Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Number of I/O | Memory Type | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed Grade | Propagation Delay | Architecture | Frequency (Max) | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Registers | Number of Inputs | RAM (words) | Bus Compatibility | Boundary Scan | Clock Frequency | Organization | Number of Macro Cells | Output Function | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Number of CLBs | JTAG BST | Combinatorial Delay of a CLB-Max | In-System Programmable |
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XCZU7EV-2FFVC1156I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1156-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 360 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV100-6TQ144I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 1.6mm | Non-RoHS Compliant | TQFP | 20mm | 20mm | 144 | 144 | no | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 225 | 2.5V | 0.5mm | 144 | 2.625V | 2.375V | 30 | Field Programmable Gate Arrays | 1.5/3.32.5V | Not Qualified | 98 | 333MHz | 600 CLBS, 108904 GATES | FIELD PROGRAMMABLE GATE ARRAY | 2700 | 108904 | 600 | 0.6 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU6EG-3FFVB1156E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1156-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 328 | DMA, WDT | 256KB | MCU, FPGA | 600MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC4VFX60-10FFG1152CS1 | Xilinx |
Min: 1 Mult: 1 |
download | 4 (72 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/xilinx-xc4vfx6010ffg1152cs1-datasheets-7100.pdf | FCBGA | 1.2V | 1152 | yes | 3A991.D | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 245 | 1mm | 30 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | S-PBGA-B1152 | 522kB | 10 | 576 | 576 | FIELD PROGRAMMABLE GATE ARRAY | 56880 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU11EG-L2FFVF1517E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1517-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1517 | 464 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC3S1400AN-4FGG676I4301 | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU19EG-L1FFVB1517I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1517-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1517 | 644 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV400E-6FG676CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | 2016 | https://pdf.utmel.com/r/datasheets/xilinx-xcv400e6fg676ces-datasheets-7631.pdf | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU5EG-3FBVB900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 600MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV405E-7BG560CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU19EG-2FFVD1760I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 308 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7K355T-3FF901E | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 100°C | 0°C | CMOS | Non-RoHS Compliant | FCBGA | 1V | 900 | No | BOTTOM | BALL | 1mm | Field Programmable Gate Arrays | S-PBGA-B900 | 300 | 3.1MB | 3 | 90 ps | 300 | 445200 | 300 | 1818MHz | 356160 | 27825 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU11EG-3FFVB1517E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1517-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 488 | DMA, WDT | 256KB | MCU, FPGA | 600MHz, 667MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV50-6BG256CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | 1998 | https://pdf.utmel.com/r/datasheets/xilinx-xcv506bg256ces-datasheets-8522.pdf | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z010-1CLG225I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 667MHz | 1.5mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z007s1clg400c-datasheets-0651.pdf | 225-LFBGA, CSPBGA | 13mm | 1V | 225 | 10 Weeks | 225 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | BOTTOM | BALL | 260 | 1V | 0.8mm | XC7Z010 | 1.05V | 30 | 86 | DMA | ARM | 256KB | 32b | -1 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 28K Logic Cells | |||||||||||||||||||||||||||||||||||||||||
EFR-DI-MM-TCC-DEC-SITE | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | Module | 1 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z045-2FFG676I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 800MHz | 3.37mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 27mm | 1V | 676 | 10 Weeks | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z045 | 1.05V | 30 | S-PBGA-B676 | 130 | ROMless | DMA | ARM | 256KB | 32b | -2 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 350K Logic Cells | ||||||||||||||||||||||||||||||||||||||||
XC2S200E-6FT256C | Xilinx |
Min: 1 Mult: 1 |
download | Standard | 3 (168 Hours) | 85°C | 0°C | CMOS | 2mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/xilinx-xc2s200e6ft256c-datasheets-9254.pdf | 17mm | 17mm | 1.8V | 256 | 256 | no | EAR99 | MAXIMUM USABLE GATES = 150000 | No | 8542.39.00.01 | e0 | BOTTOM | BALL | 240 | 1.8V | 1mm | 256 | COMMERCIAL EXTENDED | 1.89V | 30 | Field Programmable Gate Arrays | 7kB | 6 | 289 | 357MHz | FIELD PROGRAMMABLE GATE ARRAY | 5292 | 52000 | 864 | 0.47 ns | |||||||||||||||||||||||||||||||||||||||||||||||
XCZU4EV-1SFVC784E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 784-BFBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 252 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC95108-7PQG100I | Xilinx |
Min: 1 Mult: 1 |
download | 3 | 85°C | -40°C | CMOS | 3.4mm | RoHS Compliant | 1998 | /files/xilinx-xc951087pqg100i-datasheets-9609.pdf | PQFP | 20mm | 14mm | 5V | 100 | 100 | yes | EAR99 | No | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 245 | 5V | 0.65mm | 100 | INDUSTRIAL | 30 | Programmable Logic Devices | 81 | FLASH | 7 | 7.5 ns | 83.3MHz | 108 | MACROCELL | 8 | YES | YES | |||||||||||||||||||||||||||||||||||||||||||||||
XC7Z014S-1CLG400I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2016 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 400-LFBGA, CSPBGA | 17mm | 17mm | 400 | 10 Weeks | yes | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 1.05V | 0.95V | NOT SPECIFIED | S-PBGA-B400 | 125 | DMA | 256KB | MCU, FPGA | 667MHz | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | 667MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 65K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||
XC5VFX100T-3FF1738C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | FCBGA | 42.5mm | 42.5mm | 1V | e0 | TIN LEAD | BOTTOM | BALL | 225 | 1V | 1mm | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5V | Not Qualified | 680 | 1MB | 3 | 680 | 680 | 1412MHz | 102400 | 8000 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU3CG-2SFVC784I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Bulk | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 784 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | S-PBGA-B784 | 252 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV2000E-8FG860I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 2.2mm | Non-RoHS Compliant | FBGA | 42.5mm | 42.5mm | 860 | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1.8V | 1mm | 860 | 1.89V | 1.71V | 30 | Field Programmable Gate Arrays | 1.2/3.61.8V | Not Qualified | S-PBGA-B860 | 660 | 660 | 416MHz | 9600 CLBS, 518400 GATES | FIELD PROGRAMMABLE GATE ARRAY | 43200 | 518400 | 9600 | 0.4 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z010-3CLG225E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 866MHz | 1.5mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z007s1clg400c-datasheets-0651.pdf | 225-LFBGA, CSPBGA | 13mm | 225 | 10 Weeks | 225 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | BOTTOM | BALL | 260 | 1V | 0.8mm | XC7Z010 | 1.05V | 0.95V | 30 | 86 | DMA | ARM | 256KB | 32b | -3 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 28K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||
XCV100E-6FGG256C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | 2mm | RoHS Compliant | FBGA | 17mm | 17mm | 1.8V | 256 | yes | EAR99 | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 260 | 1.8V | 1mm | 256 | OTHER | 1.89V | 30 | Field Programmable Gate Arrays | 10kB | 6 | 176 | 176 | 357MHz | FIELD PROGRAMMABLE GATE ARRAY | 2700 | 32400 | 600 | 0.47 ns | |||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z020-1CLG400CES | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~85°C TJ | Tray | 3 (168 Hours) | 85°C | 0°C | 667MHz | RoHS Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 400-LFBGA, CSPBGA | 7 Weeks | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | XC7Z020 | 400-CSPBGA (17x17) | 130 | DMA | ARM | 256KB | MCU, FPGA | 667MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 85K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV200-6BG352I | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 1.7mm | Non-RoHS Compliant | BGA | 35mm | 35mm | 352 | no | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 2.5V | 1.27mm | 352 | 2.625V | 2.375V | 30 | Field Programmable Gate Arrays | 1.2/3.62.5V | Not Qualified | 260 | 260 | 333MHz | 1176 CLBS, 236666 GATES | FIELD PROGRAMMABLE GATE ARRAY | 5292 | 236666 | 1176 | 0.6 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z030-1FB484I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Bulk | 2A (4 Weeks) | CMOS | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 484-BBGA, FCBGA | 484 | 11 Weeks | no | GPIO WITH FOUR 32-BIT BANKS | 8542.39.00.01 | YES | BOTTOM | BALL | S-PBGA-B484 | 130 | DMA | 256KB | MCU, FPGA | 667MHz | 256000 | CAN, ETHERNET, I2C, PCI, SPI, UART, USB | YES | 667MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC5VSX35T-2FF665I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | RoHS Compliant | FCBGA | 1V | 665 | 665 | no | 3A991.D | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 665 | 1.05V | 30 | Field Programmable Gate Arrays | Not Qualified | 360 | 378kB | 2 | 360 | 34816 | 2720 | FIELD PROGRAMMABLE GATE ARRAY |
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