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ContactTelecom Interface ICs(3995)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Pbfree Code | Number of Ports | ECCN Code | Radiation Hardening | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Temperature Grade | Telecom IC Type | Operating Temperature (Max) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Number of Circuits | Qualification Status | JESD-30 Code | Supplier Device Package | Consumer IC Type | Data Rate | Logic Function | Function | Battery Feed | Hybrid |
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| LE88264TQCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2015 | 4-Wire Serial | 2 | 64-QFN | Battery Switch | |||||||||||||||||||||||||||||||||||||||||||||||||||
| LE88236DLCT | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | RoHS Compliant | 2005 | /files/microchiptechnology-le88216dlc-datasheets-2100.pdf | 80-LQFP | 80 | PCM | 2 | 80-eLQFP | Telecom Circuit | |||||||||||||||||||||||||||||||||||||||||||||||
| XRT83L38IB-F | MaxLinear, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 4 (72 Hours) | /files/maxlinearinc-xrt83l38ib-datasheets-1486.pdf | 225-BGA | LIU | 3.135V~3.465V | 8 | Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||
| LE88236DLC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/microchiptechnology-le88216dlc-datasheets-2100.pdf | 80-LQFP | 80 | PCM | 2 | Telecom Circuit | |||||||||||||||||||||||||||||||||||||||||||||||||
| MT3370BSR1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | 4.19MHz | 3mA | 2.65mm | ROHS3 Compliant | /files/microchiptechnology-mt3271be1-datasheets-2117.pdf | 18-SOIC (0.295, 7.50mm Width) | 7.5mm | 5V | 18 | 18 | Parallel | yes | No | e3 | MATTE TIN | 4.75V~5.25V | DUAL | GULL WING | 260 | 5V | DTMF SIGNALING CIRCUIT | 30 | Telecom Signaling Circuits | 5V | 8mA | 1 | Receiver | DTMF Receiver | |||||||||||||||||||||||||||
| LE88246DLC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/microsemicorporation-le88226dlct-datasheets-2094.pdf | 80-LQFP | 80 | PCM | 2 | Telecom Circuit | |||||||||||||||||||||||||||||||||||||||||||||||||
| LE88264TQC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2015 | 4-Wire Serial | 2 | 64-QFN | Battery Switch | |||||||||||||||||||||||||||||||||||||||||||||||||||
| LE9531DMQC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 40mA | ROHS3 Compliant | QFN | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| RPCS3487C.B0-998840 | Inphi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | 1369-BGA | Interlaken, XAUI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE9531CETCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 40mA | ROHS3 Compliant | 2011 | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||||||||||||||
| LE9531DETC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 40mA | ROHS3 Compliant | 2011 | QFN | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||||||||||||||
| LE9502BTC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | BIPOLAR | 7.5mA | ROHS3 Compliant | 2002 | /files/microchiptechnology-le9502btc-datasheets-2042.pdf | 44-TQFP Exposed Pad | 3.3V | 44 | 2-Wire | e3 | MATTE TIN | QUAD | GULL WING | 3.3V | 0.8mm | Analog Transmission Interfaces | 1 | Not Qualified | S-PQFP-G44 | Subscriber Line Interface Concept (SLIC) | CONSTANT CURRENT | 2-4 CONVERSION | |||||||||||||||||||||||||||||||||
| RPCS3477C.B0-998976 | Inphi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | 1024-BGA | Interlaken | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 73M1866B-IMR/F | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MicroDAA™ | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 0.9mm | ROHS3 Compliant | 2009 | /files/maximintegrated-73m1916ivtf-datasheets-1360.pdf | 42-VFQFN Exposed Pad | 8mm | 8mm | 42 | 42 | PCM, Serial, SPI | no | EAR99 | No | 3V~3.6V | QUAD | 0.5mm | 73M1866 | 3.6V | 3V | 1 | CONSUMER CIRCUIT | Data Access Arrangement (DAA) | ||||||||||||||||||||||||||||||||
| ZL50073GAG2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 500mA | ROHS3 Compliant | 2006 | /files/microchiptechnology-zl50073gac-datasheets-1942.pdf | 484-BGA | 23mm | 23mm | 484 | 14 Weeks | 484 | 128 | No | e1 | TIN SILVER COPPER | 1.71V~1.89V | BOTTOM | BALL | 1.8V | ZL50073 | 1 | Switch | ||||||||||||||||||||||||||||||||||
| LE9520SDDTCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 40mA | ROHS3 Compliant | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE9500ABJCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 1 (Unlimited) | 4.7mA | 4.572mm | ROHS3 Compliant | PLCC | 3.3V | 28 | Parallel | yes | YES | QUAD | J BEND | 3.3V | COMMERCIAL | 70°C | 1 | Not Qualified | S-PQCC-J28 | 28-PLCC | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||
| ZL50110GAG | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 950mA | 2.53mm | Non-RoHS Compliant | 2009 | /files/microchiptechnology-zl50114gag-datasheets-2007.pdf | 552-BGA | 35mm | 35mm | 552 | TDM | no | e0 | TIN LEAD | YES | 1.65V~1.95V | BOTTOM | BALL | 225 | 1.8V | ZL50110 | 30 | Other Telecom ICs | 1 | Not Qualified | S-PBGA-B552 | Telecom Circuit | ||||||||||||||||||||||||||||||
| LE9500DBJC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tube | 1 (Unlimited) | 4.7mA | 4.572mm | ROHS3 Compliant | PLCC | 3.3V | 28 | Parallel | yes | YES | QUAD | J BEND | 3.3V | COMMERCIAL | 70°C | 1 | Not Qualified | S-PQCC-J28 | 28-PLCC | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||
| LE89136QVCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 1 | SLAC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE9531DMQCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 40mA | ROHS3 Compliant | QFN | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||||||||||||||
| ZL50074GAG2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 500mA | ROHS3 Compliant | /files/microchiptechnology-zl50074gac-datasheets-1983.pdf | 484-BGA | 23mm | 23mm | 484 | e1 | TIN SILVER COPPER | YES | 1.71V~1.89V | BOTTOM | BALL | 1.8V | ZL50074 | 1 | Not Qualified | S-PBGA-B484 | Switch | |||||||||||||||||||||||||||||||||||||
| LE9500CBJCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 1 (Unlimited) | 4.7mA | 4.572mm | ROHS3 Compliant | PLCC | 3.3V | 28 | Parallel | yes | YES | QUAD | J BEND | 3.3V | COMMERCIAL | 70°C | 1 | Not Qualified | S-PQCC-J28 | 28-PLCC | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||
| LE9500DBJCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 1 (Unlimited) | 4.7mA | 4.572mm | ROHS3 Compliant | 2011 | PLCC | 3.3V | 28 | Parallel | yes | YES | QUAD | J BEND | 3.3V | COMMERCIAL | 70°C | 1 | Not Qualified | S-PQCC-J28 | 28-PLCC | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||
| XRT75VL00DIVTR | MaxLinear, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 120mA | /files/maxlinearinc-xrt75vl00divtrf-datasheets-1850.pdf | 52-LQFP | LIU | 3.135V~3.465V | 1 | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||||||||||||
| LE88136BLC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/microchiptechnology-le88136blc-datasheets-2028.pdf | 44-LQFP | 44 | PCM | 1 | Telecom Circuit | |||||||||||||||||||||||||||||||||||||||||||||||||
| CS1777.E0-998170 | Inphi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | 1020-BGA | SPI-4.2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE88111BLCT | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | RoHS Compliant | 1993 | /files/microsemicorporation-le88111blct-datasheets-2030.pdf | 44-LQFP | 44 | PCM | 3V 5V | 1 | 44-eLQFP | Telecom Circuit | ||||||||||||||||||||||||||||||||||||||||||||||
| ZL50057GAG2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | 85°C | -40°C | 240mA | 240mA | ROHS3 Compliant | /files/microchiptechnology-zl50057gac-datasheets-1917.pdf | 272-BBGA | 272 | 1.71V~1.89V | ZL50057 | 272-PBGA (27x27) | Switch | |||||||||||||||||||||||||||||||||||||||||||
| ZL50120GAG2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 950mA | ROHS3 Compliant | /files/microchiptechnology-zl50119gag2-datasheets-1865.pdf | 324-BGA | 23mm | 23mm | 324 | 324 | TDM | No | e1 | TIN SILVER COPPER | 1.65V~1.95V | BOTTOM | BALL | 1.8V | ZL50120 | Other Telecom ICs | 1 | 64 kbps | Telecom Circuit |
