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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Voltage - Rated DC | Current Rating | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Lifecycle Status | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Max Frequency | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Power Dissipation | Number of Elements | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Memory Size | Number of I/O | Peripherals | Core Architecture | RAM Size | Turn On Delay Time | Speed Grade | Rise Time | Fall Time (Typ) | Turn-Off Delay Time | Continuous Drain Current (ID) | Gate to Source Voltage (Vgs) | Transistor Element Material | Configuration | Case Connection | Transistor Application | Drain to Source Voltage (Vdss) | Architecture | DS Breakdown Voltage-Min | Number of Outputs | Speed | Power Dissipation-Max | JEDEC-95 Code | Number of Registers | Number of Inputs | Number of Gates | Pulsed Drain Current-Max (IDM) | Drain-source On Resistance-Max | Avalanche Energy Rating (Eas) | Core Processor | Connectivity | Number of Logic Elements/Cells | FET Type | Input Capacitance (Ciss) (Max) @ Vds | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Flash Size | Rds On (Max) @ Id, Vgs | Vgs(th) (Max) @ Id | Current - Continuous Drain (Id) @ 25°C | Gate Charge (Qg) (Max) @ Vgs | Drive Voltage (Max Rds On,Min Rds On) | Vgs (Max) | Module/Board Type | Total RAM Bits |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| APT12M80B | Microsemi |
Min: 1 Mult: 1 |
download | POWER MOS 8™ | Through Hole | Through Hole | -55°C~150°C TJ | Tube | 1 (Unlimited) | MOSFET (Metal Oxide) | ENHANCEMENT MODE | RoHS Compliant | 1997 | /files/microsemicorporation-apt12m80b-datasheets-4015.pdf | 800V | 12A | TO-247-3 | Lead Free | 3 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | yes | AVALANCHE RATED, HIGH RELIABILITY | No | e1 | TIN SILVER COPPER | SINGLE | 3 | 335W | 1 | R-PSFM-T3 | 14 ns | 20ns | 18 ns | 60 ns | 13A | 30V | SILICON | SINGLE WITH BUILT-IN DIODE | DRAIN | SWITCHING | 335W Tc | TO-247AD | 45A | 0.8Ohm | 525 mJ | N-Channel | 2470pF @ 25V | 800m Ω @ 6A, 10V | 5V @ 1mA | 13A Tc | 80nC @ 10V | 10V | ±30V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050-VFG400I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.51mm | RoHS Compliant | 2014 | /files/microsemicorporation-m2s050tfgg484-datasheets-1246.pdf | 400-LFBGA | 17mm | 17mm | 400 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B400 | 207 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 207 | 166MHz | 207 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 2N6760 | Microsemi |
Min: 1 Mult: 1 |
download | Through Hole | Through Hole | -55°C~150°C TJ | Bulk | 1 (Unlimited) | MOSFET (Metal Oxide) | ENHANCEMENT MODE | Non-RoHS Compliant | 1997 | /files/microsemicorporation-jan2n6758-datasheets-1724.pdf | TO-204AA, TO-3 | 2 | 3 | HIGH RELIABILITY | 8541.29.00.95 | BOTTOM | PIN/PEG | 2 | 1 | FET General Purpose Power | O-MBFM-P2 | 40ns | 5.5A | 20V | SILICON | SINGLE WITH BUILT-IN DIODE | DRAIN | SWITCHING | 400V | 400V | 4W Ta 75W Tc | 22A | N-Channel | 1.22 Ω @ 5.5A, 10V | 4V @ 250μA | 5.5A Tc | 39nC @ 10V | 10V | ±20V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S010T-1FG484M | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -55°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | Non-RoHS Compliant | 2016 | /files/microsemicorporation-m2s150ts1fc1152m-datasheets-6169.pdf | 484-BGA | 23mm | 23mm | 484 | 10 Weeks | IN PRODUCTION (Last Updated: 3 days ago) | 3A001.A.2.C | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 233 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 233 | 166MHz | 233 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SK-RT4K-CQ352-KITBTM | Microsemi |
Min: 1 Mult: 1 |
download | Socket | 1 (Unlimited) | Non-RoHS Compliant | 2003 | 20 Weeks | Socket Adapter | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050TS-VF400I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.51mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 400-LFBGA | 17mm | 17mm | 400 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B400 | 207 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 207 | 166MHz | 207 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM175PG-ACTEL-1 | Microsemi |
Min: 1 Mult: 1 |
download | Socket | 1 (Unlimited) | RoHS Compliant | 14 Weeks | Socket Adapter | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050T-1VF400I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 166MHz | Non-RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 400-LFBGA | 8 Weeks | 400 | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | M2S050T | 400-VFBGA (17x17) | 207 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 50K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM180CS-ACTEL-1 | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050TS-1FCS325I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.01mm | Non-RoHS Compliant | /files/microsemicorporation-m2s025vfg256i-datasheets-0686.pdf | 325-TFBGA, CSPBGA | 11mm | 11mm | 325 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | LG-MIN, WD-MIN | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B325 | 200 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 200 | 166MHz | 200 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM3F-68QN-ACTEL-1 | Microsemi |
Min: 1 Mult: 1 |
download | Hardware | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S060TS-1FG676 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 676-BGA | 27mm | 27mm | 676 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B676 | 387 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 387 | 166MHz | 387 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM208CQ-ACTEL-2 | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | 2005 | Module | 14 Weeks | Socket Adapter | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S060TS-1FG676I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | Non-RoHS Compliant | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 676-BGA | 27mm | 27mm | 676 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B676 | 387 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 387 | 166MHz | 387 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM3F-132QN-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090T-1FG484 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 166MHz | 2.44mm | Non-RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 484-BGA | 23mm | 23mm | 484 | 10 Weeks | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | M2S090T | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 267 | 267 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM3F-484FG-ACTEL-1 | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | Module | 14 Weeks | Socket Adapter | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S090T-1FCSG325I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.16mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 325-TFBGA, CSPBGA | 13.5mm | 11mm | 325 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | LG-MIN, WD-MIN | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | R-PBGA-B325 | 180 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 180 | 166MHz | 180 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM175PG-ACTEL | Microsemi |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | 2011 | Module | No | Socket Adapter | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S060-FG676I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 676-BGA | 27mm | 27mm | 676 | 6 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B676 | 387 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 387 | 166MHz | 387 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P600-FGG256I | Microsemi |
Min: 1 Mult: 1 |
download | ProASIC3 | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 231MHz | 45mA | RoHS Compliant | /files/microsemicorporation-a3p600pqg208i-datasheets-5753.pdf | 256-LBGA | 17mm | 1.2mm | 17mm | 1.5V | Lead Free | 256 | 12 Weeks | 256 | 3A001.A.7.A | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | A3P600 | 40 | 13.5kB | 177 | 13.5kB | 13824 | 600000 | 6500 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150-1FCVG484 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 3.15mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0686.pdf | 484-BFBGA | 19mm | 19mm | 484 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | LG-MIN, WD-MIN | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 273 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 273 | 166MHz | 273 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3PN125-2VQG100I | Microsemi |
Min: 1 Mult: 1 |
download | ProASIC3 nano | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2mA | RoHS Compliant | 2009 | /files/microsemicorporation-a3pn250vqg100-datasheets-5523.pdf | 100-TQFP | 14mm | 1mm | 14mm | 1.5V | 100 | 10 Weeks | 100 | IN PRODUCTION (Last Updated: 1 month ago) | No | 350MHz | 1.425V~1.575V | QUAD | GULL WING | 260 | 1.5V | 0.5mm | A3PN125 | 40 | 71 | 4.5kB | 2 | 3072 | 125000 | FIELD PROGRAMMABLE GATE ARRAY | 36864 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050T-1FGG896I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 166MHz | RoHS Compliant | 2009 | /files/microsemicorporation-m2s005vfg256i-datasheets-1224.pdf | 896-BGA | 1.2V | 8 Weeks | 896 | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | M2S050T | 896-FBGA (31x31) | 377 | DDR, PCIe, SERDES | ARM | 64KB | 1 | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 50K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGL250V2-VQ100I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | Non-RoHS Compliant | 2013 | /files/microsemicorporation-agl600v5fgg256i-datasheets-6582.pdf | 100-TQFP | 14mm | 1mm | 14mm | 1.5V | 100 | 22 Weeks | 100 | IN PRODUCTION (Last Updated: 1 month ago) | 892.86MHz | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | 1.14V~1.575V | QUAD | GULL WING | 230 | 1.2V | 0.5mm | AGL250 | 30 | Not Qualified | 68 | 4.5kB | 250000 | 6144 | FIELD PROGRAMMABLE GATE ARRAY | 36864 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150-FC1152I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.9mm | Non-RoHS Compliant | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 1152-BBGA, FCBGA | 35mm | 35mm | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B1152 | 574 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 574 | 166MHz | 574 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3PN250-VQG100I | Microsemi |
Min: 1 Mult: 1 |
download | ProASIC3 nano | Surface Mount | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 30mA | RoHS Compliant | 2013 | /files/microsemicorporation-a3pn250vqg100-datasheets-5523.pdf | 100-TQFP | 14mm | 1mm | 14mm | 1.5V | Lead Free | 100 | 8 Weeks | 100 | IN PRODUCTION (Last Updated: 1 month ago) | 3A001.A.7.B | Tin | No | 350MHz | 8542.39.00.01 | 1.425V~1.575V | QUAD | GULL WING | 260 | 1.5V | 0.5mm | A3PN250 | 40 | 4.5kB | 68 | 4.5kB | 6144 | 250000 | 3000 | FIELD PROGRAMMABLE GATE ARRAY | 36864 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150-1FCG1152I | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 166MHz | RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 1152-BBGA, FCBGA | 12 Weeks | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | M2S150 | 1152-FCBGA (35x35) | 574 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 150K Logic Modules | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL010TS-FGG484I | Microsemi |
Min: 1 Mult: 1 |
download | IGLOO2 | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BGA | 23mm | 23mm | 1.2V | 484 | 12 Weeks | 484 | IN PRODUCTION (Last Updated: 1 month ago) | 8542.39.00.01 | YES | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | Field Programmable Gate Arrays | Not Qualified | 233 | 114kB | 233 | 12084 | FIELD PROGRAMMABLE GATE ARRAY | 933888 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150-1FC1152 | Microsemi |
Min: 1 Mult: 1 |
download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 166MHz | 2.9mm | Non-RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 1152-BBGA, FCBGA | 35mm | 35mm | 12 Weeks | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | M2S150 | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B1152 | 574 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 574 | 574 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB |
