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ContactTelecom Interface ICs(3995)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Pbfree Code | Number of Ports | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Voltage | Surface Mount | Max Power Dissipation | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Temperature Grade | Telecom IC Type | Operating Temperature (Max) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Number of Circuits | Qualification Status | JESD-30 Code | Supplier Device Package | Data Rate | Logic Function | Function | Number of Input Lines |
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| MT3271BE1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Through Hole | -40°C~85°C | Tube | 1 (Unlimited) | 85°C | -40°C | 4.19MHz | 3mA | 3mA | ROHS3 Compliant | 2007 | /files/microchiptechnology-mt3271be1-datasheets-2117.pdf | 8-DIP (0.300, 7.62mm) | 5V | 7 Weeks | 930.006106mg | 5.25V | 4.75V | 8 | Parallel | No | 3mA | 5V | 500mW | 4.75V~5.25V | 1 | 8-PDIP | Receiver | DTMF Receiver | ||||||||||||||||||||||||||||||||
| LE9520DDTC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | 40mA | ROHS3 Compliant | Parallel | 3.3V | 2 | 64-eTQFP | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE88116BLC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/microchiptechnology-le88136blc-datasheets-2028.pdf | 44-LQFP | 44 | PCM | 3V 5V | 1 | Telecom Circuit | ||||||||||||||||||||||||||||||||||||||||||||||||||
| ZL50070GAC | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | 500mA | Non-RoHS Compliant | /files/microsemicorporation-zl50070gac-datasheets-2085.pdf | 484-BGA | 23mm | 23mm | 484 | 256 | no | 96 | e0 | TIN LEAD | 1.71V~1.89V | BOTTOM | BALL | 225 | 1.8V | ZL50070 | 30 | 1 | Not Qualified | S-PBGA-B484 | Switch | ||||||||||||||||||||||||||||||||||
| LE9531CMQCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 40mA | ROHS3 Compliant | 2007 | QFN | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE89830JSCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 2010 | PCM | 1 | 16-SOIC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE88226DLC | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | RoHS Compliant | /files/microsemicorporation-le88226dlct-datasheets-2094.pdf | 80-LQFP | 80 | PCM | 2 | Telecom Circuit | |||||||||||||||||||||||||||||||||||||||||||||||||||
| LE88111BLC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/microsemicorporation-le88111blct-datasheets-2030.pdf | 44-LQFP | 5V | 356.09836mg | 44 | PCM | 3V 5V | Telecom Circuit | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||
| MT3171BE1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Through Hole | -40°C~85°C | Tube | 1 (Unlimited) | 4.19MHz | 3mA | 5.33mm | ROHS3 Compliant | /files/microchiptechnology-mt3271be1-datasheets-2117.pdf | 8-DIP (0.300, 7.62mm) | 9.59mm | 7.62mm | 5V | 8 | 8 | Parallel | yes | No | 3mA | e3 | MATTE TIN | 4.75V~5.25V | DUAL | 260 | 5V | 2.54mm | DTMF SIGNALING CIRCUIT | 30 | Telecom Signaling Circuits | 5V | 1 | Receiver | DTMF Receiver | ||||||||||||||||||||||||||||
| ZL50212/GBC | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 85°C | -40°C | 10mA | 10mA | Non-RoHS Compliant | /files/microsemicorporation-zl50212gbc-datasheets-2092.pdf | 535-BGA | 535 | 1.6V~2V | 1 | 535-PBGA (31x31) | Echo Cancellation | |||||||||||||||||||||||||||||||||||||||||||||
| LE9531DETCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 40mA | ROHS3 Compliant | 2011 | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| ZL50110GAG | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 950mA | 2.53mm | Non-RoHS Compliant | 2009 | /files/microchiptechnology-zl50114gag-datasheets-2007.pdf | 552-BGA | 35mm | 35mm | 552 | TDM | no | e0 | TIN LEAD | YES | 1.65V~1.95V | BOTTOM | BALL | 225 | 1.8V | ZL50110 | 30 | Other Telecom ICs | 1 | Not Qualified | S-PBGA-B552 | Telecom Circuit | ||||||||||||||||||||||||||||||||
| LE9500DBJC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tube | 1 (Unlimited) | 4.7mA | 4.572mm | ROHS3 Compliant | PLCC | 3.3V | 28 | Parallel | yes | YES | QUAD | J BEND | 3.3V | COMMERCIAL | 70°C | 1 | Not Qualified | S-PQCC-J28 | 28-PLCC | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||
| LE89136QVCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 1 | SLAC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE9531DMQCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | 40mA | ROHS3 Compliant | QFN | Parallel | 3.3V | 1 | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| ZL50074GAG2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 500mA | ROHS3 Compliant | /files/microchiptechnology-zl50074gac-datasheets-1983.pdf | 484-BGA | 23mm | 23mm | 484 | e1 | TIN SILVER COPPER | YES | 1.71V~1.89V | BOTTOM | BALL | 1.8V | ZL50074 | 1 | Not Qualified | S-PBGA-B484 | Switch | |||||||||||||||||||||||||||||||||||||||
| LE9500CBJCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 1 (Unlimited) | 4.7mA | 4.572mm | ROHS3 Compliant | PLCC | 3.3V | 28 | Parallel | yes | YES | QUAD | J BEND | 3.3V | COMMERCIAL | 70°C | 1 | Not Qualified | S-PQCC-J28 | 28-PLCC | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||
| LE9500DBJCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 1 (Unlimited) | 4.7mA | 4.572mm | ROHS3 Compliant | 2011 | PLCC | 3.3V | 28 | Parallel | yes | YES | QUAD | J BEND | 3.3V | COMMERCIAL | 70°C | 1 | Not Qualified | S-PQCC-J28 | 28-PLCC | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||
| XRT75VL00DIVTR | MaxLinear, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 120mA | /files/maxlinearinc-xrt75vl00divtrf-datasheets-1850.pdf | 52-LQFP | LIU | 3.135V~3.465V | 1 | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||||||||||||||
| LE88136BLC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/microchiptechnology-le88136blc-datasheets-2028.pdf | 44-LQFP | 44 | PCM | 1 | Telecom Circuit | |||||||||||||||||||||||||||||||||||||||||||||||||||
| CS1777.E0-998170 | Inphi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | 1020-BGA | SPI-4.2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE88111BLCT | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | RoHS Compliant | 1993 | /files/microsemicorporation-le88111blct-datasheets-2030.pdf | 44-LQFP | 44 | PCM | 3V 5V | 1 | 44-eLQFP | Telecom Circuit | ||||||||||||||||||||||||||||||||||||||||||||||||
| ZL50057GAG2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | 85°C | -40°C | 240mA | 240mA | ROHS3 Compliant | /files/microchiptechnology-zl50057gac-datasheets-1917.pdf | 272-BBGA | 272 | 1.71V~1.89V | ZL50057 | 272-PBGA (27x27) | Switch | |||||||||||||||||||||||||||||||||||||||||||||
| ZL50120GAG2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 950mA | ROHS3 Compliant | /files/microchiptechnology-zl50119gag2-datasheets-1865.pdf | 324-BGA | 23mm | 23mm | 324 | 324 | TDM | No | e1 | TIN SILVER COPPER | 1.65V~1.95V | BOTTOM | BALL | 1.8V | ZL50120 | Other Telecom ICs | 1 | 64 kbps | Telecom Circuit | ||||||||||||||||||||||||||||||||||||
| XRT79L71IB | MaxLinear, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 4 (72 Hours) | CMOS | 1.7mm | Non-RoHS Compliant | /files/maxlinearinc-xrt79l71ibf-datasheets-1805.pdf | 208-LBGA | 17mm | 17mm | 208 | LIU | compliant | 8542.39.00.01 | 1 | e0 | TIN LEAD | YES | 3.15V~3.45V | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1mm | ATM/SONET/SDH NETWORK INTERFACE | NOT SPECIFIED | Not Qualified | S-PBGA-B208 | |||||||||||||||||||||||||||||||||
| XRT75R03IV | MaxLinear, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 2A (4 Weeks) | 410mA | /files/maxlinearinc-xrt75r03ivtr-datasheets-1775.pdf | 128-LQFP | LIU | 3.135V~3.465V | 3 | 128-LQFP (14x20) | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||||||||||||||||||||||
| ZL50112GAG | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 950mA | 2.53mm | Non-RoHS Compliant | /files/microchiptechnology-zl50114gag-datasheets-2007.pdf | 552-BGA | 35mm | 35mm | 1.8V | 552 | 552 | TDM | 1.65V~1.95V | BOTTOM | BALL | 1.8V | ZL50112 | Other Telecom ICs | 1 | Not Qualified | 1 Gbps | Telecom Circuit | ||||||||||||||||||||||||||||||||||||
| LE88536PQCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2016 | 4-Wire Serial | 3.3V~35V | 2 | 48-QFN | Battery Switch | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| 73M1906B-IMR/F | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | /files/maximintegrated-73m1916ivtf-datasheets-1360.pdf | 32-VFQFN Exposed Pad | 6 Weeks | PCM | 3V~3.6V | 73M1906 | 1 | Direct Access Arrangement (DAA) | ||||||||||||||||||||||||||||||||||||||||||||||||
| XRT72L52IQ-F | MaxLinear, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 4 (72 Hours) | 100mA | /files/maxlinearinc-xrt72l52iqtrf-datasheets-1581.pdf | 160-BQFP | 3.3V |
