Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Lifecycle Status | Pbfree Code | Thickness | Number of Ports | Additional Feature | Contact Plating | Radiation Hardening | Max Frequency | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Telecom IC Type | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Time@Peak Reflow Temperature-Max (s) | Power Dissipation | Subcategory | Power Supplies | Supply Current-Max | Number of Circuits | Qualification Status | JESD-30 Code | Supplier Device Package | Consumer IC Type | Data Rate | Turn On Delay Time | Turn-Off Delay Time | Dual Supply Voltage | Function | Min Dual Supply Voltage | Power (Watts) | Number of Outputs | Number of Inputs | Output Low Current-Max | Neg Supply Voltage-Nom | ISDN Access Rate | Reference Point | Output High Voltage-Min | Output Low Voltage-Max | Battery Feed | Noise-Max | Hybrid |
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MT8981DP1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | CMOS | 6mA | ROHS3 Compliant | 2010 | /files/microchiptechnology-mt8981de1-datasheets-6063.pdf | 44-LCC (J-Lead) | 5V | Lead Free | 44 | 8 Weeks | 44 | yes | 4 | No | e3 | MATTE TIN | 4.75V~5.25V | QUAD | J BEND | 260 | 5V | 30 | Other Telecom ICs | 5V | 1 | Switch | |||||||||||||||||||||||||||||||||||||||||||||||||||||
LE79Q2284MVCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 1993 | /files/microchiptechnology-le79q2284mvc-datasheets-6143.pdf | 80-LQFP | 3.3V | 7 Weeks | 3.465V | 80 | PCM | IN PRODUCTION (Last Updated: 1 month ago) | 3.3V | 4 | 80-LQFP (12x12) | ISLAC DEVICE | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SI3018-F-GS | Silicon Labs |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Integrated Circuit (IC) | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | 8.5mA | RoHS Compliant | 1999 | /files/siliconlabs-si3050e1ftr-datasheets-2949.pdf | 16-SOIC (0.154, 3.90mm Width) | 9.9mm | 3.9mm | 3.3V | Lead Free | 16 | 8 Weeks | 189.318115mg | 16 | Parallel, SPI, UART | yes | No | 8.192MHz | 15mA | YES | 3V~3.6V | DUAL | GULL WING | SI3018 | 3.6V | 3V | 1 | 54.6875 kbps | Direct Access Arrangement (DAA) | |||||||||||||||||||||||||||||||||||||||||||||||||||
LE88231DLC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2005 | /files/microsemicorporation-le88211dlct-datasheets-2218.pdf | 80-LQFP | 14 Weeks | PCM | IN PRODUCTION (Last Updated: 1 month ago) | 2 | Telecom Circuit | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
HC9P5504B-5ZX96 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~75°C | Bag | 3 (168 Hours) | BIPOLAR | ROHS3 Compliant | /files/renesaselectronicsamericainc-hc9p5504b5zx96-datasheets-6193.pdf | 24-SOIC (0.295, 7.50mm Width) | 24 | 7 Weeks | e3 | Matte Tin (Sn) - annealed | YES | DUAL | GULL WING | 5V | HC5504B | 1 | R-PDSO-G24 | Subscriber Line Interface Concept (SLIC) | 550mW | -48V | CONSTANT CURRENT | 5 dBrnC | 2-4 CONVERSION | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
VSC7109XJW | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~110°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 32-TFQFN Exposed Pad | 32 | 7 Weeks | EXT TEMP -40 DEG CEL AMBIENT TO 110 DEG CEL JUNCTION | YES | 2.5V | QUAD | NO LEAD | 2 | CONSUMER CIRCUIT | Signal Conditioner | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
LE79234KVC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2011 | 128-TQFP | 10 Weeks | 2-Wire | IN PRODUCTION (Last Updated: 1 month ago) | No | 128-TQFP | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MT8985APR1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 10mA | ROHS3 Compliant | /files/microchiptechnology-mt8985apr1-datasheets-6206.pdf | 44-LCC (J-Lead) | 6 Weeks | 4.75V~5.25V | 1 | 44-PLCC (16.51x16.51) | Switch | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SI32179-B-GM1 | Silicon Labs |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | RoHS Compliant | 2014 | /files/siliconlabs-si32176bgm1r-datasheets-3570.pdf | 42-WFQFN Exposed Pad | 3.3V | 8 Weeks | 3.13V | PCM, SPI | 1 | Subscriber Line Interface Concept (SLIC), CODEC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MT9122APR1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 70mA | 4.57mm | ROHS3 Compliant | /files/microchiptechnology-mt9122apr1-datasheets-6207.pdf | 28-LCC (J-Lead) | 11.505mm | 11.505mm | 5V | 28 | 7 Weeks | 28 | Serial | yes | No | e3 | MATTE TIN | 4.5V~5.5V | QUAD | J BEND | 260 | 5V | ISDN ECHO CANCELLER | 30 | Other Telecom ICs | 5V | 100mA | 2 | Echo Cancellation | ||||||||||||||||||||||||||||||||||||||||||||||||||
SI3010-F-GS | Silicon Labs |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | 15mA | RoHS Compliant | 1998 | /files/siliconlabs-si3018fgsr-datasheets-3055.pdf | 16-SOIC (0.154, 3.90mm Width) | 9.9mm | 3.9mm | Lead Free | 16 | 8 Weeks | 189.318115mg | Parallel, SPI, UART | yes | 3V~3.6V | DUAL | GULL WING | NOT SPECIFIED | SI3010 | 3.6V | 3V | NOT SPECIFIED | 1 | Not Qualified | CONSUMER CIRCUIT | Direct Access Arrangement (DAA) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
CPC7601KTR | IXYS / Littelfuse |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | 100nA | 100nA | ROHS3 Compliant | 2014 | /files/ixys-cpc7601ktr-datasheets-5423.pdf | 48-LQFP | 12 Weeks | 48 | 3V~5.5V | 16 | 2.3W | 1 | 48-LQFP (7x7) | 5 μs | 5 μs | 100V | Switch | 40V | 16 | 16 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
LE79Q2284MVC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 1993 | /files/microchiptechnology-le79q2284mvc-datasheets-6143.pdf | 80-LQFP | 3.3V | 7 Weeks | 3.465V | 80 | PCM | IN PRODUCTION (Last Updated: 1 month ago) | Tin | 3.3V | 4 | 80-LQFP (12x12) | ISLAC DEVICE | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MT9173AN1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 10mA | 2mm | ROHS3 Compliant | /files/microsemicorporation-mt9173ae-datasheets-2180.pdf | SSOP | 8.2mm | 5.3mm | 5V | 24 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | No | e3 | MATTE TIN | 4.75V~5.25V | DUAL | GULL WING | 260 | 5V | 0.65mm | DIGITAL SLIC | 30 | Digital Transmission Interfaces | 5V | 1 | R-PDSO-G24 | 24-SSOP | 160 kbps | Subscriber Line Interface Concept (SLIC) | 0.005A | BASIC | S | 2.4V | 0.4V | ||||||||||||||||||||||||||||||||||||||||||||
LE88221DLC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/microchiptechnology-le88221dlct-datasheets-6046.pdf | 80-LQFP | 14 Weeks | PCM | 2 | 80-eLQFP | Telecom Circuit | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SI32261-C-GM1 | Silicon Labs |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ProSLIC® | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | RoHS Compliant | 2000 | /files/siliconlabs-si32261cfm1r-datasheets-3305.pdf | 60-WFQFN Exposed Pad | 3.3V | 8 Weeks | GCI, PCM, SPI | yes | 3.13V~3.47V | DIGITAL SLIC | 1 | Subscriber Line Interface Concept (SLIC), CODEC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
LE57D121BTCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | 9.3mA | ROHS3 Compliant | 2012 | /files/microchiptechnology-le57d122btct-datasheets-5935.pdf | 44-TQFP Exposed Pad | 5V | 10 Weeks | 4.75V | 2-Wire | IN PRODUCTION (Last Updated: 3 weeks ago) | 4.75V~5.25V | 2 | 44-TQFP-EP (10x10) | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SI32261-C-FM2R | Silicon Labs |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ProSLIC® | Surface Mount | Surface Mount | 0°C~70°C | Tape & Reel (TR) | 3 (168 Hours) | RoHS Compliant | 2000 | /files/siliconlabs-si32261cfm1r-datasheets-3305.pdf | 60-WFQFN Exposed Pad | 8 Weeks | GCI, PCM, SPI | yes | 3.13V~3.47V | DIGITAL SLIC | 1 | Subscriber Line Interface Concept (SLIC), CODEC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SI32269-C-GM1R | Silicon Labs |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ProSLIC® | Surface Mount | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | RoHS Compliant | 2014 | QFN | 8 Weeks | GCI, PCM, SPI | 3.3V | DIGITAL SLIC | 1 | 50-QFN (6x8) | Subscriber Line Interface Concept (SLIC), CODEC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
LE57D122BTC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 9.3mA | ROHS3 Compliant | /files/microchiptechnology-le57d122btct-datasheets-5935.pdf | 44-TQFP Exposed Pad | 10mm | 10mm | 5V | 44 | 10 Weeks | 2-Wire | IN PRODUCTION (Last Updated: 3 weeks ago) | e3 | Matte Tin (Sn) | 4.75V~5.25V | QUAD | GULL WING | 5V | 0.8mm | 2 | Not Qualified | S-PQFP-G44 | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MT9171APR1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | 10mA | ROHS3 Compliant | /files/microchiptechnology-mt9171anr1-datasheets-2697.pdf | 8 Weeks | 4.75V~5.25V | 1 | 28-PLCC | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SI32282-A-GMR | Silicon Labs |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ProSLIC® | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | Non-RoHS Compliant | /files/siliconlabs-si32285afmr-datasheets-5733.pdf | 56-VFQFN Exposed Pad | 8 Weeks | 3-Wire, PCM | yes | 3.3V | DIGITAL SLIC | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
LE88221DLCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/microchiptechnology-le88221dlct-datasheets-6046.pdf | 80-LQFP | 14 Weeks | 80 | PCM | IN PRODUCTION (Last Updated: 1 month ago) | 2 | Telecom Circuit | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
BU8772KN-E2 | ROHM Semiconductor |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2002 | /files/rohmsemiconductor-bu8772kn-datasheets-2851.pdf | 28-VFQFN | 10 Weeks | 2.7V~3.6V | BU8772 | 1 | Sound Generator | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
UCC3750DWTR | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tape & Reel (TR) | 2 (1 Year) | BICMOS | 50Hz | 500μA | ROHS3 Compliant | 28-SOIC (0.295, 7.50mm Width) | 17.9mm | 2.65mm | 7.5mm | 5V | Lead Free | 28 | 6 Weeks | 792.000628mg | 28 | ACTIVE (Last Updated: 6 days ago) | yes | 2.35mm | No | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | YES | DUAL | GULL WING | 260 | 5V | UCC3750 | TELECOM CIRCUIT | 1 | Ring Generator Controller | |||||||||||||||||||||||||||||||||||||||||||||||||||
SI32287-A-FM | Silicon Labs |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ProSLIC® | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | Non-RoHS Compliant | 2015 | /files/siliconlabs-si32285afmr-datasheets-5733.pdf | 56-VFQFN Exposed Pad | 8 Weeks | 3-Wire, PCM | yes | 3.3V | DIGITAL SLIC | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SI3050-E1-GM | Silicon Labs |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Integrated Circuit (IC) | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | 8.5mA | RoHS Compliant | 1997 | /files/siliconlabs-si3050e1ftr-datasheets-2949.pdf | 24-WFQFN Exposed Pad | 4mm | 4mm | 3.3V | 24 | 8 Weeks | 24 | GCI, PCM, SPI | No | 8kHz | 10mA | YES | 3V~3.6V | QUAD | 0.5mm | SI3050 | 3.6V | 3V | 1 | Direct Access Arrangement (DAA) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
SI32260-C-GM1 | Silicon Labs |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ProSLIC® | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | RoHS Compliant | 2000 | /files/siliconlabs-si32261cfm1r-datasheets-3305.pdf | 60-WFQFN Exposed Pad | 3.3V | 8 Weeks | GCI, PCM, SPI | yes | 3.13V~3.47V | DIGITAL SLIC | 1 | Subscriber Line Interface Concept (SLIC), CODEC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MT8952BPR1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | 1μA | 1μA | ROHS3 Compliant | /files/microchiptechnology-mt8952bs1-datasheets-2859.pdf | 28-LCC (J-Lead) | 7 Weeks | 28 | No | 4.75V~5.25V | 1 | 28-PLCC | Controller | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
LE88286DLCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/microchiptechnology-le88266dlc-datasheets-5717.pdf | 80-LQFP | 10 Weeks | 80 | PCM | IN PRODUCTION (Last Updated: 1 month ago) | 4.75V~35V | 2 | Telecom Circuit |
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