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ContactTelecom Interface ICs(3995)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Lifecycle Status | Pbfree Code | Number of Ports | Additional Feature | Contact Plating | Radiation Hardening | Max Frequency | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Max Power Dissipation | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Temperature Grade | Telecom IC Type | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Time@Peak Reflow Temperature-Max (s) | Power Dissipation | Subcategory | Power Supplies | Supply Current-Max | Number of Circuits | Qualification Status | JESD-30 Code | Supplier Device Package | Consumer IC Type | Data Rate | Turn On Delay Time | Turn-Off Delay Time | Dual Supply Voltage | Function | Min Dual Supply Voltage | Power (Watts) | Number of Outputs | uPs/uCs/Peripheral ICs Type | Number of Inputs | Boundary Scan | Low Power Mode | Format | Output Low Current-Max | Barrel Shifter | Filter | Companding Law | Neg Supply Voltage-Nom | ISDN Access Rate | Reference Point | Output High Voltage-Min | Output Low Voltage-Max | Battery Feed | PSRR-Min | Noise-Max | Hybrid |
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| CYG2000 | IXYS / Littelfuse |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Cybergate™ | Through Hole | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | 70°C | 0°C | 8mA | 8mA | Non-RoHS Compliant | 2001 | /files/ixysintegratedcircuitsdivision-cyg2030-datasheets-5668.pdf | 18-DIP Module (0.850, 21.59mm), 11 Leads | 1kV | Contains Lead | 8 Weeks | 9 | 5V | 1 | 18-DIP | Data Access Arrangement (DAA) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT8980DP1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | CMOS | 6mA | 4.57mm | ROHS3 Compliant | 2006 | /files/microchiptechnology-mt8980dpr1-datasheets-6158.pdf | 44-LCC (J-Lead) | 5V | Lead Free | 6mA | 44 | 7 Weeks | 2.386605g | 44 | yes | 8 | No | e3 | MATTE TIN | 2W | 4.75V~5.25V | QUAD | J BEND | 260 | 5V | 30 | Other Telecom ICs | 5V | 1 | Switch | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT9173ANR1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 10mA | 2mm | ROHS3 Compliant | /files/microsemicorporation-mt9173ae-datasheets-2180.pdf | SSOP | 8.2mm | 5.3mm | 5V | Lead Free | 24 | 8 Weeks | No | e3 | MATTE TIN | 4.75V~5.25V | DUAL | GULL WING | 260 | 5V | 0.65mm | DIGITAL SLIC | 30 | Digital Transmission Interfaces | 5V | 1 | R-PDSO-G24 | 24-SSOP | 160 kbps | Subscriber Line Interface Concept (SLIC) | 0.005A | BASIC | S | 2.4V | 0.4V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT8986APR1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 10mA | 4.57mm | ROHS3 Compliant | 2001 | /files/microchiptechnology-mt8986apr1-datasheets-6260.pdf | 44-LCC (J-Lead) | 5V | 44 | 7 Weeks | 44 | yes | No | e3 | MATTE TIN | 4.75V~5.25V | QUAD | J BEND | 260 | 5V | 30 | Other Telecom ICs | 5V | 1 | Switch | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT9172AP1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | CMOS | 10mA | 4.57mm | ROHS3 Compliant | /files/microchiptechnology-mt9171anr1-datasheets-2697.pdf | 28-LCC (J-Lead) | 5V | 28 | 8 Weeks | 28 | IN PRODUCTION (Last Updated: 1 month ago) | No | e3 | MATTE TIN | 4.75V~5.25V | QUAD | J BEND | 5V | DIGITAL SLIC | 1 | 160 kbps | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT9126AS1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | CMOS | 4.096MHz | 5mA | 2.65mm | ROHS3 Compliant | /files/microchiptechnology-mt9126as1-datasheets-6265.pdf | 28-SOIC (0.295, 7.50mm Width) | 17.9mm | 7.5mm | 5V | 28 | 8 Weeks | 2.214806g | 28 | Serial | yes | No | e3 | MATTE TIN | 500mW | 4.5V~5.5V | DUAL | GULL WING | 260 | 5V | 1.27mm | ADPCM CODEC | 30 | Codecs | 5V | 4 | 64 kbps | Telecom Circuit | NO | A/MU-LAW | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CYG2111 | IXYS / Littelfuse |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Cybergate™ | Through Hole | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | 70°C | 0°C | 8mA | 8mA | ROHS3 Compliant | 2012 | /files/ixys-cyg2111-datasheets-5446.pdf | 18-DIP Module (0.850, 21.59mm), 9 Leads | 5V | Lead Free | 8 Weeks | 20V | 4.5V | 9 | 5V | 1 | 18-DIP | Data Access Arrangement (DAA) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE79128KVC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 128-TQFP | 10 Weeks | 2-Wire | IN PRODUCTION (Last Updated: 1 month ago) | 128-TQFP | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT9172APR1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 10mA | 4.57mm | ROHS3 Compliant | 2001 | /files/microchiptechnology-mt9171anr1-datasheets-2697.pdf | 28-LCC (J-Lead) | 5V | 28 | 8 Weeks | No | e3 | MATTE TIN | 4.75V~5.25V | QUAD | J BEND | 260 | 5V | DIGITAL SLIC | 30 | 1 | S-PQCC-J28 | 160 kbps | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SI3019-F-FS | Silicon Labs |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Integrated Circuit (IC) | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | 8.5mA | RoHS Compliant | 1999 | /files/siliconlabs-si3050e1ftr-datasheets-2949.pdf | 16-SOIC (0.154, 3.90mm Width) | 9.9mm | 3.9mm | 3.3V | Lead Free | 16 | 8 Weeks | 189.318115mg | 16 | GCI, PCM, SPI | yes | Tin | No | 8.192MHz | 8.5mA | YES | 3V~3.6V | DUAL | GULL WING | SI3019 | 3.6V | 3V | 1 | Direct Access Arrangement (DAA) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE79124KVCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.2mm | ROHS3 Compliant | 128-TQFP | 14mm | 14mm | 128 | 10 Weeks | 2-Wire | IN PRODUCTION (Last Updated: 1 month ago) | QUAD | GULL WING | 1.8V | 0.4mm | INDUSTRIAL | 85°C | -40°C | 1.89V | 1.71V | S-PQFP-G128 | DIGITAL SIGNAL PROCESSOR, OTHER | NO | YES | FIXED POINT | NO | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 82V2051EPPG8 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/renesaselectronicsamericainc-82v2051epp-datasheets-0685.pdf | 44-LQFP | 14 Weeks | LIU | 3.13V~3.47V | IDT82V2051 | 44-TQFP (10x10) | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT8980DE1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -40°C~85°C | Tube | 1 (Unlimited) | 6mA | ROHS3 Compliant | /files/microchiptechnology-mt8980dpr1-datasheets-6158.pdf | 40-DIP (0.620, 15.75mm) | 8 Weeks | 4.75V~5.25V | 1 | 40-PDIP | Switch | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE79128KVCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2011 | 128-TQFP | 10 Weeks | 2-Wire | IN PRODUCTION (Last Updated: 1 month ago) | 128-TQFP | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CYG2020 | IXYS / Littelfuse |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Cybergate™ | Through Hole | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | 70°C | 0°C | 8mA | 8mA | Non-RoHS Compliant | 2001 | /files/ixysintegratedcircuitsdivision-cyg2030-datasheets-5668.pdf | 18-DIP Module (0.850, 21.59mm), 11 Leads | Contains Lead | 8 Weeks | 10 | 5V | 1 | 18-DIP | Data Access Arrangement (DAA) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ZL50012GDG2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 250mA | ROHS3 Compliant | 2006 | /files/microchiptechnology-zl50012gdg2-datasheets-6299.pdf | 144-LBGA | 3.3V | Lead Free | 144 | 8 Weeks | 144 | 16 | No | e1 | TIN SILVER COPPER | 3V~3.6V | BOTTOM | BALL | 3.3V | ZL50012 | Other Telecom ICs | 1 | Switch | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ZL38003GMG2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/microchiptechnology-zl38003gmg-datasheets-1972.pdf | 81-LBGA | Lead Free | 81 | 13 Weeks | 81 | Serial | IN PRODUCTION (Last Updated: 3 weeks ago) | yes | No | e1 | TIN SILVER COPPER | BOTTOM | BALL | TELECOM CIRCUIT | 1 | Echo Cancellation | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SI3210-FT | Silicon Labs |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ProSLIC® | Surface Mount | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | 88mA | RoHS Compliant | 1998 | /files/siliconlabs-si3210mgt-datasheets-3409.pdf | 38-TFSOP (0.173, 4.40mm Width) | 9.7mm | 4.4mm | 5V | Lead Free | 38 | 8 Weeks | 140.160042mg | 38 | PCM, SPI | yes | No | e3 | Matte Tin (Sn) | 700mW | 3.3V 5V | DUAL | GULL WING | 260 | 3.3V | 0.5mm | SI3210 | 40 | Analog Transmission Interfaces | 1 | Subscriber Line Interface Concept (SLIC), CODEC | CONSTANT CURRENT | 40 dB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT8981DP1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | CMOS | 6mA | ROHS3 Compliant | 2010 | /files/microchiptechnology-mt8981de1-datasheets-6063.pdf | 44-LCC (J-Lead) | 5V | Lead Free | 44 | 8 Weeks | 44 | yes | 4 | No | e3 | MATTE TIN | 4.75V~5.25V | QUAD | J BEND | 260 | 5V | 30 | Other Telecom ICs | 5V | 1 | Switch | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE79Q2284MVCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 1993 | /files/microchiptechnology-le79q2284mvc-datasheets-6143.pdf | 80-LQFP | 3.3V | 7 Weeks | 3.465V | 80 | PCM | IN PRODUCTION (Last Updated: 1 month ago) | 3.3V | 4 | 80-LQFP (12x12) | ISLAC DEVICE | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SI3018-F-GS | Silicon Labs |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Integrated Circuit (IC) | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | 8.5mA | RoHS Compliant | 1999 | /files/siliconlabs-si3050e1ftr-datasheets-2949.pdf | 16-SOIC (0.154, 3.90mm Width) | 9.9mm | 3.9mm | 3.3V | Lead Free | 16 | 8 Weeks | 189.318115mg | 16 | Parallel, SPI, UART | yes | No | 8.192MHz | 15mA | YES | 3V~3.6V | DUAL | GULL WING | SI3018 | 3.6V | 3V | 1 | 54.6875 kbps | Direct Access Arrangement (DAA) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE88231DLC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2005 | /files/microsemicorporation-le88211dlct-datasheets-2218.pdf | 80-LQFP | 14 Weeks | PCM | IN PRODUCTION (Last Updated: 1 month ago) | 2 | Telecom Circuit | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| HC9P5504B-5ZX96 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~75°C | Bag | 3 (168 Hours) | BIPOLAR | ROHS3 Compliant | /files/renesaselectronicsamericainc-hc9p5504b5zx96-datasheets-6193.pdf | 24-SOIC (0.295, 7.50mm Width) | 24 | 7 Weeks | e3 | Matte Tin (Sn) - annealed | YES | DUAL | GULL WING | 5V | HC5504B | 1 | R-PDSO-G24 | Subscriber Line Interface Concept (SLIC) | 550mW | -48V | CONSTANT CURRENT | 5 dBrnC | 2-4 CONVERSION | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC7109XJW | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~110°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 32-TFQFN Exposed Pad | 32 | 7 Weeks | EXT TEMP -40 DEG CEL AMBIENT TO 110 DEG CEL JUNCTION | YES | 2.5V | QUAD | NO LEAD | 2 | CONSUMER CIRCUIT | Signal Conditioner | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE79234KVC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2011 | 128-TQFP | 10 Weeks | 2-Wire | IN PRODUCTION (Last Updated: 1 month ago) | No | 128-TQFP | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT8985APR1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 10mA | ROHS3 Compliant | /files/microchiptechnology-mt8985apr1-datasheets-6206.pdf | 44-LCC (J-Lead) | 6 Weeks | 4.75V~5.25V | 1 | 44-PLCC (16.51x16.51) | Switch | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SI32179-B-GM1 | Silicon Labs |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | RoHS Compliant | 2014 | /files/siliconlabs-si32176bgm1r-datasheets-3570.pdf | 42-WFQFN Exposed Pad | 3.3V | 8 Weeks | 3.13V | PCM, SPI | 1 | Subscriber Line Interface Concept (SLIC), CODEC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT9122APR1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 70mA | 4.57mm | ROHS3 Compliant | /files/microchiptechnology-mt9122apr1-datasheets-6207.pdf | 28-LCC (J-Lead) | 11.505mm | 11.505mm | 5V | 28 | 7 Weeks | 28 | Serial | yes | No | e3 | MATTE TIN | 4.5V~5.5V | QUAD | J BEND | 260 | 5V | ISDN ECHO CANCELLER | 30 | Other Telecom ICs | 5V | 100mA | 2 | Echo Cancellation | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SI3010-F-GS | Silicon Labs |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | 15mA | RoHS Compliant | 1998 | /files/siliconlabs-si3018fgsr-datasheets-3055.pdf | 16-SOIC (0.154, 3.90mm Width) | 9.9mm | 3.9mm | Lead Free | 16 | 8 Weeks | 189.318115mg | Parallel, SPI, UART | yes | 3V~3.6V | DUAL | GULL WING | NOT SPECIFIED | SI3010 | 3.6V | 3V | NOT SPECIFIED | 1 | Not Qualified | CONSUMER CIRCUIT | Direct Access Arrangement (DAA) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CPC7601KTR | IXYS / Littelfuse |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | 100nA | 100nA | ROHS3 Compliant | 2014 | /files/ixys-cpc7601ktr-datasheets-5423.pdf | 48-LQFP | 12 Weeks | 48 | 3V~5.5V | 16 | 2.3W | 1 | 48-LQFP (7x7) | 5 μs | 5 μs | 100V | Switch | 40V | 16 | 16 |
