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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Lifecycle Status | Pbfree Code | Impedance | ECCN Code | Additional Feature | Radiation Hardening | Max Frequency | Reach Compliance Code | HTS Code | Tolerance | JESD-609 Code | Feature | Terminal Finish | Polarity | Reference Standard | Surface Mount | Max Power Dissipation | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Element Configuration | Time@Peak Reflow Temperature-Max (s) | Power Dissipation | Number of Elements | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Memory Size | Number of I/O | Peripherals | RAM Size | Voltage - Input | Turn On Delay Time | Speed Grade | Max Reverse Leakage Current | Zener Voltage | Case Connection | Propagation Delay | Test Current | Architecture | Number of Outputs | Speed | Power - Max | Diode Element Material | Reference Voltage | Voltage Tol-Max | Diode Type | Voltage Tolerance | Number of Registers | Number of Inputs | Clock Frequency | Number of Gates | Utilized IC / Part | Impedance-Max | Core Processor | Connectivity | Number of Logic Elements/Cells | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Flash Size | Number of CLBs | Supplied Contents | Current - Reverse Leakage @ Vr | Voltage - Forward (Vf) (Max) @ If | Voltage - Zener (Nom) (Vz) | Module/Board Type | Total RAM Bits | Number of LABs/CLBs | Combinatorial Delay of a CLB-Max | Outputs and Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SM3F-121CS-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | Hardware | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S025TS-1FG484M | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -55°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | Non-RoHS Compliant | /files/microsemicorporation-m2s150ts1fc1152m-datasheets-6169.pdf | 484-BGA | 23mm | 23mm | 484 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 267 | 166MHz | 267 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SMAX-1272CG-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | Module | Lead Free | 14 Weeks | Socket Adapter | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090TS-1FCSG325 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.16mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 325-TFBGA, CSPBGA | 13.5mm | 11mm | 325 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | LG-MIN, WD-MIN | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | R-PBGA-B325 | 180 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 180 | 166MHz | 180 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL050T-FGG484I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO2 | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s050tfgg484-datasheets-1246.pdf | 484-BGA | 23mm | 23mm | 484 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 8542.39.00.01 | YES | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | 267 | 267 | 56340 | FIELD PROGRAMMABLE GATE ARRAY | 1869824 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090TS-FG484 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BGA | 23mm | 23mm | 484 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 267 | 166MHz | 267 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGLN010V2-UCG36I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO nano | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 3μA | 0.8mm | RoHS Compliant | 2015 | /files/microsemicorporation-agln010v5ucg36i-datasheets-4103.pdf | 36-WFBGA, CSPBGA | 3mm | 3mm | 1.5V | Lead Free | 36 | 20 Weeks | 36 | IN PRODUCTION (Last Updated: 1 month ago) | 250MHz | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.4mm | AGLN010 | NOT SPECIFIED | Not Qualified | 23 | 10000 | 260 | FIELD PROGRAMMABLE GATE ARRAY | 260 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150-1FCS536 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0686.pdf | 536-LFBGA, CSPBGA | 536 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B536 | 293 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 293 | 166MHz | 293 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL010-VFG400 | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO2 | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | 1.51mm | RoHS Compliant | 2013 | /files/microsemicorporation-m2s050tfgg484-datasheets-1246.pdf | 400-LFBGA | 17mm | 17mm | 1.2V | 400 | 11 Weeks | 400 | IN PRODUCTION (Last Updated: 1 month ago) | 8542.39.00.01 | YES | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | M2GL010 | 30 | Field Programmable Gate Arrays | Not Qualified | 114kB | 195 | 114kB | 195 | 12084 | FIELD PROGRAMMABLE GATE ARRAY | 933888 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090T-FGG676I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0686.pdf | 676-BGA | 27mm | 27mm | 676 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B676 | 425 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 425 | 166MHz | 425 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P400-1FG144 | Microsemi |
Min: 1 Mult: 1 |
download | ProASIC3 | Surface Mount | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 272MHz | Non-RoHS Compliant | 2013 | /files/microsemicorporation-a3p600pqg208i-datasheets-5753.pdf | 144-LBGA | 13mm | 1.05mm | 13mm | 1.5V | 144 | 20 Weeks | 400.011771mg | 144 | IN PRODUCTION (Last Updated: 2 weeks ago) | No | e0 | TIN LEAD SILVER | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | A3P400 | 30 | 97 | 6.8kB | 1 | 9216 | 400000 | FIELD PROGRAMMABLE GATE ARRAY | 55296 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090-1FCS325 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.16mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 325-TFBGA, CSPBGA | 13.5mm | 11mm | 325 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | LG-MIN, WD-MIN | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | R-PBGA-B325 | 180 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 180 | 166MHz | 180 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P600-FG144 | Microsemi |
Min: 1 Mult: 1 |
download | ProASIC3 | Surface Mount | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | 70°C | 0°C | Non-RoHS Compliant | 2009 | /files/microsemicorporation-a3p600pqg208i-datasheets-5753.pdf | 144-LBGA | 13mm | 1.05mm | 13mm | 1.5V | 10 Weeks | 400.011771mg | 1.575V | 1.425V | 144 | No | 231MHz | 1.425V~1.575V | A3P600 | 144-FPBGA (13x13) | 97 | 13.5kB | 13824 | 600000 | 110592 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150T-1FCSG536 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 536-LFBGA, CSPBGA | 536 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B536 | 293 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 293 | 166MHz | 293 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EX128-PTQG100 | Microsemi |
Min: 1 Mult: 1 |
download | EX | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 1 (Unlimited) | CMOS | RoHS Compliant | 2012 | /files/microsemicorporation-ex64tqg64a-datasheets-6238.pdf | 100-LQFP | 14mm | 1.4mm | 14mm | 2.5V | 100 | 12 Weeks | 657.000198mg | 100 | IN PRODUCTION (Last Updated: 4 weeks ago) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | e3 | Matte Tin (Sn) | 2.3V~2.7V | QUAD | GULL WING | 260 | 2.5V | 0.5mm | EX128 | 40 | 70 | 357MHz | 6000 | 256 | FIELD PROGRAMMABLE GATE ARRAY | 0.7 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150-FCG1152I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.9mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 1152-BBGA, FCBGA | 35mm | 35mm | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B1152 | 574 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 574 | 166MHz | 574 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APA075-TQG144 | Microsemi |
Min: 1 Mult: 1 |
download | ProASICPLUS | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 180MHz | RoHS Compliant | 2000 | /files/microsemicorporation-apa150pqg208-datasheets-1175.pdf | 144-LQFP | 20mm | 1.4mm | 20mm | 2.5V | 144 | 12 Weeks | 1.319103g | 144 | IN PRODUCTION (Last Updated: 1 month ago) | No | 8542.39.00.01 | e3 | Matte Tin (Sn) | 2.3V~2.7V | QUAD | GULL WING | 260 | 2.5V | 0.5mm | APA075 | 40 | Field Programmable Gate Arrays | 2.52.5/3.3V | 107 | 3.4kB | 107 | 3072 | 75000 | FIELD PROGRAMMABLE GATE ARRAY | 27648 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150TS-FCVG484I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | 3.15mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BFBGA | 19mm | 19mm | 484 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | yes | LG-MIN, WD-MIN | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | S-PBGA-B484 | 273 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LX1744 EVAL KIT | Microsemi |
Min: 1 Mult: 1 |
download | Bulk | 1 (Unlimited) | /files/microsemicorporation-lx1744cpw-datasheets-1965.pdf | Dimmable | 1.6V~6V | LX1744 | Board(s) | 1, Non-Isolated | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150-1FCSG536I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 536-LFBGA, CSPBGA | 536 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B536 | 293 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 293 | 166MHz | 293 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL050-1FG484I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO2 | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | 2.44mm | Non-RoHS Compliant | 2013 | /files/microsemicorporation-m2gl005s1vf400i-datasheets-6764.pdf | 484-BGA | 23mm | 23mm | Contains Lead | 484 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | M2GL050 | 20 | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | 228.3kB | 267 | 267 | 56340 | FIELD PROGRAMMABLE GATE ARRAY | 1869824 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MX1DS10PE | Microsemi |
Min: 1 Mult: 1 |
download | Prescaler | 1 (Unlimited) | 50MHz~15GHz | Non-RoHS Compliant | /files/microsemicorporation-mx1ds10p-datasheets-8425.pdf | Board(s) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AX250-FGG256I | Microsemi |
Min: 1 Mult: 1 |
download | Axcelerator | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 649MHz | RoHS Compliant | 2012 | /files/microsemicorporation-ax250fg484m-datasheets-6326.pdf | 256-LBGA | 17mm | 1.2mm | 17mm | 1.5V | 256 | 22 Weeks | 400.011771mg | 256 | IN PRODUCTION (Last Updated: 4 weeks ago) | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | AX250 | 40 | Field Programmable Gate Arrays | 1.51.5/3.32.5/3.3V | 138 | 6.8kB | 990 ps | 990 ps | 248 | 2816 | 250000 | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 4224 | 0.99 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 1N827A | Microsemi |
Min: 1 Mult: 1 |
download | Through Hole | Through Hole | -55°C~175°C | Bulk | 1 (Unlimited) | ZENER | Non-RoHS Compliant | 1999 | /files/microsemicorporation-1n823a-datasheets-0545.pdf | DO-204AH, DO-35, Axial | Contains Lead | 2 | 20 Weeks | 2 | OBSOLETE (Last Updated: 1 month ago) | no | 10Ohm | EAR99 | METALLURGICALLY BONDED | No | 8541.10.00.50 | ±5% | e0 | Tin/Lead (Sn/Pb) | 500mW | WIRE | 2 | Single | 500mW | 1 | 2μA | 6.2V | ISOLATED | 7.5mA | SILICON | 6.2V | 4.84% | ZENER DIODE | 5% | 10Ohm | 2μA @ 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL090T-1FG676I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO2 | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | Non-RoHS Compliant | 2013 | /files/microsemicorporation-m2s050tfgg484-datasheets-1246.pdf | 676-BGA | 27mm | 27mm | 676 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | YES | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | M2GL090T | 20 | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B676 | 425 | 323.3kB | 425 | 425 | 86316 | FIELD PROGRAMMABLE GATE ARRAY | 2648064 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 2EZ22D5 | Microsemi |
Min: 1 Mult: 1 |
download | Through Hole | Through Hole | -65°C~150°C | Cut Tape (CT) | 1 (Unlimited) | 150°C | -65°C | RoHS Compliant | 1999 | /files/microsemicorporation-2ez36d5-datasheets-4231.pdf | DO-204AL, DO-41, Axial | OBSOLETE (Last Updated: 1 month ago) | 12Ohm | ±5% | 2W | 2EZ22 | DO-204AL (DO-41) | 22V | 2W | 12Ohms | 500nA @ 16.7V | 1.2V @ 200mA | 22V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APA075-PQG208I | Microsemi |
Min: 1 Mult: 1 |
download | ProASICPLUS | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 180MHz | 5mA | RoHS Compliant | 2007 | /files/microsemicorporation-apa150pqg208-datasheets-1175.pdf | 208-BFQFP | 28mm | 3.4mm | 28mm | 2.5V | 208 | 10 Weeks | 208 | IN PRODUCTION (Last Updated: 1 month ago) | No | 8542.39.00.01 | 2.3V~2.7V | QUAD | GULL WING | 245 | 2.5V | 0.5mm | APA075 | 40 | Field Programmable Gate Arrays | 2.52.5/3.3V | 3.4kB | 158 | 3.4kB | 158 | 3072 | 75000 | FIELD PROGRAMMABLE GATE ARRAY | 27648 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JANTX1N5521B-1 | Microsemi |
Min: 1 Mult: 1 |
download | Military, MIL-PRF-19500/437 | Through Hole | Through Hole | -65°C~175°C | Bulk | 1 (Unlimited) | ZENER | Non-RoHS Compliant | 1999 | /files/microsemicorporation-jantx1n5521b1-datasheets-4476.pdf | DO-204AH, DO-35, Axial | 2 | 14 Weeks | 2 | IN PRODUCTION (Last Updated: 4 weeks ago) | no | EAR99 | METALLURGICALLY BONDED | No | 8541.10.00.50 | ±5% | e0 | Tin/Lead (Sn/Pb) | UNIDIRECTIONAL | MIL-19500 | 500mW | WIRE | 2 | Single | 417mW | 1 | Qualified | 3μA | 4.3V | ISOLATED | 20mA | SILICON | 4.3V | 5% | ZENER DIODE | 5% | 18Ohm | 3μA @ 1.5V | 1.1V @ 200mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P1000L-1FG144I | Microsemi |
Min: 1 Mult: 1 |
download | ProASIC3L | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2009 | /files/microsemicorporation-a3p600lfgg144-datasheets-3290.pdf | 144-LBGA | 13mm | 1.05mm | 13mm | 1.2V | 144 | 12 Weeks | 400.011771mg | 144 | IN PRODUCTION (Last Updated: 1 month ago) | No | 892.86MHz | e0 | TIN LEAD SILVER | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.2V | A3P1000L | 30 | Field Programmable Gate Arrays | 97 | 18kB | 1 | 97 | 24576 | 1000000 | FIELD PROGRAMMABLE GATE ARRAY | 147456 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JANTX1N4627-1 | Microsemi |
Min: 1 Mult: 1 |
download | Military, MIL-PRF-19500/435 | Through Hole | Through Hole | -65°C~175°C | Bulk | 1 (Unlimited) | ZENER | Non-RoHS Compliant | 1999 | /files/microsemicorporation-jantx1n46261-datasheets-4374.pdf | DO-204AH, DO-35, Axial | Contains Lead | 2 | 14 Weeks | 2 | IN PRODUCTION (Last Updated: 3 weeks ago) | no | 1.2kOhm | EAR99 | METALLURGICALLY BONDED | No | 8541.10.00.50 | ±5% | e0 | Tin/Lead (Sn/Pb) | UNIDIRECTIONAL | MIL-19500/435 | 500mW | WIRE | 1N4627 | 2 | Single | 480mW | 1 | Qualified | 10μA | 6.2V | ISOLATED | 250μA | SILICON | 6.2V | 5% | ZENER DIODE | 5% | 1.2kOhm | 10μA @ 5V | 1.1V @ 200mA |
