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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Lead Free | Number of Terminations | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | ECCN Code | Contact Plating | Radiation Hardening | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Pin Count | Temperature Grade | Time@Peak Reflow Temperature-Max (s) | Power Supplies | Memory Size | Memory Type | Frequency (Max) | Access Time | Memory Width | Standby Current-Max | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | I2C Control Byte | Reverse Pinout | Manufacturer: | Technology: | Length: | Width: | Ihs Manufacturer: | JESD-30 Code: | JESD-609 Code: | Manufacturer Part Number: | Number of Terminals: | Operating Temperature-Max: | Package Body Material: | Package Description: | Package Shape: | Package Style: | Part Life Cycle Code: | Peak Reflow Temperature (Cel): | Reach Compliance Code: | Risk Rank: | Surface Mount: | Terminal Finish: | Terminal Form: | Terminal Position: | Rohs Code: | Operating Temperature-Min: | HTS Code: | Package Code: | Temperature Grade: | Terminal Pitch: | Supply Voltage-Nom: | Supply Voltage-Max: | Supply Voltage-Min: | Organization: |
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| 24LC256-I/STG | Microchip |
Min: 1 Mult: 1 |
download | Surface Mount | Tape and Reel | 1 (Unlimited) | 85°C | -40°C | CMOS | 400kHz | 1.2mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/microchip-24lc256istg-datasheets-3939.pdf | TSSOP | 4.4mm | 3mm | Lead Free | 8 | 5.5V | 2.5V | 8 | I2C, Serial | 256 kb | yes | EAR99 | Tin | No | 1 | 3mA | e3 | DUAL | GULL WING | 260 | 0.65mm | 8 | INDUSTRIAL | 40 | 3/5V | 32kB | EEPROM | 400kHz | 900 ns | 8 | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | NO | |||||||||||||||||||||||||||||||||||||
| AGLN125V2-VQ100I | Microchip |
Min: 1 Mult: 1 |
/files/900a335d19f0438f614d9ce972b8fa97.pdf&product=microchip-agln125v2vq100i-32736780 | Microsemi Corporation | CMOS | 14 mm | 14 mm | MICROSEMI CORP | S-PQFP-G100 | e0 | AGLN125V2-VQ100I | 100 | 85 °C | PLASTIC/EPOXY | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | 230 | unknown | 5.59 | YES | Tin/Lead (Sn/Pb) | GULL WING | QUAD | No | -40 °C | 8542.39.00.01 | TFQFP | INDUSTRIAL | 0.5 mm | 1.2 V | 1.575 V | 1.14 V | 3072 CLBS, 125000 GATES | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P1000-PQ208I | Microchip |
Min: 1 Mult: 1 |
/files/604a024c61135ab1600c9942925d6961.pdf&product=microchip-a3p1000pq208i-32872627 | Microsemi Corporation | CMOS | 28 mm | 28 mm | MICROSEMI CORP | S-PQFP-G208 | e0 | A3P1000-PQ208I | 208 | 100 °C | PLASTIC/EPOXY | FQFP, | SQUARE | FLATPACK, FINE PITCH | Obsolete | 225 | compliant | 7.75 | YES | Tin/Lead (Sn/Pb) | GULL WING | QUAD | No | -40 °C | 8542.39.00.01 | FQFP | INDUSTRIAL | 0.5 mm | 1.5 V | 1.575 V | 1.425 V | 24576 CLBS, 1000000 GATES |
