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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Operating Supply Current | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Lifecycle Status | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Halogen Free | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Operating Temperature (Max) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | Source Url Status Check Date | Screening Level | Consumer IC Type | Data Rate | Sampling Rate | Interface IC Type | Number of I/O | Data Bus Width | Output Type | Frequency (Max) | Quiescent Current | uPs/uCs/Peripheral ICs Type | Number of Inputs | Bus Compatibility | Boundary Scan | Number of DMA Channels | Clock Frequency | Data Transfer Rate-Max | Address Bus Width | External Data Bus Width | Drive Interface Standard | Current - Output |
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| 89HPES24T6ZGBXG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | CMOS | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes24t6zgbxg-datasheets-9499.pdf | 27mm | 27mm | Lead Free | 420 | 10 Weeks | 420 | PCI Express | yes | 1.7mm | EAR99 | ALSO REQUIRES 3.3V SUPPLY | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 1mm | 420 | COMMERCIAL | 1.1V | 0.9V | 30 | Bus Controllers | 3.3V | Not Qualified | BUS CONTROLLER, PCI | PCI | 125MHz | ||||||||||||||||||||||||||||||||||||||||||
| SAP5SD-A-G1-R | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 | 85°C | -25°C | RoHS Compliant | 2016 | /files/integrateddevicetechnology-sap5sdag1r-datasheets-9371.pdf | SOP | 12.8mm | 7.6mm | Lead Free | 16 Weeks | 34V | 16V | 20 | 2-Wire, Serial, UART | yes | 2.34mm | 6mA | e3 | Tin (Sn) | 260 | 20 | ANALOG CIRCUIT | NOT SPECIFIED | Voltage | 4 | 10mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 89HPES12T3G2ZABC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | CMOS | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes12t3g2zabc-datasheets-9178.pdf | BGA | 19mm | 1.4mm | 19mm | Contains Lead | 324 | 10 Weeks | 324 | PCI Express | no | 1.4mm | EAR99 | Lead, Tin | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 324 | COMMERCIAL | 1.1V | 0.9V | NOT SPECIFIED | Bus Controllers | 3.3V | Not Qualified | BUS CONTROLLER, PCI | PCI | 125MHz | ||||||||||||||||||||||||||||||||||||||||
| TSI107D-133LEY | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 105°C | 0°C | CMOS | RoHS Compliant | 1999 | /files/integrateddevicetechnology-tsi107d133ley-datasheets-9029.pdf | FCBGA | 33mm | 33mm | Contains Lead | 503 | 503 | PCI | no | 2.75mm | EAR99 | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 1.27mm | 503 | 2.625V | 2.375V | 64 | YES | 66MHz | ||||||||||||||||||||||||||||||||||||||||||||||||
| 89HT0816PYBBCGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Bulk | 85°C | -40°C | RoHS Compliant | Copper, Silver, Tin | 8 Gbps | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 89HPES24N3AZGBX | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | CMOS | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes24n3azgbx-datasheets-8635.pdf | 27mm | 27mm | Contains Lead | 420 | 10 Weeks | 420 | PCI Express | no | 1.7mm | EAR99 | ALSO REQUIRES 3.3V SUPPLY | Lead, Tin | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 420 | COMMERCIAL | 1.1V | 0.9V | 20 | Bus Controllers | 3.3V | Not Qualified | BUS CONTROLLER, PCI | PCI | 125MHz | |||||||||||||||||||||||||||||||||||||||||
| 89HPES24N3AZCBX | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | CMOS | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes24n3azcbx-datasheets-8462.pdf | 27mm | 27mm | Contains Lead | 420 | 10 Weeks | 420 | PCI Express | no | 1.7mm | EAR99 | ALSO REQUIRES 3.3V SUPPLY | Lead, Tin | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 420 | COMMERCIAL | 1.1V | 0.9V | 20 | Bus Controllers | 3.3V | Not Qualified | BUS CONTROLLER, PCI | PCI | 125MHz | |||||||||||||||||||||||||||||||||||||||||
| TSI340-66CQY | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 | 85°C | 0°C | CMOS | 3.4mm | RoHS Compliant | 1999 | /files/integrateddevicetechnology-tsi34066cqy-datasheets-8394.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 128 | 10 Weeks | 503.487531mg | 128 | yes | 2.9mm | EAR99 | No | 8542.39.00.01 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 128 | OTHER | 3.6V | Bus Controllers | 715mA | 32b | 66MHz | BUS CONTROLLER, PCI | PCI | ||||||||||||||||||||||||||||||||||||||||||
| 89H32NT8BG2ZCHLG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 | 70°C | 0°C | CMOS | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h32nt8bg2zchlg-datasheets-6974.pdf | FCBGA | 23mm | 23mm | 3.3V | Lead Free | 484 | 10 Weeks | 484 | PCI Express | yes | 2.92mm | 8 | EAR99 | ALSO OPERATES AT 100 MHZ | Copper, Silver, Tin | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 1V | 1mm | 484 | COMMERCIAL | 1.1V | NOT SPECIFIED | Bus Controllers | 3400mA | Not Qualified | 256 Gbps | 125MHz | BUS CONTROLLER, PCI | I2C; ISA; VGA | ||||||||||||||||||||||||||||||||||||||||
| CS82C37A | Intersil (Renesas Electronics America) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | CMOS | RoHS Compliant | 1996 | /files/intersil-cs82c37a-datasheets-6521.pdf | PLCC | Contains Lead | 44 | 44 | no | 8542.31.00.01 | e0 | Tin/Lead (Sn/Pb) | QUAD | J BEND | 5V | 1.27mm | 44 | COMMERCIAL | 5.5V | 4.5V | DMA Controllers | 5V | 16mA | Not Qualified | DMA CONTROLLER | 80C286; 80286; 80186; 80C86; 8086; 80C88; 8088; 8085; Z80; NSC800 | 4 | 8MHz | 16 | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||
| ASI4UE-G1-SR | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 1 | 85°C | -25°C | CMOS | 6mA | 1.99mm | RoHS Compliant | /files/integrateddevicetechnology-asi4ueg1sr-datasheets-5593.pdf | SSOP | 10.2mm | 5.3mm | Lead Free | 28 | 20 Weeks | 33.1V | 16V | 28 | 2-Wire, Serial, UART | yes | 1.73mm | 1 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | GULL WING | 260 | 30V | 0.65mm | 28 | OTHER | 30 | 4 | |||||||||||||||||||||||||||||||||||||||||||||||
| AD9393BBCZRL-80 | Analog Devices Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 3 | 80°C | -10°C | CMOS | 109mA | 1.4mm | RoHS Compliant | /files/analogdevices-ad9393bbczrl80-datasheets-5588.pdf | BGA | 6mm | 6mm | 3.3V | Contains Lead | 76 | 76 | Analog | PRODUCTION (Last Updated: 1 week ago) | no | EAR99 | No | 8542.39.00.01 | 1 | 109mA | e1 | TIN SILVER COPPER | BOTTOM | BALL | 260 | 0.5mm | 76 | COMMERCIAL EXTENDED | 3.47V | 1.7V | 40 | 2013-05-01 14:56:30.707 | CONSUMER CIRCUIT | 80 Msps | |||||||||||||||||||||||||||||||||||||||||||
| TSI109-200CLY | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 | CMOS | 2.76mm | RoHS Compliant | 1999 | /files/integrateddevicetechnology-tsi109200cly-datasheets-5334.pdf | FCBGA | 33mm | 33mm | Contains Lead | 7 Weeks | 1023 | PCI | no | 2mm | EAR99 | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 1mm | COMMERCIAL | 70°C | 1.26V | 1.14V | POWERPC 60X | 33.33MHz | |||||||||||||||||||||||||||||||||||||||||||||||||
| 89H32NT8BG2ZCHLG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h32nt8bg2zchlg8-datasheets-4039.pdf | FCBGA | 23mm | 2.92mm | 23mm | 3.3V | Lead Free | 10 Weeks | 484 | PCI Express | yes | 2.92mm | 8 | Copper, Silver, Tin | 484 | 256 Gbps | 125MHz | BUS CONTROLLER, PCI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 89HPES12N3A2ZCBCG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes12n3a2zcbcg8-datasheets-1294.pdf | BGA | 10 Weeks | 324 | PCI Express | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 89HPES24N3AZGBXG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | CMOS | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes24n3azgbxg-datasheets-3334.pdf | 27mm | 27mm | Lead Free | 420 | 10 Weeks | 420 | PCI Express | yes | 1.7mm | EAR99 | ALSO REQUIRES 3.3V SUPPLY | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 1mm | 420 | COMMERCIAL | 1.1V | 0.9V | 30 | Bus Controllers | 3.3V | Not Qualified | BUS CONTROLLER, PCI | PCI | 125MHz | ||||||||||||||||||||||||||||||||||||||||||
| 89HPEB383ZAEM | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 85°C | 0°C | CMOS | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpeb383zaem-datasheets-1059.pdf | TQFP | 14mm | 1mm | 14mm | 5V | Contains Lead | 128 | 503.487531mg | 128 | PCI Express | no | 1mm | No | 8542.31.00.01 | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 240 | 1.05V | 0.4mm | 128 | COMMERCIAL | 20 | 32b | 33MHz | BUS CONTROLLER, PCI | ISA; PCI; SBUS; VGA; USB | 2500 MBps | ||||||||||||||||||||||||||||||||||||||||||||
| TSI384-133ILV | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 85°C | -40°C | CMOS | 1.8mm | RoHS Compliant | 1999 | /files/integrateddevicetechnology-tsi384133ilv-datasheets-2691.pdf | BGA | 17mm | 17mm | 1.2V | Lead Free | 256 | 10 Weeks | 1.724105g | 256 | yes | 1.61mm | EAR99 | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 256 | INDUSTRIAL | 1.26V | Bus Controllers | 8 Gbps | 133MHz | BUS CONTROLLER, PCI | PCI | IEEE 1149.6; IEEE 1149.1 | |||||||||||||||||||||||||||||||||||||||||||
| TSI350-66CQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | CMOS | Non-RoHS Compliant | 2014 | /files/integrateddevicetechnology-tsi35066cq-datasheets-0721.pdf | PQFP | 28mm | 3.5mm | 28mm | Contains Lead | 208 | 10 Weeks | 208 | PCI | no | 3.5mm | EAR99 | No | 8542.39.00.01 | e0 | TIN LEAD | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 208 | OTHER | 85°C | 3.6V | 3V | ISA; VGA | ||||||||||||||||||||||||||||||||||||||||||||||||
| 89H12NT12G2ZAHLGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 85°C | -40°C | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h12nt12g2zahlgi8-datasheets-0412.pdf | FCBGA | 3.3V | PCI Express | 12 | 96 Gbps | 125MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 89H34H16G2ZCBLGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 | 85°C | -40°C | CMOS | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h34h16g2zcblgi-datasheets-1302.pdf | FCBGA | 35mm | 2.82mm | 35mm | Lead Free | 10 Weeks | 1156 | PCI Express | yes | 2.82mm | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 1mm | INDUSTRIAL | 1.1V | 0.9V | NOT SPECIFIED | Bus Controllers | 12.52.5/3.3V | 6264mA | Not Qualified | BUS CONTROLLER, PCI | I2C; ISA; PCI; SMBUS; VGA | 125MHz | 34000 MBps | |||||||||||||||||||||||||||||||||||||||||
| 89H32NT8BG2ZCHL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 | 70°C | 0°C | CMOS | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h32nt8bg2zchl-datasheets-0804.pdf | FCBGA | 23mm | 2.92mm | 23mm | 3.3V | Contains Lead | 484 | 10 Weeks | 484 | PCI Express | no | 2.92mm | 8 | EAR99 | ALSO OPERATES AT 100 MHZ | Lead, Tin | not_compliant | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1V | 1mm | 484 | COMMERCIAL | 1.1V | NOT SPECIFIED | Bus Controllers | 3400mA | Not Qualified | 256 Gbps | 125MHz | BUS CONTROLLER, PCI | I2C; ISA; VGA | ||||||||||||||||||||||||||||||||||||||
| 89HPES16T4G2ZABXG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | CMOS | 1.7mm | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes16t4g2zabxg-datasheets-0801.pdf | 23mm | 23mm | Lead Free | 288 | 10 Weeks | 288 | PCI Express | yes | 1.1mm | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | e1 | TIN SILVER COPPER | BOTTOM | BALL | 260 | 1V | 288 | COMMERCIAL | 1.1V | 0.9V | 30 | Bus Controllers | 1.22.53.3V | Not Qualified | BUS CONTROLLER, PCI | PCI | 125MHz | |||||||||||||||||||||||||||||||||||||||||||
| TLE9260QXV33XUMA1 | Infineon |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 | 150°C | -40°C | 0.9mm | RoHS Compliant | /files/infineon-tle9260qxv33xuma1-datasheets-0802.pdf | VQFN | 7mm | 7mm | Lead Free | 48 | 48 | yes | 8542.39.00.01 | 1 | Halogen Free | YES | QUAD | NO LEAD | NOT SPECIFIED | 13.5V | 0.5mm | 28V | 5.5V | NOT SPECIFIED | AEC-Q100 | INTERFACE CIRCUIT | 15A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CA91L8200B-100CE | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 | 70°C | 0°C | CMOS | 2.46mm | Non-RoHS Compliant | 2014 | /files/integrateddevicetechnology-ca91l8200b100ce-datasheets-9906.pdf | 37.5mm | 37.5mm | 3.3V | Contains Lead | 480 | 480 | no | 2.33mm | 3A001.A.3 | Lead, Tin | not_compliant | 8542.31.00.01 | e0 | TIN LEAD | BOTTOM | BALL | NOT SPECIFIED | 2.5V | 1.27mm | 480 | COMMERCIAL | 2.63V | NOT SPECIFIED | Not Qualified | 66MHz | BUS CONTROLLER, PCI | MPC8260; POWERPC 603E; POWERPC 7400; POWERPC 740; POWERPC 750 | ||||||||||||||||||||||||||||||||||||||||||||
| 89HPES16H16ZABLI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 85°C | -40°C | CMOS | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes16h16zabli-datasheets-9714.pdf | FCBGA | 23mm | 3.34mm | 23mm | Contains Lead | 484 | 10 Weeks | 484 | PCI Express | no | 3.34mm | EAR99 | Lead, Tin | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 484 | COMMERCIAL | 1.1V | 0.9V | NOT SPECIFIED | Bus Controllers | 13.3V | Not Qualified | BUS CONTROLLER, PCI | PCI | 125MHz | ||||||||||||||||||||||||||||||||||||||||
| 89HPES24T6ZCBXG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | CMOS | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes24t6zcbxg-datasheets-9715.pdf | 27mm | 27mm | Lead Free | 420 | 10 Weeks | 420 | PCI Express | yes | 1.7mm | EAR99 | ALSO REQUIRES 3.3V SUPPLY | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 1mm | 420 | COMMERCIAL | 1.1V | 0.9V | 30 | Bus Controllers | 3.3V | Not Qualified | BUS CONTROLLER, PCI | PCI | 125MHz | ||||||||||||||||||||||||||||||||||||||||||
| TSI148-133CL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 | CMOS | 2.36mm | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-tsi148133cl-datasheets-9407.pdf | BGA | 27mm | 27mm | Contains Lead | 456 | 456 | no | 2.65mm | EAR99 | ALSO OPERATES AT 3.3V SUPPLY | No | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | 225 | 1.8V | 1mm | 456 | COMMERCIAL | 70°C | 1.95V | 1.65V | BUS CONTROLLER, VME | PCI | 133MHz | IEEE 1149.1 | |||||||||||||||||||||||||||||||||||||||||||||
| CA91C142D-25EE | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 | 125°C | -55°C | CMOS | 3.5mm | Non-RoHS Compliant | 2010 | /files/integrateddevicetechnology-ca91c142d25ee-datasheets-9539.pdf | BGA | 35mm | 35mm | 5V | Contains Lead | 313 | 8 Weeks | 313 | no | 2.3mm | 3A001.A.2.C | Lead, Tin | No | 8542.31.00.01 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 5V | 2.54mm | 313 | MILITARY | Bus Controllers | 5V | 560 Mbps | 33MHz | BUS CONTROLLER, VME | PCI | 70 MBps | |||||||||||||||||||||||||||||||||||||||||
| CA91C142D-33CEV | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.5mm | RoHS Compliant | 2004 | /files/integrateddevicetechnology-ca91c142d33cev-datasheets-8811.pdf | 35mm | 35mm | 5V | Lead Free | 313 | 8 Weeks | 313 | yes | 2.3mm | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 5V | 2.54mm | 313 | COMMERCIAL | NOT SPECIFIED | Bus Controllers | 5V | Not Qualified | 560 Mbps | 33MHz | BUS CONTROLLER, VME | PCI | 70 MBps |
