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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Lifecycle Status | Pbfree Code | ECCN Code | Additional Feature | Radiation Hardening | Max Frequency | Reach Compliance Code | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Applications | Reference Standard | Surface Mount | Max Power Dissipation | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | Power Dissipation | Number of Elements | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Data Rate | Memory Size | Number of I/O | Peripherals | Core Architecture | RAM Size | Turn On Delay Time | Rise Time | Fall Time (Typ) | Turn-Off Delay Time | Continuous Drain Current (ID) | Gate to Source Voltage (Vgs) | Transistor Element Material | Configuration | Case Connection | Transistor Application | Polarity/Channel Type | Drain to Source Voltage (Vdss) | Supply Type | Architecture | DS Breakdown Voltage-Min | FET Technology | Number of Outputs | Speed | Power - Max | JEDEC-95 Code | Collector Emitter Breakdown Voltage | Collector Emitter Voltage (VCEO) | Max Collector Current | Transition Frequency | Number of Inputs | Output | Organization | Number of Gates | Pulsed Drain Current-Max (IDM) | Drain-source On Resistance-Max | Avalanche Energy Rating (Eas) | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Voltage - Collector Emitter Breakdown (Max) | Current - Collector (Ic) (Max) | FET Type | Input Capacitance (Ciss) (Max) @ Vds | Turn Off Time-Max (toff) | Turn On Time-Max (ton) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Flash Size | Number of Equivalent Gates | Collector Base Voltage (VCBO) | Emitter Base Voltage (VEBO) | Current - Collector Cutoff (Max) | Transistor Type | DC Current Gain (hFE) (Min) @ Ic, Vce | Vce Saturation (Max) @ Ib, Ic | Multiplexer/Demultiplexer Circuit | Voltage - Supply, Single (V+) | Rds On (Max) @ Id, Vgs | Vgs(th) (Max) @ Id | Current - Continuous Drain (Id) @ 25°C | Gate Charge (Qg) (Max) @ Vgs | FET Feature | Manufacturer: | Subcategory: | Configuration: | ECCN Code: | Ihs Manufacturer: | JESD-30 Code: | Manufacturer Part Number: | Number of Elements: | Number of Terminals: | Operating Temperature-Max: | Package Body Material: | Package Description: | Package Shape: | Package Style: | Part Life Cycle Code: | Reach Compliance Code: | Risk Rank: | Surface Mount: | Terminal Form: | Terminal Position: | Part Package Code: | Pin Count: |
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| JAN2N5667S | Microsemi |
Min: 1 Mult: 1 |
download | Military, MIL-PRF-19500/455 | Through Hole | Through Hole | -65°C~200°C TJ | Bulk | 1 (Unlimited) | Non-RoHS Compliant | 2007 | TO-205AD, TO-39-3 Metal Can | 2 | 22 Weeks | 3 | IN PRODUCTION (Last Updated: 1 month ago) | no | EAR99 | No | 8541.29.00.95 | e0 | Tin/Lead (Sn/Pb) | MIL-19500/455E | 1.2W | BOTTOM | PIN/PEG | 2 | 1 | Qualified | O-MBFM-P2 | SILICON | SINGLE | COLLECTOR | SWITCHING | NPN | TO-5 | 300V | 5A | 5A | 400V | 200nA | NPN | 25 @ 1A 5V | 1V @ 1A, 5A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MRF905 | Microsemi |
Min: 1 Mult: 1 |
Advanced Semiconductor Inc | Other Transistors | SINGLE | EAR99 | ASI SEMICONDUCTOR INC | O-MBCY-W3 | MRF905 | 1 | 3 | 200 °C | METAL | CYLINDRICAL, O-MBCY-W3 | ROUND | CYLINDRICAL | Active | unknown | 5.41 | NO | WIRE | BOTTOM | TO-46 | 3 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S005S-1VF256 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.56mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 256-LFBGA | 14mm | 14mm | 256 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | LG-MIN, WD-MIN | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B256 | 161 | DDR | 64KB | MCU, FPGA | 161 | 166MHz | 161 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JAN2N6251 | Microsemi |
Min: 1 Mult: 1 |
download | Military, MIL-PRF-19500/510 | Through Hole | Through Hole | -65°C~200°C TJ | Bulk | 1 (Unlimited) | Non-RoHS Compliant | /files/microsemicorporation-jan2n6250-datasheets-0518.pdf | TO-3 | 2 | 3 | IN PRODUCTION (Last Updated: 1 month ago) | no | No | 8541.29.00.95 | MIL-19500/510 | 6W | BOTTOM | PIN/PEG | 2 | 1 | Qualified | O-MBFM-P2 | SILICON | SINGLE | COLLECTOR | NPN | 5.5W | TO-204AA | 350V | 10A | 10A | 450V | 1mA | NPN | 6 @ 10A 3V | 1.5V @ 1.67A, 10A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S005-FG484I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BGA | 23mm | 23mm | 484 | 4 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 209 | DDR | 64KB | MCU, FPGA | 209 | 166MHz | 209 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JAN2N3057A | Microsemi |
Min: 1 Mult: 1 |
download | Military, MIL-PRF-19500/391 | Through Hole | Through Hole | -65°C~200°C TJ | Bulk | 1 (Unlimited) | 200°C | -65°C | Non-RoHS Compliant | 2007 | /files/microsemicorporation-2n3057a-datasheets-4927.pdf | TO-206AB, TO-46-3 Metal Can | 23 Weeks | 3 | IN PRODUCTION (Last Updated: 1 month ago) | No | 500mW | TO-46-3 | 500mW | 80V | 500mV | 1A | 80V | 1A | 140V | 10nA | NPN | 50 @ 500mA 10V | 500mV @ 50mA, 500mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F200M3F-FG256 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion® | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 80MHz | 2mA | 1.7mm | Non-RoHS Compliant | 2012 | /files/microsemicorporation-a2f500m3gfgg484i-datasheets-0641.pdf | 256-LBGA | 17mm | 17mm | 1.5V | 256 | 12 Weeks | 1.575V | 1.425V | 256 | EBI/EMI, Ethernet, I2C, SPI, UART, USART | TIN LEAD/TIN LEAD SILVER | BOTTOM | BALL | 225 | 1.5V | 1mm | A2F200 | 30 | Field Programmable Gate Arrays | Not Qualified | MCU - 25, FPGA - 66 | DMA, POR, WDT | ARM | 64KB | MCU, FPGA | 66 | 200000 | ARM® Cortex®-M3 | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 8 | FIELD PROGRAMMABLE GATE ARRAY | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 2N2219 | Microsemi |
Min: 1 Mult: 1 |
download | Through Hole | Through Hole | -55°C~200°C TJ | Bulk | 1 (Unlimited) | 200°C | -55°C | Non-RoHS Compliant | 2007 | /files/microsemicorporation-2n2219a-datasheets-8170.pdf | TO-205AD, TO-39-3 Metal Can | 22 Weeks | 3 | IN PRODUCTION (Last Updated: 3 weeks ago) | No | 800mW | TO-39 (TO-205AD) | 800mW | 30V | 1.6V | 800mA | 30V | 800mA | 60V | 10nA | NPN | 100 @ 150mA 10V | 1.6V @ 50mA, 500mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S005S-1FG484 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BGA | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-FPBGA (23x23) | 209 | DDR | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 5K Logic Modules | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JAN2N3251A | Microsemi |
Min: 1 Mult: 1 |
download | Military, MIL-PRF-19500/323 | Through Hole | Through Hole | -65°C~200°C TJ | Bulk | 1 (Unlimited) | Non-RoHS Compliant | 2007 | /files/microsemicorporation-2n3250a-datasheets-4988.pdf | TO-205AD, TO-39-3 Metal Can | 3 | 3 | no | EAR99 | No | e0 | Tin/Lead (Sn/Pb) | 360mW | BOTTOM | WIRE | 3 | 360mW | 1 | SILICON | SINGLE | COLLECTOR | SWITCHING | PNP | 60V | 200mA | 70ns | 60V | 5V | 10μA ICBO | PNP | 100 @ 10mA 1V | 500mV @ 5mA, 50mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S010T-VF256I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.56mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 256-LFBGA | 14mm | 14mm | 256 | 10 Weeks | LG-MIN, WD-MIN | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B256 | 138 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 138 | 166MHz | 138 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JANS2N3439UA | Microsemi |
Min: 1 Mult: 1 |
download | Military, MIL-PRF-19500/368 | Surface Mount | Surface Mount | -65°C~200°C TJ | Bulk | 1 (Unlimited) | Non-RoHS Compliant | 2007 | /files/microsemicorporation-2n3440ua-datasheets-5357.pdf | 4-SMD, No Lead | 4 | 20 Weeks | 4 | IN PRODUCTION (Last Updated: 1 month ago) | no | EAR99 | No | e0 | Tin/Lead (Sn/Pb) | MIL-19500/368F | 800mW | DUAL | 4 | 1 | Other Transistors | Qualified | SILICON | SINGLE | NPN | 350V | 1A | 1A | 10000ns | 1000ns | 450V | 2μA | NPN | 40 @ 20mA 10V | 500mV @ 4mA, 50mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S005S-1VFG256T2 | Microsemi |
Min: 1 Mult: 1 |
download | Automotive, AEC-Q100, SmartFusion®2 | -40°C~125°C TJ | Tray | 3 (168 Hours) | RoHS Compliant | /files/microsemicorporation-m2s005s1vfg400t2-datasheets-2815.pdf | 256-LBGA | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | yes | NOT SPECIFIED | NOT SPECIFIED | 161 | DDR | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JANTX2N5672 | Microsemi |
Min: 1 Mult: 1 |
download | Military, MIL-PRF-19500/488 | Through Hole | Through Hole | -65°C~200°C TJ | Bulk | 1 (Unlimited) | Non-RoHS Compliant | /files/microsemi-jantx2n5672-datasheets-6789.pdf | TO-204AA, TO-3 | 2 | 3 | IN PRODUCTION (Last Updated: 3 weeks ago) | no | EAR99 | No | e0 | Tin/Lead (Sn/Pb) | 6W | BOTTOM | PIN/PEG | 2 | 6W | 1 | Qualified | O-MBFM-P2 | SILICON | SINGLE | COLLECTOR | NPN | 120V | 30A | 50MHz | 150V | 7V | 10mA | NPN | 20 @ 15A 2V | 5V @ 6A, 30A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S005-VFG400I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.51mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 400-LFBGA | 17mm | 17mm | 400 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B400 | 169 | DDR | 64KB | MCU, FPGA | 171 | 166MHz | 171 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JAN2N6277 | Microsemi |
Min: 1 Mult: 1 |
download | Military, MIL-PRF-19500/514 | Through Hole | Through Hole | -65°C~200°C TJ | Bulk | 1 (Unlimited) | Non-RoHS Compliant | 2007 | /files/microsemicorporation-jantx2n6274-datasheets-1862.pdf | TO-204AA, TO-3 | 2 | 3 | IN PRODUCTION (Last Updated: 1 month ago) | no | EAR99 | No | e0 | Tin/Lead (Sn/Pb) | MIL | 250W | BOTTOM | PIN/PEG | 2 | 1 | Other Transistors | Qualified | O-MBFM-P2 | SILICON | SINGLE | COLLECTOR | SWITCHING | NPN | 150V | 50A | 30MHz | 50A | 180V | 50μA | NPN | 30 @ 20A 4V | 3V @ 10A, 50A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S010T-1VF400I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 166MHz | Non-RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 400-LFBGA | 10 Weeks | 400 | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 3 weeks ago) | M2S010T | 400-VFBGA (17x17) | 195 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 10K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JANS2N4150 | Microsemi |
Min: 1 Mult: 1 |
download | Military, MIL-PRF-19500/394 | Through Hole | Through Hole | -65°C~200°C TJ | Bulk | 1 (Unlimited) | Non-RoHS Compliant | 2007 | TO-205AA, TO-5-3 Metal Can | 3 | 3 | IN PRODUCTION (Last Updated: 1 month ago) | EAR99 | No | 8541.29.00.95 | e0 | TIN LEAD | 1W | BOTTOM | WIRE | 3 | 1 | Qualified | SILICON | SINGLE | COLLECTOR | SWITCHING | NPN | 70V | 10A | 10A | 2000ns | 550ns | 100V | 10μA | NPN | 40 @ 5A 5V | 2.5V @ 1A, 10A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S025T-1FCS325 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.01mm | Non-RoHS Compliant | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 325-TFBGA, CSPBGA | 11mm | 11mm | 325 | 10 Weeks | LG-MIN, WD-MIN | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B325 | 180 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 180 | 166MHz | 180 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JANTX2N3421S | Microsemi |
Min: 1 Mult: 1 |
download | Military, MIL-PRF-19500/393 | Through Hole | Through Hole | -65°C~200°C TJ | Bulk | 1 (Unlimited) | Non-RoHS Compliant | 2007 | /files/microsemicorporation-2n3419s-datasheets-5134.pdf | TO-205AD, TO-39-3 Metal Can | 3 | 20 Weeks | 3 | IN PRODUCTION (Last Updated: 4 weeks ago) | no | EAR99 | No | e0 | Tin/Lead (Sn/Pb) | 1W | BOTTOM | WIRE | 2 | 1W | 1 | Other Transistors | Qualified | SILICON | SINGLE | COLLECTOR | SWITCHING | NPN | 80V | 3A | 125V | 8V | 5μA | NPN | 40 @ 1A 2V | 500mV @ 200mA, 2A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F500M3G-CSG288I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion® | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 80MHz | 1.05mm | RoHS Compliant | /files/microsemicorporation-a2f500m3gfgg484i-datasheets-0641.pdf | 288-TFBGA, CSPBGA | 11mm | 11mm | 288 | 12 Weeks | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.5V | 0.5mm | A2F500M3G | 1.575V | 1.425V | 30 | Field Programmable Gate Arrays | 1.51.82.53.3V | Not Qualified | S-PBGA-B288 | MCU - 31, FPGA - 78 | DMA, POR, WDT | ARM | 64KB | MCU, FPGA | 78 | 78 | 11520 CLBS, 500000 GATES | ARM® Cortex®-M3 | EBI/EMI, Ethernet, I2C, SPI, UART/USART | FIELD PROGRAMMABLE GATE ARRAY | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | 500000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC3108XVP-01 | Microsemi |
Min: 1 Mult: 1 |
download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | 110°C | 0°C | RoHS Compliant | 2003 | /files/microsemicorporation-vsc3108xvp01-datasheets-2417.pdf | 69-CBGA | 8mm | 8mm | 69 | 69 | 1 | Backplane, Cable Interconnect | BOTTOM | BALL | NOT SPECIFIED | 2.5V | 0.8mm | OTHER | 2.625V | 1 | CROSS POINT SWITCH | NOT SPECIFIED | Multiplexer or Switches | 2.5/3.3V | Not Qualified | Single | SEPARATE OUTPUT | 8:8 | 2.2V 3.3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F200M3F-FGG484I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion® | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 100MHz | 7mA | RoHS Compliant | 2013 | /files/microsemicorporation-a2f500m3gfgg484i-datasheets-0641.pdf | 484-BGA | 1.5V | Lead Free | 12 Weeks | 1.575V | 1.425V | 484 | EBI/EMI, Ethernet, I2C, SPI, UART, USART | No | 100MHz | A2F200 | 484-FPBGA (23x23) | 400 kbps | 4.5kB | MCU - 41, FPGA - 94 | DMA, POR, WDT | ARM | 64KB | MCU, FPGA | 80MHz | 200000 | ARM® Cortex®-M3 | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 2500 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APTM100H45STG | Microsemi |
Min: 1 Mult: 1 |
download | Chassis Mount, Screw | Chassis Mount | -40°C~150°C TJ | Bulk | 1 (Unlimited) | ENHANCEMENT MODE | RoHS Compliant | 1999 | /files/microsemicorporation-aptm100h45stg-datasheets-3269.pdf | SP4 | 14 | 36 Weeks | 4 | yes | EAR99 | AVALANCHE RATED | No | e1 | TIN SILVER COPPER | 357W | UPPER | UNSPECIFIED | 14 | 357W | 4 | 10 ns | 12ns | 35 ns | 121 ns | 18A | 30V | SILICON | ISOLATED | SWITCHING | 1000V 1kV | 1000V | METAL-OXIDE SEMICONDUCTOR | 72A | 2500 mJ | 4 N-Channel (H-Bridge) | 4350pF @ 25V | 540m Ω @ 9A, 10V | 5V @ 2.5mA | 154nC @ 10V | Standard | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S025T-VFG256I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.56mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 256-LBGA | 14mm | 14mm | 256 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | LG-MIN, WD-MIN | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B256 | 138 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 138 | 166MHz | 138 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APTM20AM06SG | Microsemi |
Min: 1 Mult: 1 |
download | Chassis Mount, Screw | Chassis Mount | -40°C~150°C TJ | Bulk | 1 (Unlimited) | ENHANCEMENT MODE | RoHS Compliant | /files/microsemicorporation-aptm20am06sg-datasheets-9451.pdf | SP6 | 7 | 36 Weeks | 6 | yes | EAR99 | AVALANCHE RATED | No | e1 | TIN SILVER COPPER | 1.25kW | UPPER | UNSPECIFIED | 7 | 1.25kW | 2 | R-XUFM-X7 | 28 ns | 56ns | 99 ns | 81 ns | 300A | 30V | SILICON | ISOLATED | SWITCHING | 200V | METAL-OXIDE SEMICONDUCTOR | 1250W | 1300 mJ | 2 N-Channel (Half Bridge) | 18500pF @ 25V | 7.2m Ω @ 150A, 10V | 5V @ 6mA | 325nC @ 10V | Standard | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S025TS-FCS325 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.01mm | Non-RoHS Compliant | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 325-TFBGA, CSPBGA | 11mm | 11mm | 325 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | LG-MIN, WD-MIN | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B325 | 180 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 180 | 166MHz | 180 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APTM120A15FG | Microsemi |
Min: 1 Mult: 1 |
download | Chassis Mount, Screw | Chassis Mount | -40°C~150°C TJ | Bulk | 1 (Unlimited) | ENHANCEMENT MODE | RoHS Compliant | /files/microsemicorporation-aptm120a15fg-datasheets-9513.pdf | SP6 | 7 | 36 Weeks | 6 | yes | EAR99 | AVALANCHE RATED | No | e1 | TIN SILVER COPPER | 1.25kW | UPPER | UNSPECIFIED | 7 | 1.25kW | 2 | R-XUFM-X7 | 20 ns | 15ns | 45 ns | 160 ns | 60A | 30V | SILICON | ISOLATED | SWITCHING | 1200V 1.2kV | METAL-OXIDE SEMICONDUCTOR | 1250W | 0.175Ohm | 3000 mJ | 2 N-Channel (Half Bridge) | 20600pF @ 25V | 175m Ω @ 30A, 10V | 5V @ 10mA | 748nC @ 10V | Standard | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S025TS-FG484 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | Non-RoHS Compliant | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BGA | 23mm | 23mm | 484 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 267 | 166MHz | 267 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APTMC170AM30CT1AG | Microsemi |
Min: 1 Mult: 1 |
download | Chassis Mount, Through Hole | Chassis Mount | -40°C~150°C TJ | Bulk | 1 (Unlimited) | RoHS Compliant | 1997 | /files/microsemicorporation-aptmc170am30ct1ag-datasheets-9567.pdf | SP1 | 36 Weeks | 1 | IN PRODUCTION (Last Updated: 1 month ago) | EAR99 | 700W | NOT SPECIFIED | NOT SPECIFIED | 35 ns | 40ns | 70 ns | 150 ns | 106A | 1700V 1.7kV | 2 N Channel (Phase Leg) | 6160pF @ 1000V | 30m Ω @ 100A, 20V | 2.3V @ 5mA (Typ) | 100A Tc | 380nC @ 20V | Silicon Carbide (SiC) |
