Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Screening Level | Number of I/O | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed Grade | Propagation Delay | Architecture | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Registers | Number of Inputs | RAM (words) | Bus Compatibility | Boundary Scan | Clock Frequency | Organization | Number of Gates | UV Erasable | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Number of CLBs | Combinatorial Delay of a CLB-Max |
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XA7Z020-1CLG400Q | Xilinx |
Min: 1 Mult: 1 |
download | Automotive, AEC-Q100, Zynq®-7000 XA | Surface Mount | -40°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 667MHz | 1.6mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xa7z0201clg484q-datasheets-0818.pdf | 400-LFBGA, CSPBGA | 17mm | 1V | 400 | 10 Weeks | 400 | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | NOT SPECIFIED | Other uPs/uCs/Peripheral ICs | 11.8V | Not Qualified | 130 | DMA | ARM | 256KB | 32b | MCU, FPGA | MICROPROCESSOR CIRCUIT | N | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 85K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||
XC3S500E-4FTG256CS1 | Xilinx |
Min: 1 Mult: 1 |
Standard | 3 (168 Hours) | 85°C | 0°C | CMOS | 1.55mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/xilinx-xc3s500e4ftg256cs1-datasheets-9152.pdf | 17mm | 17mm | 1.2V | 256 | 256 | yes | EAR99 | No | e1 | BOTTOM | BALL | 260 | 1.2V | 1mm | OTHER | 1.26V | 30 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | 45kB | 4 | 149 | 9312 | 572MHz | FIELD PROGRAMMABLE GATE ARRAY | 500000 | 0.76 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z035-2FFG900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | Surface Mount | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 800MHz | 3.35mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 900-BBGA, FCBGA | 31mm | 31mm | 900 | 10 Weeks | 1.05V | 950mV | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | Copper, Silver, Tin | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 1mm | 30 | S-PBGA-B900 | 130 | DMA | ARM | 256KB | 2 | 100 ps | MCU, FPGA | 343800 | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 275K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||
XC5VLX155-3FF1760C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | FCBGA | 42.5mm | 42.5mm | 1V | 1760 | no | e0 | TIN LEAD | BOTTOM | BALL | 225 | 1V | 1mm | 1760 | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5V | Not Qualified | S-PBGA-B1760 | 800 | 864kB | 3 | 800 | 800 | 1412MHz | 155648 | 12160 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU3CG-1SBVA484E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 484-BFBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 82 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV1006BG256CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z007S-1CLG225I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.5mm | ROHS3 Compliant | 2016 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4559.pdf | 225-LFBGA, CSPBGA | 13mm | 13mm | 225 | 10 Weeks | yes | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1V | 0.8mm | 1.05V | 0.95V | 30 | S-PBGA-B225 | 54 | DMA | 256KB | MCU, FPGA | 667MHz | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | 667MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 23K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||
EFR-DI-25GEMAC-SITE | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z030-2FBG676E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 800MHz | 2.54mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 27mm | 1V | 676 | 10 Weeks | 676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z030 | 1.05V | 30 | 130 | DMA | ARM | 256KB | 32b | -2 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||
XCS20XL-4CSG144C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | 1.2mm | RoHS Compliant | 12mm | 12mm | 3.3V | 144 | 144 | MAXIMUM USABLE GATES 20000 | e1 | YES | BOTTOM | BALL | 3.3V | 0.8mm | 144 | OTHER | 3.6V | 4 | 1120 | 217MHz | FIELD PROGRAMMABLE GATE ARRAY | 7000 | 400 | 1.1 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XA7Z030-1FBG484Q | Xilinx |
Min: 1 Mult: 1 |
download | Automotive, AEC-Q100, Zynq®-7000 XA | -40°C~125°C TJ | Tray | 4 (72 Hours) | CMOS | 2.54mm | RoHS Compliant | 2010 | /files/xilinxinc-xa7z0201clg484q-datasheets-0818.pdf | 484-BBGA, FCBGA | 23mm | 23mm | 484 | EAR99 | not_compliant | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 250 | 1mm | 30 | Other uPs/uCs/Peripheral ICs | 11.8V | Not Qualified | S-PBGA-B484 | 130 | DMA | 256KB | MCU, FPGA | 667MHz | MICROPROCESSOR CIRCUIT | N | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||
XCVU080-1FFVA2104C | Xilinx |
Min: 1 Mult: 1 |
3.86mm | Non-RoHS Compliant | 47.5mm | 47.5mm | 2104 | 3A001.A.7.A | 8542.39.00.01 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | NOT SPECIFIED | 0.95V | 1mm | OTHER | 85°C | 0.979V | 0.922V | NOT SPECIFIED | S-PBGA-B2104 | 672 CLBS | FIELD PROGRAMMABLE GATE ARRAY | 672 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU2CG-1SFVC784E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 252 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XQ4062XL-3HQ240N | Xilinx |
Min: 1 Mult: 1 |
Bulk | 3 (168 Hours) | CMOS | 4.1mm | Non-RoHS Compliant | 32mm | 32mm | Contains Lead | 240 | 240 | 3A001.A.2.C | TYPICAL GATES = 40000 TO 130000 | 8542.39.00.01 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 240 | MILITARY | 125°C | -55°C | 3.6V | 3V | 30 | Field Programmable Gate Arrays | 3.3V | Not Qualified | MIL-PRF-38535 | 193 | 166MHz | 2304 CLBS, 40000 GATES | 62000 | FIELD PROGRAMMABLE GATE ARRAY | 5472 | 40000 | 2304 | 1.6 ns | |||||||||||||||||||||||||||||||||||||||||||||||
XCZU2EG-2SFVC784E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2013 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 784-BFBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 252 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6SLX150-L1FG676C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 85°C | 0°C | CMOS | 2.44mm | RoHS Compliant | BGA | 27mm | 27mm | 1V | 676 | 676 | no | 3A991.D | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 676 | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5/3.3V | Not Qualified | 498 | 603kB | 498 | 184304 | 147443 | 11519 | FIELD PROGRAMMABLE GATE ARRAY | 0.46 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z030-3FBG676E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 1GHz | 2.54mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 27mm | 1V | 676 | 10 Weeks | 676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z030 | 1.05V | 30 | 130 | DMA | ARM | 256KB | 32b | -3 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||
XC3S200-4VQ100CES | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 85°C | 0°C | RoHS Compliant | 1.2V | 11 Weeks | 1.26V | 1.14V | 100 | Lead, Tin | No | 27kB | 4 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU3EG-2SBVA484E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 484-BFBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 82 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7A75T-L2FTG256E | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 100°C | 0°C | CMOS | 1.55mm | RoHS Compliant | FBGA | 17mm | 17mm | 900mV | 256 | 256 | yes | EAR99 | ALSO OPERATES AT 1V SUPPLY | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | 256 | OTHER | 0.93V | NOT SPECIFIED | Field Programmable Gate Arrays | 0.9V | Not Qualified | 170 | 472.5kB | 850 ps | 170 | 94400 | 1098MHz | 75520 | 5900 | FIELD PROGRAMMABLE GATE ARRAY | 1.51 ns | ||||||||||||||||||||||||||||||||||||||||||||||||
XCZU3EG-2SFVA625I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 625-BFBGA, FCBGA | 625 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.876V | 0.825V | NOT SPECIFIED | R-PBGA-B625 | 180 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VHX255T-3FF1155C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 85°C | 0°C | CMOS | RoHS Compliant | FCBGA | 1V | 1156 | No | e0 | TIN LEAD | BOTTOM | BALL | 1V | 1mm | 1156 | OTHER | 1.05V | Field Programmable Gate Arrays | 11.2/2.5V | S-PBGA-B1156 | 440 | 2.3MB | 3 | 190 ps | 440 | 440 | 1412MHz | 253440 | 19800 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU5CG-1SFVC784E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 252 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC2S200-5FG456Q | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 2.6mm | Non-RoHS Compliant | FBGA | 23mm | 23mm | 2.5V | 456 | no | EAR99 | No | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 2.5V | 1mm | 456 | AUTOMOTIVE | 125°C | -40°C | 2.625V | 30 | Field Programmable Gate Arrays | S-PBGA-B456 | 284 | 288 | 263MHz | 864 CLBS, 200000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 5292 | 200000 | 864 | |||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU5EG-1SFVC784E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 252 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCMECH-FFG1153 | Xilinx |
Min: 1 Mult: 1 |
RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU4CG-L2FBVB900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 900-BBGA, FCBGA | 900 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B900 | 204 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XA3S1400A-4FGG484I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 100°C | -40°C | CMOS | 2.6mm | RoHS Compliant | FBGA | 23mm | 23mm | 1.2V | 484 | 484 | 3A991.D | e1 | BOTTOM | BALL | 250 | 1.2V | 1mm | 484 | INDUSTRIAL | 1.26V | 30 | Field Programmable Gate Arrays | 1.21.2/3.33.3V | Not Qualified | AEC-Q100 | 375 | 72kB | 4 | 288 | 667MHz | 1.4e+06 | 25344 | 2816 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU4CG-L1SFVC784I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 784 | 11 Weeks | IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM) | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | S-PBGA-B784 | 252 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC9572XLTQ100 | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant |
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