.3V | Not Qualified | BUS CONTROLLER, PCI | PCI | 125MHz | |||||||||||||||||||||||||||||||||
| 89H32NT8BG2ZCHLGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 85°C | -40°C | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h32nt8bg2zchlgi8-datasheets-9894.pdf | FCBGA | 23mm | 2.92mm | 23mm | 3.3V | Lead Free | 10 Weeks | 484 | PCI Express | yes | 2.92mm | 8 | Copper, Silver, Tin | 484 | 256 Gbps | 125MHz | BUS CONTROLLER, PCI |
