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ContactTelecom Interface ICs(3995)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Frequency | Operating Supply Current | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Lifecycle Status | Pbfree Code | Number of Ports | ECCN Code | Radiation Hardening | Reach Compliance Code | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Telecom IC Type | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Number of Circuits | Qualification Status | JESD-30 Code | Supplier Device Package | Consumer IC Type | Logic Function | Function | Battery Feed | Hybrid |
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| 73M1906B-IMR/F | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | /files/maximintegrated-73m1916ivtf-datasheets-1360.pdf | 32-VFQFN Exposed Pad | 6 Weeks | PCM | 3V~3.6V | 73M1906 | 1 | Direct Access Arrangement (DAA) | ||||||||||||||||||||||||||||||||||||||||||||
| XRT72L52IQ-F | MaxLinear, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 4 (72 Hours) | 100mA | /files/maxlinearinc-xrt72l52iqtrf-datasheets-1581.pdf | 160-BQFP | 3.3V | ||||||||||||||||||||||||||||||||||||||||||||||||||
| ZL50235/GDC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | CMOS | 40mA | Non-RoHS Compliant | /files/microchiptechnology-zl50235gdc-datasheets-2081.pdf | 208-LBGA | 208 | 208 | LIU | no | e0 | TIN LEAD | 1.6V~2V | BOTTOM | BALL | 225 | 1.8V | ISDN ECHO CANCELLER | 30 | Other Telecom ICs | 1 | Not Qualified | Echo Cancellation | |||||||||||||||||||||||||||||||
| LE9502BTC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | BIPOLAR | 7.5mA | ROHS3 Compliant | 2002 | /files/microchiptechnology-le9502btc-datasheets-2042.pdf | 44-TQFP Exposed Pad | 3.3V | 44 | 2-Wire | e3 | MATTE TIN | QUAD | GULL WING | 3.3V | 0.8mm | Analog Transmission Interfaces | 1 | Not Qualified | S-PQFP-G44 | Subscriber Line Interface Concept (SLIC) | CONSTANT CURRENT | 2-4 CONVERSION | |||||||||||||||||||||||||||||||
| RPCS3477C.B0-998976 | Inphi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | 1024-BGA | Interlaken | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 73M1866B-IMR/F | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MicroDAA™ | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 0.9mm | ROHS3 Compliant | 2009 | /files/maximintegrated-73m1916ivtf-datasheets-1360.pdf | 42-VFQFN Exposed Pad | 8mm | 8mm | 42 | 42 | PCM, Serial, SPI | no | EAR99 | No | 3V~3.6V | QUAD | 0.5mm | 73M1866 | 3.6V | 3V | 1 | CONSUMER CIRCUIT | Data Access Arrangement (DAA) | ||||||||||||||||||||||||||||||
| ZL50073GAG2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 500mA | ROHS3 Compliant | 2006 | /files/microchiptechnology-zl50073gac-datasheets-1942.pdf | 484-BGA | 23mm | 23mm | 484 | 14 Weeks | 484 | 128 | No | e1 | TIN SILVER COPPER | 1.71V~1.89V | BOTTOM | BALL | 1.8V | ZL50073 | 1 | Switch | ||||||||||||||||||||||||||||||||
| LE9520CDTC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | 40mA | ROHS3 Compliant | 2011 | Parallel | 3.3V | 2 | 64-eTQFP | Subscriber Line Interface Concept (SLIC) | |||||||||||||||||||||||||||||||||||||||||||||||
| ZL49031DDF1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 3.579MHz | 3mA | 2mm | ROHS3 Compliant | 2007 | /files/microchiptechnology-zl49031ddf1-datasheets-2015.pdf | 20-SSOP (0.209, 5.30mm Width) | 7.2mm | 5.3mm | 5V | Lead Free | 20 | 8 Weeks | 20 | No | e3 | MATTE TIN | 4.75V~5.25V | DUAL | GULL WING | 5V | 0.65mm | DTMF SIGNALING CIRCUIT | Telecom Signaling Circuits | 5V | 8mA | 1 | Receiver | DTMF Receiver | ||||||||||||||||||||||||
| ZL50063GAC | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | 240mA | Non-RoHS Compliant | 2006 | /files/microsemicorporation-zl50063gac-datasheets-1967.pdf | 196-BBGA | 196 | 196 | no | e0 | TIN LEAD | 1.71V~1.89V | BOTTOM | BALL | 225 | 1.8V | ZL50063 | 30 | Other Telecom ICs | 1 | Not Qualified | Switch | ||||||||||||||||||||||||||||||||
| ZL50111GAG | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 950mA | 2.53mm | Non-RoHS Compliant | /files/microchiptechnology-zl50114gag-datasheets-2007.pdf | 552-BGA | 35mm | 35mm | 552 | TDM | no | e0 | TIN LEAD | YES | 1.65V~1.95V | BOTTOM | BALL | 225 | 1.8V | ZL50111 | 30 | Other Telecom ICs | 1 | Not Qualified | S-PBGA-B552 | Telecom Circuit | |||||||||||||||||||||||||||||
| SSIXF30011-875263 | Inphi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | RoHS Compliant | 2008 | /files/inphicorporation-ssixf30009875252-datasheets-1885.pdf | 868-BGA | 4-Bit Nibble, SFI-4.1, XSBI | 868-BGA | Optical Transport Processor | |||||||||||||||||||||||||||||||||||||||||||||||
| ZL38003GMG | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | Non-RoHS Compliant | 2006 | /files/microchiptechnology-zl38003gmg-datasheets-1972.pdf | 81-LBGA | 81 | 81 | Serial | OBSOLETE (Last Updated: 3 weeks ago) | no | e0 | TIN LEAD | BOTTOM | BALL | 240 | TELECOM CIRCUIT | 30 | 1 | Not Qualified | Echo Cancellation | ||||||||||||||||||||||||||||||||||
| LE89316QVC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | 12 Weeks | 4-Wire Serial | OBSOLETE (Last Updated: 1 month ago) | TELECOM CIRCUIT | 2 | 48-LQFP | |||||||||||||||||||||||||||||||||||||||||||||||
| ZL50234/GDC | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | 22mA | Non-RoHS Compliant | /files/microsemicorporation-zl50234gdc-datasheets-1981.pdf | 208-LBGA | 208 | 208 | no | e0 | TIN LEAD | 1.6V~2V | BOTTOM | BALL | 225 | 1.8V | ISDN ECHO CANCELLER | 30 | 1 | Not Qualified | Echo Cancellation | ||||||||||||||||||||||||||||||||||
| ZL50074GAC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | 500mA | Non-RoHS Compliant | /files/microchiptechnology-zl50074gac-datasheets-1983.pdf | 484-BGA | 23mm | 23mm | 484 | no | e0 | TIN LEAD | YES | 1.71V~1.89V | BOTTOM | BALL | 225 | 1.8V | ZL50074 | 30 | Other Telecom ICs | 1 | Not Qualified | S-PBGA-B484 | Switch | |||||||||||||||||||||||||||||||
| ZL50060GAC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 240mA | Non-RoHS Compliant | /files/microchiptechnology-zl50061gag2-datasheets-1924.pdf | 256-BGA | 256 | 256 | no | 32 | e0 | TIN LEAD | 1.71V~1.89V | BOTTOM | BALL | 225 | 1.8V | ZL50060 | 30 | Other Telecom ICs | 1 | Not Qualified | Switch | ||||||||||||||||||||||||||||||||
| LE89336QVCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | PCM | 1 | 48-LQFP | ||||||||||||||||||||||||||||||||||||||||||||||||||
| 73M1912-IMR/F | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~85°C | Bulk | 3 (168 Hours) | 30mA | ROHS3 Compliant | 32-VFQFN Exposed Pad | Serial | 3V~3.6V | 73M1912 | 1 | Data Access Arrangement (DAA) | ||||||||||||||||||||||||||||||||||||||||||||||
| XRT75R03IVTR-F | MaxLinear, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 2A (4 Weeks) | 410mA | RoHS Compliant | /files/maxlinearinc-xrt75r03ivtr-datasheets-1775.pdf | 128-LQFP | LIU | 3.135V~3.465V | 3 | 128-LQFP (14x20) | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||||||||
| ZL50020GAC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | CMOS | 120mA | Non-RoHS Compliant | /files/microchiptechnology-zl50020gac-datasheets-1950.pdf | 256-BGA | 256 | 256 | no | 32 | e0 | TIN LEAD | 1.71V~1.89V | BOTTOM | BALL | 225 | 1.8V | ZL50020 | 30 | Other Telecom ICs | 1 | Not Qualified | Switch | |||||||||||||||||||||||||||||||
| ZL79124GDG | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 1 (Unlimited) | Non-RoHS Compliant | 2011 | BGA | 1 | 144-BGA | Telecom Circuit | |||||||||||||||||||||||||||||||||||||||||||||||||
| XRT73LC04AIV | MaxLinear, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | 500mA | 1.6mm | RoHS Compliant | /files/maxlinearinc-xrt73lc04aiv-datasheets-1952.pdf | 144-LQFP | 20mm | 20mm | 144 | LIU | compliant | e3 | Matte Tin (Sn) | YES | 3.135V~3.465V | QUAD | GULL WING | 260 | 3.3V | 0.5mm | PCM TRANSCEIVER | NOT SPECIFIED | 4 | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||
| ZL50022GAC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | 175mA | Non-RoHS Compliant | /files/microchiptechnology-zl50022gac-datasheets-1993.pdf | 256-BGA | 256 | 256 | no | 32 | e0 | TIN LEAD | 1.71V~1.89V | BOTTOM | BALL | 225 | 1.8V | ZL50022 | 30 | Other Telecom ICs | 1 | Not Qualified | Switch | ||||||||||||||||||||||||||||||||
| RPCS3487C.B0-998978 | Inphi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 4 (72 Hours) | 1369-BGA | Interlaken, XAUI | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE89316QVCT | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 4-Wire Serial | OBSOLETE (Last Updated: 1 month ago) | TELECOM CIRCUIT | 2 | 48-LQFP | |||||||||||||||||||||||||||||||||||||||||||||||||
| XRT7300IVTR | MaxLinear, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 180mA | /files/maxlinearinc-xrt7300ivtrf-datasheets-1584.pdf | 44-LQFP | LIU | 4.75V~5.25V | 1 | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||||||||||
| XRT75L06DIB-F | MaxLinear, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 4 (72 Hours) | /files/maxlinearinc-xrt75l06dib-datasheets-1724.pdf | 217-BBGA | Logic | 3.135V~3.465V | 6 | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||||||||||||||||||||
| ZL50058GAG2 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 240mA | ROHS3 Compliant | 2007 | /files/microchiptechnology-zl50057gac-datasheets-1917.pdf | 256-BGA | 256 | 15 Weeks | 256 | 48 | No | e1 | TIN SILVER COPPER | 1.71V~1.89V | BOTTOM | BALL | 1.8V | ZL50058 | 1 | Switch | ||||||||||||||||||||||||||||||||||
| ZL50114GAG | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 950mA | 2.53mm | Non-RoHS Compliant | /files/microchiptechnology-zl50114gag-datasheets-2007.pdf | 552-BGA | 35mm | 35mm | 552 | TDM | no | e0 | TIN LEAD | YES | 1.65V~1.95V | BOTTOM | BALL | 225 | 1.8V | ZL50114 | 30 | Other Telecom ICs | 1 | Not Qualified | S-PBGA-B552 | Telecom Circuit |
