Products
Manufacturer
RFQ
NEWS
ContactMicrosemi(18086)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Input Type | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Capacitance | Length | Height | Width | Operating Supply Voltage | Lead Free | Depth | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Lifecycle Status | Pbfree Code | Impedance | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Max Frequency | Reach Compliance Code | HTS Code | Number of Functions | Tolerance | JESD-609 Code | Feature | Terminal Finish | Polarity | Reference Standard | Surface Mount | Max Power Dissipation | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Element Configuration | Time@Peak Reflow Temperature-Max (s) | Power Dissipation | Number of Elements | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Memory Size | Number of I/O | Peripherals | Core Architecture | RAM Size | Output Type | Voltage - Input | Voltage - Load | Turn On Delay Time | Speed Grade | Max Reverse Leakage Current | Zener Voltage | Configuration | Case Connection | Propagation Delay | Test Current | Architecture | Number of Outputs | Switch Type | Speed | Output Configuration | Current - Output (Max) | Power - Max | Diode Element Material | Power Dissipation-Max | Reverse Current-Max | JEDEC-95 Code | Reference Voltage | Voltage Tol-Max | Working Test Current | Reverse Test Voltage | Diode Type | Voltage Tolerance | Number of Registers | Number of Inputs | Number of Gates | Current - Output / Channel | Utilized IC / Part | Voltage - Output | Impedance-Max | Voltage Temp Coeff-Max | Core Processor | Connectivity | Number of Logic Elements/Cells | Programmable Logic Type | Primary Attributes | Flash Size | Supplied Contents | Current - Reverse Leakage @ Vr | Voltage - Forward (Vf) (Max) @ If | Voltage - Zener (Nom) (Vz) | Ratio - Input:Output | Total RAM Bits | Number of LABs/CLBs | Combinatorial Delay of a CLB-Max | Outputs and Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2S150TS-FCV484I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | 3.15mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BFBGA | 19mm | 19mm | 484 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | no | LG-MIN,WD-MIN | 8542.39.00.01 | YES | BOTTOM | BALL | 1.2V | 0.8mm | 1.26V | 1.14V | S-PBGA-B484 | 273 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APA075-TQG100 | Microsemi |
Min: 1 Mult: 1 |
download | ProASICPLUS | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 180MHz | 5mA | RoHS Compliant | 2009 | /files/microsemicorporation-apa150pqg208-datasheets-1175.pdf | 100-LQFP | 14mm | 1.4mm | 14mm | 2.5V | Lead Free | 100 | 12 Weeks | 657.000198mg | 100 | IN PRODUCTION (Last Updated: 1 month ago) | Tin | No | 8542.39.00.01 | e3 | 2.3V~2.7V | QUAD | GULL WING | 260 | 2.5V | 0.5mm | APA075 | 40 | Field Programmable Gate Arrays | 2.52.5/3.3V | 3.4kB | 66 | 3.4kB | 66 | 3072 | 75000 | FIELD PROGRAMMABLE GATE ARRAY | 27648 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150TS-1FCSG536 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 536-LFBGA, CSPBGA | 536 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | yes | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1.26V | 1.14V | NOT SPECIFIED | S-PBGA-B536 | 293 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGLN250V2-VQ100I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO nano | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 34μA | Non-RoHS Compliant | 2013 | /files/microsemicorporation-agln010v5ucg36i-datasheets-4103.pdf | 100-TQFP | 14mm | 1mm | 14mm | 1.5V | 100 | 8 Weeks | 100 | IN PRODUCTION (Last Updated: 1 month ago) | 250MHz | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | 1.14V~1.575V | QUAD | GULL WING | 230 | 1.2V | 0.5mm | AGLN250 | 30 | Not Qualified | 68 | 4.5kB | 250000 | 6144 | FIELD PROGRAMMABLE GATE ARRAY | 36864 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150TS-FCSG536I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 536-LFBGA, CSPBGA | 536 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | yes | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1.26V | 1.14V | NOT SPECIFIED | S-PBGA-B536 | 293 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LX1990-02 EVAL | Microsemi |
Min: 1 Mult: 1 |
download | Bulk | 2 (1 Year) | 2002 | /files/microsemicorporation-lx199002eval-datasheets-3110.pdf | Programmable Output Current | 2.7V~5.5V | 30mA | LX1990 | 10V | Board(s) | 2, Non-Isolated | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F500M3G-1FG484M | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion® | -55°C~125°C TJ | Tray | 3 (168 Hours) | 100MHz | Non-RoHS Compliant | /files/microsemicorporation-a2f500m3gfgg256m-datasheets-1505.pdf | 484-BGA | 1.5V | 12 Weeks | 484 | EBI/EMI, Ethernet, I2C, SPI, UART, USART | unknown | A2F500M3G | MCU - 41, FPGA - 128 | DMA, POR, WDT | ARM | 64KB | 1 | MCU, FPGA | 11520 | ARM® Cortex®-M3 | EBI/EMI, Ethernet, I2C, SPI, UART/USART | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL050-FG484I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO2 | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BGA | 23mm | 23mm | Contains Lead | 484 | 9 Weeks | 8542.39.00.01 | YES | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | 267 | 267 | 56340 | FIELD PROGRAMMABLE GATE ARRAY | 1869824 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LX7202-22ISF | Microsemi |
Min: 1 Mult: 1 |
download | USB | Surface Mount | Surface Mount | -40°C~125°C | Tube | 1 (Unlimited) | Gull Wing | RoHS Compliant | 1997 | SOT-23-6 | 47μF | 3.1mm | 1.75mm | Lead Free | 3mm | 2 | OBSOLETE (Last Updated: 1 month ago) | EAR99 | 8504.50.80.00 | 2 | e3 | Matte Tin (Sn) | 5.25V | LX7202 | Data Line Filters | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AX250-CQ352M | Microsemi |
Min: 1 Mult: 1 |
download | Axcelerator | Surface Mount | Surface Mount | -55°C~125°C TA | Tray | 3 (168 Hours) | CMOS | 649MHz | Non-RoHS Compliant | 2005 | /files/microsemicorporation-ax250fg484m-datasheets-6326.pdf | 352-BFCQFP with Tie Bar | 48mm | 2.66mm | 48mm | 1.5V | 352 | 22 Weeks | 10.567001g | 352 | IN PRODUCTION (Last Updated: 4 weeks ago) | 3A001.A.2.C | No | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | QUAD | FLAT | 225 | 1.5V | 0.5mm | AX250 | 20 | Field Programmable Gate Arrays | 1.51.5/3.32.5/3.3V | MIL-STD-883 Class B | 198 | 6.8kB | 990 ps | 990 ps | 248 | 2816 | 250000 | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 4224 | 0.99 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM16Z4689 E3 | Microsemi |
Min: 1 Mult: 1 |
download | HEX-Reg™ | Surface Mount | -55°C~150°C | Tube | 1 (Unlimited) | ZENER | RoHS Compliant | /files/microsemicorporation-sm16z4689e3-datasheets-1457.pdf | 16-SOIC (0.154, 3.90mm Width) | 16 | EAR99 | compliant | 8541.10.00.50 | ±5% | e3 | MATTE TIN | UNIDIRECTIONAL | YES | DUAL | GULL WING | NOT SPECIFIED | 16 | NOT SPECIFIED | 8 | Other Diodes | Not Qualified | R-PDSO-G16 | 8 Independent | 1.5W | SILICON | 1.5W | 10μA | 5.1V | 5% | 0.05mA | 3V | ZENER DIODE | 10μA @ 3V | 5.1V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AX250-FG484I | Microsemi |
Min: 1 Mult: 1 |
download | Axcelerator | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 649MHz | Non-RoHS Compliant | 2005 | /files/microsemicorporation-ax250fg484m-datasheets-6326.pdf | 484-BGA | 23mm | 1.73mm | 23mm | 1.5V | 484 | 22 Weeks | 400.011771mg | 484 | IN PRODUCTION (Last Updated: 4 weeks ago) | No | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | AX250 | 30 | Field Programmable Gate Arrays | 1.51.5/3.32.5/3.3V | 248 | 6.8kB | 990 ps | 990 ps | 248 | 2816 | 250000 | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 4224 | 0.99 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CDLL4742A | Microsemi |
Min: 1 Mult: 1 |
download | Surface Mount | Surface Mount | -65°C~175°C | Bulk | 1 (Unlimited) | ZENER | Non-RoHS Compliant | 1999 | /files/microsemicorporation-cdll4742a-datasheets-5967.pdf | DO-213AB, MELF | 2 | 15 Weeks | 2 | IN PRODUCTION (Last Updated: 3 weeks ago) | no | 9Ohm | EAR99 | METALLURGICALLY BONDED | 8541.10.00.50 | ±5% | e0 | TIN LEAD | UNIDIRECTIONAL | END | WRAP AROUND | NOT SPECIFIED | 2 | Single | NOT SPECIFIED | 1W | 1 | Not Qualified | 12V | ISOLATED | 21mA | SILICON | 12V | 5% | ZENER DIODE | 5% | 9Ohm | 1μA @ 9.1V | 1.2V @ 200mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AX1000-1FG484M | Microsemi |
Min: 1 Mult: 1 |
download | Axcelerator | Surface Mount | Surface Mount | -55°C~125°C TA | Tray | 3 (168 Hours) | CMOS | 763MHz | Non-RoHS Compliant | 2012 | /files/microsemicorporation-ax250fg484m-datasheets-6326.pdf | 484-BGA | 23mm | 1.73mm | 23mm | 1.5V | 484 | 12 Weeks | 400.011771mg | 484 | No | e0 | TIN LEAD | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | AX1000 | 30 | Field Programmable Gate Arrays | MIL-STD-883 Class B | 317 | 20.3kB | 850 ps | 1 | 850 ps | 516 | 12096 | 1000000 | FIELD PROGRAMMABLE GATE ARRAY | 165888 | 18144 | 0.84 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JANTX1N4970 | Microsemi |
Min: 1 Mult: 1 |
download | Military, MIL-PRF-19500/356 | Through Hole | Through Hole | -65°C~175°C | Bulk | 1 (Unlimited) | ZENER | Non-RoHS Compliant | 1999 | /files/microsemicorporation-1n4962-datasheets-2405.pdf | E, Axial | Contains Lead | 2 | 14 Weeks | 2 | IN PRODUCTION (Last Updated: 1 month ago) | 10Ohm | EAR99 | Yes | 8541.10.00.50 | ±5% | e0 | Tin/Lead (Sn/Pb) | UNIDIRECTIONAL | MIL-19500/356H | 5W | WIRE | NOT SPECIFIED | 1N4970 | 2 | Single | NOT SPECIFIED | 5W | 1 | Qualified | 2μA | 33V | ISOLATED | 40mA | SILICON | 33V | 5% | ZENER DIODE | 5% | 10Ohm | 2μA @ 25.1V | 1.5V @ 1A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AX250-FG484 | Microsemi |
Min: 1 Mult: 1 |
download | Axcelerator | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 649MHz | Non-RoHS Compliant | 2005 | /files/microsemicorporation-ax250fg484m-datasheets-6326.pdf | 484-BGA | 23mm | 1.73mm | 23mm | 1.5V | 484 | 22 Weeks | 400.011771mg | 484 | IN PRODUCTION (Last Updated: 4 weeks ago) | No | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | AX250 | 30 | Field Programmable Gate Arrays | 1.51.5/3.32.5/3.3V | 248 | 6.8kB | 990 ps | 990 ps | 248 | 2816 | 250000 | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 4224 | 0.99 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CDLL4620 | Microsemi |
Min: 1 Mult: 1 |
download | Surface Mount | Surface Mount | -65°C~175°C | Bulk | 1 (Unlimited) | ZENER | Non-RoHS Compliant | 1999 | /files/microsemicorporation-cdll4614-datasheets-2374.pdf | DO-213AA | Contains Lead | 2 | 15 Weeks | 2 | IN PRODUCTION (Last Updated: 1 month ago) | no | 1.65kOhm | EAR99 | METALLURGICALLY BONDED | No | 8541.10.00.50 | ±5% | e0 | TIN LEAD | UNIDIRECTIONAL | 500mW | END | WRAP AROUND | 2 | Single | 500mW | 1 | 7.5μA | 3.3V | ISOLATED | 250μA | SILICON | 3.3V | 5% | ZENER DIODE | 5% | 1.65kOhm | 3.5μA @ 1.5V | 1.1V @ 200mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M1AFS1500-2FG256I | Microsemi |
Min: 1 Mult: 1 |
download | Fusion® | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2013 | /files/microsemicorporation-afs600fg256-datasheets-8675.pdf | 256-LBGA | 17mm | 1.2mm | 17mm | 1.5V | 256 | 12 Weeks | 400.011771mg | 256 | No | 1.47059GHz | TIN LEAD/TIN LEAD SILVER | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | M1AFS1500 | 30 | 119 | 33.8kB | 2 | 38400 | 1500000 | FIELD PROGRAMMABLE GATE ARRAY | 276480 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JANS1N4471US | Microsemi |
Min: 1 Mult: 1 |
download | Surface Mount | Surface Mount | -65°C~175°C | Bulk | 1 (Unlimited) | ZENER | Non-RoHS Compliant | 1999 | /files/microsemicorporation-jantx1n4479us-datasheets-4407.pdf | SQ-MELF, A | 2 | 40 Weeks | 2 | IN PRODUCTION (Last Updated: 1 month ago) | no | EAR99 | METALLURGICALLY BONDED | No | 8541.10.00.50 | ±5% | e0 | Tin/Lead (Sn/Pb) | UNIDIRECTIONAL | MIL-19500 | 1.5W | END | WRAP AROUND | Single | 1 | Qualified | 50nA | 18V | ISOLATED | SILICON | 18V | 5% | 14mA | ZENER DIODE | 5% | 11Ohm | 50nA @ 14.4V | 1.5V @ 1A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3PE3000-FG324I | Microsemi |
Min: 1 Mult: 1 |
download | ProASIC3E | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 231MHz | 25mA | Non-RoHS Compliant | 2015 | /files/microsemicorporation-a3pe1500pqg208-datasheets-3144.pdf | 324-BGA | 19mm | 1.25mm | 19mm | 1.5V | Lead Free | 324 | 12 Weeks | 400.011771mg | 324 | IN PRODUCTION (Last Updated: 2 weeks ago) | 3A001.A.7.A | No | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | BOTTOM | BALL | 1.5V | 1mm | A3PE3000 | Field Programmable Gate Arrays | 1.5/3.3V | 221 | 63kB | 221 | 75264 | 3000000 | FIELD PROGRAMMABLE GATE ARRAY | 516096 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 1PMT4121E3/TR13 | Microsemi |
Min: 1 Mult: 1 |
download | POWERMITE® | Surface Mount | Surface Mount | -55°C~150°C | Tape & Reel (TR) | 1 (Unlimited) | RoHS Compliant | 1999 | /files/microsemicorporation-1pmt4105e3tr13-datasheets-4133.pdf | DO-216AA | 21 Weeks | 2 | IN PRODUCTION (Last Updated: 3 weeks ago) | yes | 200Ohm | Tin | ±5% | e3 | 1W | NOT SPECIFIED | Single | NOT SPECIFIED | 33V | ZENER DIODE | 200Ohm | 10nA @ 25.08V | 1.1V @ 200mA | 33V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P250L-FG256I | Microsemi |
Min: 1 Mult: 1 |
download | ProASIC3L | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 3mA | Non-RoHS Compliant | 2009 | /files/microsemicorporation-a3p250lpqg208-datasheets-2725.pdf | 256-LBGA | 17mm | 1.2mm | 17mm | 1.2V | 256 | 400.011771mg | 256 | OBSOLETE (Last Updated: 1 month ago) | No | 781.25MHz | 8542.39.00.01 | TIN LEAD/TIN LEAD SILVER | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.2V | 1mm | A3P250L | 30 | Field Programmable Gate Arrays | 1.5/3.3V | 157 | 4.5kB | 157 | 6144 | 250000 | FIELD PROGRAMMABLE GATE ARRAY | 36864 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JAN1N982B-1 | Microsemi |
Min: 1 Mult: 1 |
download | Through Hole | Bulk | 175°C | -65°C | ZENER | Non-RoHS Compliant | 1999 | /files/microsemicorporation-jantx1n973b1-datasheets-4283.pdf | 2 | 14 Weeks | 2 | IN PRODUCTION (Last Updated: 3 weeks ago) | no | EAR99 | METALLURGICALLY BONDED | Lead, Tin | No | 8541.10.00.50 | e0 | Tin/Lead (Sn/Pb) | UNIDIRECTIONAL | MIL-19500/117 | 480mW | AXIAL | WIRE | 1 | Single | 500mW | 1 | Qualified | 75V | ISOLATED | 1.7mA | SILICON | DO-35 | 75V | 5% | ZENER DIODE | 5% | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGLN060V5-VQG100I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO nano | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 10μA | RoHS Compliant | 2013 | /files/microsemicorporation-agln010v5ucg36i-datasheets-4103.pdf | 100-TQFP | 14mm | 1mm | 14mm | 1.5V | Lead Free | 100 | 3 Weeks | 100 | IN PRODUCTION (Last Updated: 1 month ago) | 250MHz | 8542.39.00.01 | e3 | Tin (Sn) | 1.425V~1.575V | QUAD | GULL WING | NOT SPECIFIED | 1.5V | 0.5mm | AGLN060 | NOT SPECIFIED | Not Qualified | 2.3kB | 71 | 2.3kB | 60000 | 1536 | FIELD PROGRAMMABLE GATE ARRAY | 18432 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JANTX1N4627UR-1 | Microsemi |
Min: 1 Mult: 1 |
download | Military, MIL-PRF-19500/435 | Surface Mount | Surface Mount | -65°C~175°C | Bulk | 1 (Unlimited) | ZENER | Non-RoHS Compliant | /files/microsemicorporation-cdll4099-datasheets-2336.pdf | DO-213AA (Glass) | Contains Lead | 2 | 8 Weeks | 2 | IN PRODUCTION (Last Updated: 3 weeks ago) | no | EAR99 | HIGH RELIABILTY | No | 8541.10.00.50 | ±5% | UNIDIRECTIONAL | MIL-19500 | END | WRAP AROUND | 2 | Single | 500mW | 1 | Voltage Reference Diodes | Qualified | 5μA | 6.2V | ISOLATED | 250μA | SILICON | 6.2V | 5% | ZENER DIODE | 5% | 1.2kOhm | 3.1mV/°C | 5μA @ 5V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P600L-1FGG484 | Microsemi |
Min: 1 Mult: 1 |
download | ProASIC3L | Surface Mount | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | 70°C | 0°C | 5mA | RoHS Compliant | 2009 | /files/microsemicorporation-a3p600lfgg144-datasheets-3290.pdf | 484-BGA | 23mm | 1.73mm | 23mm | 1.2V | 400.011771mg | 1.26V | 1.14V | 484 | No | 892.86MHz | 1.14V~1.575V | A3P600L | 484-FPBGA (23x23) | 235 | 13.5kB | 1 | 13824 | 600000 | 110592 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JAN1N3032B-1 | Microsemi |
Min: 1 Mult: 1 |
download | Through Hole | Through Hole | -55°C~175°C | Bulk | 1 (Unlimited) | ZENER | Non-RoHS Compliant | 1999 | /files/microsemicorporation-jantx1n3042b1-datasheets-0497.pdf | DO-204AL, DO-41, Axial | 2 | 14 Weeks | 2 | IN PRODUCTION (Last Updated: 1 month ago) | no | EAR99 | METALLURGICALLY BONDED | No | 8541.10.00.50 | ±5% | e0 | Tin/Lead (Sn/Pb) | UNIDIRECTIONAL | MIL-19500/115K | 1W | WIRE | Single | 1W | 1 | Qualified | 10μA | 33V | ISOLATED | 7.5mA | SILICON | 33V | 5% | ZENER DIODE | 5% | 45Ohm | 10μA @ 25.1V | 1.2V @ 200mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3PE600-2PQ208I | Microsemi |
Min: 1 Mult: 1 |
download | ProASIC3E | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 310MHz | Non-RoHS Compliant | 2009 | /files/microsemicorporation-a3pe600pq208-datasheets-3348.pdf | 208-BFQFP | 28mm | 3.4mm | 28mm | 1.5V | 208 | 16 Weeks | 208 | OBSOLETE (Last Updated: 4 weeks ago) | No | e0 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | QUAD | GULL WING | 225 | 1.5V | 0.5mm | A3PE600 | 30 | Field Programmable Gate Arrays | 1.5/3.3V | 147 | 13.5kB | 2 | 147 | 13824 | 600000 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| JANTX1N963B-1 | Microsemi |
Min: 1 Mult: 1 |
download | Military, MIL-PRF-19500/117 | Through Hole | Through Hole | -55°C~175°C | Bulk | 1 (Unlimited) | ZENER | Non-RoHS Compliant | 1999 | /files/microsemicorporation-jantx1n973b1-datasheets-4283.pdf | DO-204AH, DO-35, Axial | Contains Lead | 2 | 14 Weeks | 2 | no | EAR99 | METALLURGICALLY BONDED | No | 8541.10.00.50 | ±5% | e0 | Tin/Lead (Sn/Pb) | UNIDIRECTIONAL | MIL-19500/117 | 480mW | WIRE | 2 | Single | 500mW | 1 | Qualified | 5μA | 12V | ISOLATED | 10.5mA | SILICON | 12V | 5% | ZENER DIODE | 5% | 11.5Ohm | 1μA @ 9.1V | 1.1V @ 200mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5962-1523101VYC | Microsemi |
Min: 1 Mult: 1 |
download | Surface Mount | -55°C~125°C TA | Tray | Non-Inverting | RoHS Compliant | /files/microsemicorporation-59621523101vyc-datasheets-1202.pdf | 20-CFlatpack | 8 Weeks | Parallel | P-Channel | 10V~50V | 8 | General Purpose | High Side | 2.8A | 1:1 |
