Xilinx(9426)

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Part Status Series Mount Operating Temperature Packaging Moisture Sensitivity Level (MSL) Max Operating Temperature Min Operating Temperature Technology Frequency Height Seated (Max) RoHS Status Published Datasheet Package / Case Length Width Operating Supply Voltage Lead Free Number of Terminations Factory Lead Time Number of Pins Interface Pbfree Code ECCN Code Additional Feature Contact Plating Radiation Hardening Reach Compliance Code HTS Code JESD-609 Code Terminal Finish Surface Mount Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Terminal Pitch Base Part Number Pin Count Temperature Grade Operating Temperature (Max) Operating Temperature (Min) Supply Voltage-Max (Vsup) Supply Voltage-Min (Vsup) Time@Peak Reflow Temperature-Max (s) Subcategory Power Supplies Qualification Status JESD-30 Code Screening Level Number of I/O Memory Type Peripherals Core Architecture RAM Size Data Bus Width Turn On Delay Time Speed Grade Propagation Delay Architecture Frequency (Max) Number of Outputs Speed uPs/uCs/Peripheral ICs Type Number of Registers Number of Inputs RAM (words) Bus Compatibility Boundary Scan Clock Frequency Organization Number of Macro Cells Output Function Core Processor Connectivity Number of Logic Elements/Cells Number of Logic Blocks (LABs) Programmable Logic Type Primary Attributes Number of Logic Cells Number of Equivalent Gates Number of CLBs JTAG BST Combinatorial Delay of a CLB-Max In-System Programmable
EFR-DI-25GEMAC-PROJ EFR-DI-25GEMAC-PROJ Xilinx
RFQ

Min: 1

Mult: 1

Non-RoHS Compliant
XC7Z030-1FBG676I XC7Z030-1FBG676I Xilinx
RFQ

Min: 1

Mult: 1

download Zynq®-7000 -40°C~100°C TJ Tray 4 (72 Hours) CMOS 667MHz 2.54mm ROHS3 Compliant 2009 /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf 676-BBGA, FCBGA 27mm 1V 676 10 Weeks 676 CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 3A991.D Copper, Silver, Tin No 8542.39.00.01 e1 Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) YES BOTTOM BALL 245 1V 1mm XC7Z030 1.05V 30 130 DMA ARM 256KB 32b -1 MCU, FPGA 256000 CAN; ETHERNET; I2C; SPI; UART; USB YES Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Kintex™-7 FPGA, 125K Logic Cells
XC6SLX45-L1FGG676C XC6SLX45-L1FGG676C Xilinx
RFQ

Min: 1

Mult: 1

Surface Mount 3 (168 Hours) 85°C 0°C CMOS 2.44mm RoHS Compliant BGA 27mm 27mm 1V 676 676 yes 3A991.D 8542.39.00.01 e1 Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BOTTOM BALL 250 1V 1mm 676 OTHER 1.05V 30 Field Programmable Gate Arrays 12.5/3.3V Not Qualified 358 261kB 358 54576 43661 3411 FIELD PROGRAMMABLE GATE ARRAY 0.46 ns
XCZU9EG-2FFVB1156E XCZU9EG-2FFVB1156E Xilinx
RFQ

Min: 1

Mult: 1

download Zynq® UltraScale+™ MPSoC EG 0°C~100°C TJ Tray 4 (72 Hours) ROHS3 Compliant 2013 /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf 1156-BBGA, FCBGA 11 Weeks yes 8542.31.00.01 NOT SPECIFIED NOT SPECIFIED 328 DMA, WDT 256KB MCU, FPGA 533MHz, 600MHz, 1.3GHz Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
XCR3384XL-7TQ144C XCR3384XL-7TQ144C Xilinx
RFQ

Min: 1

Mult: 1

3 70°C 0°C CMOS 1.6mm Non-RoHS Compliant TQFP 20mm 20mm 3.3V 144 144 no EAR99 YES 8542.39.00.01 e0 Tin/Lead (Sn85Pb15) YES QUAD GULL WING 225 3.3V 0.5mm 144 COMMERCIAL 3.6V 30 Programmable Logic Devices Not Qualified 118 EEPROM 7 7.5 ns 135MHz 0 DEDICATED INPUTS, 118 I/O 384 MACROCELL 24 EE PLD YES YES
XC7Z010-3CLG400E XC7Z010-3CLG400E Xilinx
RFQ

Min: 1

Mult: 1

download Zynq®-7000 0°C~100°C TJ Tray 3 (168 Hours) CMOS 866MHz 1.6mm ROHS3 Compliant 2010 /files/xilinxinc-xc7z007s1clg400c-datasheets-0651.pdf 400-LFBGA, CSPBGA 17mm 1V 400 10 Weeks 400 CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB EAR99 Copper, Silver, Tin No 8542.39.00.01 e1 Tin/Silver/Copper (Sn/Ag/Cu) YES BOTTOM BALL 260 1V 0.8mm XC7Z010 1.05V 30 130 DMA ARM 256KB 32b -3 MCU, FPGA 256000 CAN; ETHERNET; I2C; SPI; UART; USB YES Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Artix™-7 FPGA, 28K Logic Cells
XQV600-4CB228M XQV600-4CB228M Xilinx
RFQ

Min: 1

Mult: 1

CMOS 3.302mm Non-RoHS Compliant 39.37mm 39.37mm 228 228 no 3A001.A.2.C 8542.39.00.01 e0 TIN LEAD YES QUAD FLAT NOT SPECIFIED 2.5V 0.635mm 228 MILITARY 125°C -55°C 2.625V 2.375V NOT SPECIFIED Field Programmable Gate Arrays 1.2/3.62.5V Not Qualified MIL-PRF-38535 162 3456 CLBS, 661111 GATES FIELD PROGRAMMABLE GATE ARRAY 15552 661111 3456 0.8 ns
XC7Z012S-2CLG485E XC7Z012S-2CLG485E Xilinx
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Min: 1

Mult: 1

download Zynq®-7000 0°C~100°C TJ Tray 3 (168 Hours) CMOS 1.6mm ROHS3 Compliant 2016 /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf 484-LFBGA, CSPBGA 19mm 19mm 485 10 Weeks yes 8542.31.00.01 e3 Matte Tin (Sn) YES BOTTOM BALL NOT SPECIFIED 1V 0.8mm 1.05V 0.95V NOT SPECIFIED S-PBGA-B485 150 DMA 256KB MCU, FPGA 766MHz 256000 CAN; ETHERNET; I2C; SPI; UART; USB YES 800MHz Single ARM® Cortex®-A9 MPCore™ with CoreSight™ CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Artix™-7 FPGA, 55K Logic Cells
XC2S100E-7TQ144C XC2S100E-7TQ144C Xilinx
RFQ

Min: 1

Mult: 1

3 (168 Hours) 85°C 0°C CMOS 1.6mm RoHS Compliant TQFP 20mm 20mm 1.8V 144 144 no EAR99 MAXIMUM USABLE GATES = 100000 No 8542.39.00.01 e0 Tin/Lead (Sn85Pb15) YES QUAD GULL WING 225 1.8V 0.5mm 144 COMMERCIAL EXTENDED 1.89V 30 Field Programmable Gate Arrays 5kB 7 202 400MHz FIELD PROGRAMMABLE GATE ARRAY 600 0.42 ns
XCZU2CG-L1SFVA625I XCZU2CG-L1SFVA625I Xilinx
RFQ

Min: 1

Mult: 1

download Zynq® UltraScale+™ MPSoC CG -40°C~100°C TJ Tray 4 (72 Hours) CMOS ROHS3 Compliant /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf 625-BFBGA, FCBGA 625 11 Weeks ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY 8542.31.00.01 YES BOTTOM BALL NOT SPECIFIED 0.72V 0.742V 0.698V NOT SPECIFIED R-PBGA-B625 180 DMA, WDT 256KB MCU, FPGA 500MHz, 1.2GHz MICROPROCESSOR CIRCUIT Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
XQV100-4PQ240N XQV100-4PQ240N Xilinx
RFQ

Min: 1

Mult: 1

Bulk 3 (168 Hours) CMOS 4.1mm RoHS Compliant 32mm 32mm Contains Lead 240 240 no 3A001.A.2.C 8542.39.00.01 e0 Tin/Lead (Sn85Pb15) YES QUAD GULL WING 225 2.5V 0.5mm 240 MILITARY 125°C -55°C 2.625V 2.375V 30 Field Programmable Gate Arrays 1.5/3.32.5V Not Qualified MIL-PRF-38535 166 5kB 166 2700 600 FIELD PROGRAMMABLE GATE ARRAY 108904 600 0.8 ns
XCZU2CG-L2SBVA484E XCZU2CG-L2SBVA484E Xilinx
RFQ

Min: 1

Mult: 1

download Zynq® UltraScale+™ MPSoC CG 0°C~100°C TJ Tray 4 (72 Hours) CMOS ROHS3 Compliant 2016 /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf 484-BFBGA, FCBGA 484 11 Weeks ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY 8542.31.00.01 YES BOTTOM BALL NOT SPECIFIED 0.72V 0.742V 0.698V NOT SPECIFIED R-PBGA-B484 82 DMA, WDT 256KB MCU, FPGA 533MHz, 1.3GHz MICROPROCESSOR CIRCUIT Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
XC6SLX9-L1FT256C XC6SLX9-L1FT256C Xilinx
RFQ

Min: 1

Mult: 1

Surface Mount 3 (168 Hours) 85°C 0°C CMOS 1.55mm RoHS Compliant BGA 17mm 17mm 1V 256 256 no EAR99 8542.39.00.01 e0 Tin/Lead (Sn63Pb37) BOTTOM BALL 240 1V 1mm 256 OTHER 1.05V 30 Field Programmable Gate Arrays 12.5/3.3V Not Qualified 186 72kB 186 11440 9152 715 FIELD PROGRAMMABLE GATE ARRAY 715 0.46 ns
XCZU2CG-2SFVA625I XCZU2CG-2SFVA625I Xilinx
RFQ

Min: 1

Mult: 1

download Zynq® UltraScale+™ MPSoC CG -40°C~100°C TJ Tray 4 (72 Hours) CMOS ROHS3 Compliant 2016 /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf 625-BFBGA, FCBGA 625 11 Weeks 8542.31.00.01 e1 Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) YES BOTTOM BALL NOT SPECIFIED 0.85V 0.876V 0.825V NOT SPECIFIED R-PBGA-B625 180 DMA, WDT 256KB MCU, FPGA 533MHz, 1.3GHz MICROPROCESSOR CIRCUIT Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
XC2S150E-6FGG456I XC2S150E-6FGG456I Xilinx
RFQ

Min: 1

Mult: 1

3 (168 Hours) 100°C -40°C CMOS RoHS Compliant FBGA 23mm 23mm 1.8V 456 yes 3A991.D MAXIMUM USABLE GATES = 150000 No 8542.39.00.01 e1 Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) YES BOTTOM BALL 250 1.8V 1mm 456 1.89V 30 Field Programmable Gate Arrays 6kB 6 265 265 357MHz FIELD PROGRAMMABLE GATE ARRAY 3888 52000 864 0.47 ns
XCZU3EG-2SFVA625E XCZU3EG-2SFVA625E Xilinx
RFQ

Min: 1

Mult: 1

download Zynq® UltraScale+™ MPSoC EG 0°C~100°C TJ Tray 4 (72 Hours) ROHS3 Compliant 2016 /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf 625-BFBGA, FCBGA 11 Weeks yes 8542.31.00.01 NOT SPECIFIED NOT SPECIFIED 180 DMA, WDT 256KB MCU, FPGA 533MHz, 600MHz, 1.3GHz Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
XC9572XL-10VQG44Q0962 XC9572XL-10VQG44Q0962 Xilinx
RFQ

Min: 1

Mult: 1

125°C -40°C RoHS Compliant 3.3V 44 No FLASH 10 ns 10 10 ns 100MHz 4 4
XAZU4EV-1SFVC784I XAZU4EV-1SFVC784I Xilinx
RFQ

Min: 1

Mult: 1

download 3 (168 Hours) CMOS 3.32mm ROHS3 Compliant /files/xilinxinc-xazu5ev1sfvc784q-datasheets-4796.pdf 23mm 23mm 784 11 Weeks 8542.31.00.01 YES BOTTOM BALL NOT SPECIFIED 0.85V 0.8mm INDUSTRIAL 100°C -40°C NOT SPECIFIED S-PBGA-B784 MICROPROCESSOR CIRCUIT
XC6VHX255T-3FFG1155C XC6VHX255T-3FFG1155C Xilinx
RFQ

Min: 1

Mult: 1

Surface Mount 4 (72 Hours) 85°C 0°C CMOS RoHS Compliant FCBGA 1V 1155 e1 BOTTOM BALL 245 1mm 30 Field Programmable Gate Arrays 11.2/2.5V Not Qualified 440 2.3MB 3 440 1412MHz 253440 19800 FIELD PROGRAMMABLE GATE ARRAY
XCZU3CG-L2SFVC784E XCZU3CG-L2SFVC784E Xilinx
RFQ

Min: 1

Mult: 1

download Zynq® UltraScale+™ MPSoC CG 0°C~100°C TJ Tray 4 (72 Hours) CMOS ROHS3 Compliant 2016 /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf 784-BFBGA, FCBGA 784 11 Weeks IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM) 8542.31.00.01 YES BOTTOM BALL NOT SPECIFIED 0.72V NOT SPECIFIED S-PBGA-B784 252 DMA, WDT 256KB MCU, FPGA 533MHz, 1.3GHz MICROPROCESSOR CIRCUIT Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
XCV150-6BG256I XCV150-6BG256I Xilinx
RFQ

Min: 1

Mult: 1

3 (168 Hours) CMOS 2.55mm Non-RoHS Compliant BGA 27mm 27mm 256 no not_compliant 8542.39.00.01 e0 Tin/Lead (Sn63Pb37) YES BOTTOM BALL 225 2.5V 1.27mm 256 2.625V 2.375V 30 Field Programmable Gate Arrays 1.2/3.62.5V Not Qualified 180 180 333MHz 864 CLBS, 164674 GATES FIELD PROGRAMMABLE GATE ARRAY 3888 164674 864 0.6 ns
XCZU4CG-L1FBVB900I XCZU4CG-L1FBVB900I Xilinx
RFQ

Min: 1

Mult: 1

download Zynq® UltraScale+™ MPSoC CG -40°C~100°C TJ Tray 4 (72 Hours) CMOS ROHS3 Compliant 2016 /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf 900-BBGA, FCBGA 900 11 Weeks ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY 8542.31.00.01 YES BOTTOM BALL NOT SPECIFIED 0.72V 0.742V 0.698V NOT SPECIFIED R-PBGA-B900 204 DMA, WDT 256KB MCU, FPGA 500MHz, 1.2GHz MICROPROCESSOR CIRCUIT Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
XC95144XV-7TQ100I XC95144XV-7TQ100I Xilinx
RFQ

Min: 1

Mult: 1

3 85°C -40°C CMOS 1.6mm RoHS Compliant TQFP 14mm 14mm 2.5V 100 100 EAR99 YES No e0 YES QUAD GULL WING 225 2.5V 0.5mm 100 INDUSTRIAL 2.62V 30 Programmable Logic Devices 81 FLASH 7.5 ns 7 7.5 ns 125MHz 144 MACROCELL 8 YES YES
XC7Z035-3FFG676E XC7Z035-3FFG676E Xilinx
RFQ

Min: 1

Mult: 1

download Zynq®-7000 0°C~100°C TJ Tray 4 (72 Hours) CMOS 800MHz 3.37mm ROHS3 Compliant 2010 /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf 676-BBGA, FCBGA 27mm 27mm 676 10 Weeks CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 3A991.D PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY 8542.39.00.01 e1 Tin/Silver/Copper (Sn/Ag/Cu) YES BOTTOM BALL NOT SPECIFIED 1V 1mm 1.05V 0.95V NOT SPECIFIED S-PBGA-B676 130 DMA ARM 256KB MCU, FPGA 256000 CAN; ETHERNET; I2C; SPI; UART; USB YES Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Kintex™-7 FPGA, 275K Logic Cells
XC6VSX315T-L1FF1156C XC6VSX315T-L1FF1156C Xilinx
RFQ

Min: 1

Mult: 1

Surface Mount 85°C 0°C CMOS 3.5mm RoHS Compliant 35mm 35mm 900mV 1156 no 3A991.D 8542.39.00.01 e0 TIN LEAD BOTTOM BALL NOT SPECIFIED 0.9V 1mm 1156 OTHER 0.93V NOT SPECIFIED Field Programmable Gate Arrays 11.2/2.5V Not Qualified S-PBGA-B1156 600 3.1MB 600 600 1098MHz 314880 24600 FIELD PROGRAMMABLE GATE ARRAY 5.87 ns
XCZU3EG-L1SBVA484I XCZU3EG-L1SBVA484I Xilinx
RFQ

Min: 1

Mult: 1

download Zynq® UltraScale+™ MPSoC EG -40°C~100°C TJ Tray 4 (72 Hours) CMOS ROHS3 Compliant 2016 /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf 484-BFBGA, FCBGA 484 11 Weeks ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY 8542.31.00.01 YES BOTTOM BALL NOT SPECIFIED 0.72V 0.742V 0.698V NOT SPECIFIED R-PBGA-B484 82 DMA, WDT 256KB MCU, FPGA 500MHz, 600MHz, 1.2GHz MICROPROCESSOR CIRCUIT Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
XC6VHX380T-2FFG1155I XC6VHX380T-2FFG1155I Xilinx
RFQ

Min: 1

Mult: 1

Surface Mount 4 (72 Hours) 100°C -40°C CMOS 3.5mm RoHS Compliant FCBGA 35mm 35mm 1V 1155 yes 3A991.D e1 Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BOTTOM BALL 245 1V 1mm INDUSTRIAL 1.05V 30 Field Programmable Gate Arrays Not Qualified 440 3.4MB 2 440 382464 29880 FIELD PROGRAMMABLE GATE ARRAY
XCZU4EG-3FBVB900E XCZU4EG-3FBVB900E Xilinx
RFQ

Min: 1

Mult: 1

download Zynq® UltraScale+™ MPSoC EG 0°C~100°C TJ Tray 4 (72 Hours) ROHS3 Compliant 2016 /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf 900-BBGA, FCBGA 11 Weeks 8542.31.00.01 NOT SPECIFIED NOT SPECIFIED 204 DMA, WDT 256KB MCU, FPGA 600MHz, 1.5GHz Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
XC95144-15TQG100I XC95144-15TQG100I Xilinx
RFQ

Min: 1

Mult: 1

3 CMOS 1.6mm Non-RoHS Compliant 14mm 14mm 5V 100 100 yes EAR99 YES e3 Matte Tin (Sn) YES QUAD GULL WING 260 5V 0.5mm 100 INDUSTRIAL -40°C 30 Programmable Logic Devices Not Qualified 81 15 ns 55.6MHz 144 MACROCELL 8 FLASH PLD YES YES
XC7Z045-3FBG676E XC7Z045-3FBG676E Xilinx
RFQ

Min: 1

Mult: 1

download Zynq®-7000 0°C~100°C TJ Tray 3 (168 Hours) CMOS 1GHz 2.54mm ROHS3 Compliant 2009 /files/xilinxinc-xc7z045l2ffg676i-datasheets-4559.pdf 676-BBGA, FCBGA 27mm 1V 676 10 Weeks CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 3A991.D Copper, Silver, Tin No 8542.39.00.01 e1 Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) YES BOTTOM BALL 245 1V 1mm XC7Z045 1.05V 30 S-PBGA-B676 130 ROMless DMA ARM 256KB 32b -3 MCU, FPGA 256000 CAN; ETHERNET; I2C; SPI; UART; USB YES Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Kintex™-7 FPGA, 350K Logic Cells

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