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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Density | Pbfree Code | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Max Frequency | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Surface Mount | Voltage - Supply | Terminal Position | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Memory Size | Memory Type | Data Bus Width | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Memory Format | Memory Interface | Organization | Memory Width | Write Cycle Time - Word, Page | Memory Density | Alternate Memory Width | Standby Current-Max | Word Size | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Access Time (Max) | Sync/Async | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Ready/Busy | Common Flash Interface | Page Size | I/O Type | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length | Access Mode |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| W25Q512JVEIQ TR | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q512jvbim-datasheets-5648.pdf | 8-WDFN Exposed Pad | 10 Weeks | 2.7V~3.6V | 512Mb 64M x 8 | Non-Volatile | 133MHz | FLASH | SPI - Quad I/O | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W632GG6NB11I | Winbond Electronics |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~95°C TC | Tray | 3 (168 Hours) | SDRAM - DDR3 | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w632gg6nb12-datasheets-8478.pdf | 96-VFBGA | 10 Weeks | 1.425V~1.575V | 2Gb 128M x 16 | Volatile | 20ns | 933MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25X16VZPIG T&R | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25x16vsfigtr-datasheets-1665.pdf | 8-WDFN Exposed Pad | 2.7V~3.6V | 8-WSON (6x5) | 16Mb 2M x 8 | Non-Volatile | 75MHz | FLASH | SPI | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25X40AVDAIZ | Winbond Electronics | $0.66 |
Min: 1 Mult: 1 |
download | SpiFlash® | Through Hole | Through Hole | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | 5.33mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25x80avzpig-datasheets-1100.pdf | 8-DIP (0.300, 7.62mm) | 9.27mm | 3.3V | 8 | 8 | SPI, Serial | 4 Mb | EAR99 | unknown | 1 | 18mA | 2.7V~3.6V | DUAL | NOT SPECIFIED | 3V | 2.54mm | 8 | 3.6V | 2.7V | NOT SPECIFIED | Not Qualified | 4Mb 512K x 8 | Non-Volatile | 7 ns | 2.7V | 100MHz | 24b | FLASH | SPI | 8 | 3ms | 0.00001A | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | ||||||||||||||||||||||||||||||||||||||||
| W948D6FBHX5E | Winbond Electronics | $3.04 |
Min: 1 Mult: 1 |
download | Surface Mount | Surface Mount | -25°C~85°C TC | Tray | 3 (168 Hours) | SDRAM - Mobile LPDDR | 1.025mm | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w948d2fbjx5e-datasheets-6682.pdf | 60-TFBGA | 9mm | 1.8V | Lead Free | 60 | 60 | 256 Mb | 1 | EAR99 | AUTO/SELF REFRESH | No | 8542.32.00.02 | 1 | 55mA | 1.7V~1.95V | BOTTOM | 1.8V | 0.8mm | 60 | 1.95V | 1.7V | 256Mb 16M x 16 | Volatile | 16b | 3-STATE | 5ns | 200MHz | 15b | DRAM | Parallel | 8MX16 | 16 | 15ns | 0.00001A | COMMON | 8192 | 24816 | 24816 | ||||||||||||||||||||||||||||||||||||||||
| W25Q32DWZPIG | Winbond Electronics | $0.34 |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 0.8mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q32dwsfig-datasheets-5426.pdf | 8-WDFN Exposed Pad | 6mm | 5mm | 8 | SPI, Serial | EAR99 | TOP/BOTTOM BOOT BLOCK | 8542.32.00.51 | 1 | YES | 1.7V~1.95V | DUAL | 1.8V | 1.27mm | 8 | 1.95V | 1.7V | 1.8V | 0.04mA | Not Qualified | R-PDSO-N8 | 32Mb 4M x 8 | Non-Volatile | 1.8V | 104MHz | FLASH | SPI | 256KX16 | 16 | 3ms | 4194304 bit | 0.00002A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 7.5 ns | ||||||||||||||||||||||||||||||||||||||||
| W25Q40BWZPIG | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 0.8mm | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q40bwsnig-datasheets-5420.pdf | 8-WDFN Exposed Pad | 6mm | 5mm | 8 | SPI, Serial | EAR99 | 8542.32.00.51 | 1 | YES | 1.65V~1.95V | DUAL | 1.8V | 1.27mm | 8 | 1.95V | 1.65V | 1.8V | 0.025mA | Not Qualified | R-PDSO-N8 | 4Mb 512K x 8 | Non-Volatile | 1.8V | 80MHz | FLASH | SPI | 4MX1 | 1 | 800μs | 4194304 bit | 0.00001A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||
| W29GL128CL9B | Winbond Electronics |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ASYNCHRONOUS | 1.4mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w29gl128ch9t-datasheets-5439.pdf | 64-LBGA | 13mm | 11mm | 64 | 14 Weeks | 64 | 3A991.B.1.A | IT ALSO OPERATES AT 3 V TO 3.6 V | 8542.32.00.51 | 1 | YES | 2.7V~3.6V | BOTTOM | 3V | 1mm | 64 | 3.6V | 2.7V | 1.8/3.33/3.3V | 0.055mA | Not Qualified | 128Mb 16M x 8 8M x 16 | Non-Volatile | 3V | FLASH | Parallel | 128MX1 | 1 | 90ns | 134217728 bit | 8 | 0.000005A | 100 ns | YES | YES | YES | 128 | 128K | YES | YES | 8/16words | ||||||||||||||||||||||||||||||||||||||
| W25Q128FVFIQ | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 2.64mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q128fvsig-datasheets-5561.pdf | 16-SOIC (0.295, 7.50mm Width) | 10.31mm | 7.49mm | 16 | SPI, Serial | 3A991.B.1.A | 8542.32.00.51 | 1 | YES | 2.7V~3.6V | DUAL | 3V | 1.27mm | 16 | 3.6V | 2.7V | 3/3.3V | 0.02mA | Not Qualified | R-PDSO-G16 | 128Mb 16M x 8 | Non-Volatile | 3V | 104MHz | FLASH | SPI - Quad I/O, QPI | 128MX1 | 1 | 50μs, 3ms | 134217728 bit | 0.00002A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||
| W25Q256FVEIF | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 0.8mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q256fvcif-datasheets-3435.pdf | 8-WDFN Exposed Pad | 8mm | 6mm | 8 | SPI, Serial | 1 | YES | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | 3/3.3V | 0.025mA | Not Qualified | R-PDSO-N8 | 256Mb 32M x 8 | Non-Volatile | 3V | 104MHz | FLASH | SPI - Quad I/O, QPI | 256MX1 | 1 | 50μs, 3ms | 268435456 bit | 0.000025A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||
| W29N01GWDIBA | Winbond Electronics | $1.93 |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NAND (SLC) | ASYNCHRONOUS | 1mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w29n01gwdiba-datasheets-3590.pdf | 48-VFBGA | 8mm | 6.5mm | 48 | 48 | 1 | YES | 1.7V~1.95V | BOTTOM | 1.8V | 0.8mm | 1.95V | 1.7V | 1Gb 64M x 16 | Non-Volatile | 1.8V | FLASH | Parallel | 1GX1 | 1 | 35ns | 1073741824 bit | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W632GG6KB12I | Winbond Electronics |
Min: 1 Mult: 1 |
download | Surface Mount | Surface Mount | -40°C~95°C TC | Tray | 3 (168 Hours) | SDRAM - DDR3 | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w632gg6kb12i-datasheets-3642.pdf | 96-TFBGA | 13mm | 1.5V | 96 | 96 | 2 Gb | 1 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.36 | 1 | 250mA | e1 | 1.425V~1.575V | BOTTOM | NOT SPECIFIED | 1.5V | 0.8mm | 96 | 1.575V | 1.425V | NOT SPECIFIED | Not Qualified | 2Gb 128M x 16 | Volatile | 3-STATE | 20ns | 800MHz | 17b | DRAM | Parallel | 128MX16 | 16 | 0.07A | COMMON | 8192 | 8 | 8 | ||||||||||||||||||||||||||||||||||||||||
| W97BH6KBQX2E | Winbond Electronics |
Min: 1 Mult: 1 |
download | Surface Mount | -25°C~85°C TC | Tray | 3 (168 Hours) | SDRAM - Mobile LPDDR2 | SYNCHRONOUS | 0.8mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w97bh2kbvx2e-datasheets-3586.pdf | 168-WFBGA | 12mm | 12mm | 168 | 168 | yes | 1 | EAR99 | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | 1 | YES | 1.14V~1.95V | BOTTOM | 1.2V | 0.5mm | 1.3V | 1.14V | 2Gb 128M x 16 | Volatile | 400MHz | DRAM | Parallel | 128MX16 | 16 | 15ns | 2147483648 bit | MULTI BANK PAGE BURST | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| W98AD6KBGX6I | Winbond Electronics |
Min: 1 Mult: 1 |
download | Tray | 3 (168 Hours) | ROHS3 Compliant | 2016 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16DWSNIG TR | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q16dwssig-datasheets-5478.pdf | 8-SOIC (0.154, 3.90mm Width) | 1.65V~1.95V | 16Mb 2M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O, QPI | 40μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W29GL256PL9B TR | Winbond Electronics |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w29gl256ph9t-datasheets-3540.pdf | 64-LBGA | 14 Weeks | 2.7V~3.6V | 256Mb 32M x 8 16M x 16 | Non-Volatile | FLASH | Parallel | 90ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W632GG8KB-15 TR | Winbond Electronics |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~95°C TC | Tape & Reel (TR) | 3 (168 Hours) | SDRAM - DDR3 | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w632gg8kb12i-datasheets-3731.pdf | 78-TFBGA | 1.425V~1.575V | 2Gb 256M x 8 | Volatile | 20ns | 667MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q256FVEIF TR | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q256fvcif-datasheets-3435.pdf | 8-WDFN Exposed Pad | 14 Weeks | 2.7V~3.6V | 256Mb 32M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16DVZPIQ TR | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q16dvzpiq-datasheets-3576.pdf | 8-WDFN Exposed Pad | 2.7V~3.6V | 16Mb 2M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q32FVTCIP TR | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q32fvsfig-datasheets-5409.pdf | 24-TBGA | 2.7V~3.6V | 32Mb 4M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16DVDAIG TR | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Through Hole | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q16dvzpiq-datasheets-3576.pdf | 8-DIP (0.300, 7.62mm) | 2.7V~3.6V | 16Mb 2M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25X20BVSNIG | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | 1.72mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25x20bvsnig-datasheets-6541.pdf | 8-SOIC (0.154, 3.90mm Width) | 3.3V | 8 | 8 | SPI, Serial | 2 Mb | EAR99 | No | 1 | 16.5mA | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | 2Mb 256K x 8 | Non-Volatile | 7 ns | 2.7V | 104MHz | 24b | FLASH | SPI | 2MX1 | 1 | 3ms | 0.000005A | 1b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | 256B | ||||||||||||||||||||||||||||||||||||||||||
| W25Q16BVZPIG | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q16bvsfig-datasheets-6563.pdf | 8-WDFN Exposed Pad | 6mm | 3.3V | Lead Free | 8 | 8 | SPI, Serial | 16 Mb | EAR99 | No | 1 | 18mA | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | 16Mb 2M x 8 | Non-Volatile | 6 ns | 2.7V | 104MHz | 1b | FLASH | SPI - Quad I/O | 8 | 50μs, 3ms | 0.000005A | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | |||||||||||||||||||||||||||||||||||||||||||
| W29GL128CL9T TR | Winbond Electronics |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w29gl128ch9t-datasheets-5439.pdf | 56-TFSOP (0.724, 18.40mm Width) | 14 Weeks | 2.7V~3.6V | 128Mb 16M x 8 8M x 16 | Non-Volatile | FLASH | Parallel | 90ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W971GG8KB-25 | Winbond Electronics |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~85°C TC | Tray | 3 (168 Hours) | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w971gg8kb25tr-datasheets-3935.pdf | 60-TFBGA | 12.5mm | 8mm | 60 | 1 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.32 | 1 | YES | 1.7V~1.9V | BOTTOM | NOT SPECIFIED | 1.8V | 0.8mm | 60 | 1.9V | 1.7V | NOT SPECIFIED | 1.8V | 0.185mA | Not Qualified | R-PBGA-B60 | 1Gb 128M x 8 | Volatile | 3-STATE | 400ps | 200MHz | DRAM | Parallel | 128MX8 | 8 | 15ns | 1073741824 bit | COMMON | 8192 | 48 | 48 | |||||||||||||||||||||||||||||||||||||||||
| W25X40CLDAIG TR | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Through Hole | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25x40clsnig-datasheets-9270.pdf | 8-DIP (0.300, 7.62mm) | 2.3V~3.6V | 4Mb 512K x 8 | Non-Volatile | 104MHz | FLASH | SPI | 800μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W972GG6JB-25 | Winbond Electronics |
Min: 1 Mult: 1 |
download | Surface Mount | Surface Mount | 0°C~85°C TC | Tray | 3 (168 Hours) | SDRAM - DDR2 | 1.2mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w972gg6jb3i-datasheets-5367.pdf | 84-TFBGA | 13mm | 1.8V | Lead Free | 84 | 84 | 2 Gb | 1 | AUTO/SELF REFRESH | No | 800MHz | 1 | 170mA | 1.7V~1.9V | BOTTOM | 1.8V | 0.8mm | 1.9V | 1.7V | 2Gb 128M x 16 | Volatile | 16b | 3-STATE | 400ps | 200MHz | 17b | DRAM | Parallel | 128MX16 | 16 | 15ns | 0.012A | COMMON | 8192 | 48 | 48 | |||||||||||||||||||||||||||||||||||||||||||
| W25Q256FVEIG TR | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q256fvcif-datasheets-3435.pdf | 8-WDFN Exposed Pad | 14 Weeks | 2.7V~3.6V | 256Mb 32M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16CVZPIG TR | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q16cvssig-datasheets-5341.pdf | 8-WDFN Exposed Pad | 2.7V~3.6V | 16Mb 2M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q257FVFIQ TR | Winbond Electronics |
Min: 1 Mult: 1 |
download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q257fvfiftr-datasheets-9921.pdf | 16-SOIC (0.295, 7.50mm Width) | 14 Weeks | 2.7V~3.6V | 16-SOIC | 256Mb 32M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms |
