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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Screening Level | Number of I/O | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed Grade | Propagation Delay | Architecture | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Registers | Number of Inputs | RAM (words) | Bus Compatibility | Boundary Scan | Clock Frequency | Organization | UV Erasable | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Number of CLBs | Combinatorial Delay of a CLB-Max |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XC6VHX255T-1FF1923C | Xilinx |
Min: 1 Mult: 1 |
download | CMOS | 3.85mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/xilinx-xc6vhx255t1ff1923c-datasheets-4824.pdf | 45mm | 45mm | 1924 | 6 Weeks | no | 3A991.D | 8542.39.00.01 | e0 | TIN LEAD | YES | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 1924 | OTHER | 85°C | 1.05V | 0.95V | NOT SPECIFIED | Field Programmable Gate Arrays | 11.2/2.5V | Not Qualified | S-PBGA-B1924 | 480 | 480 | 1098MHz | FIELD PROGRAMMABLE GATE ARRAY | 253440 | 5.08 ns | |||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z100-1FFG900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tube | 4 (72 Hours) | CMOS | 667MHz | 3.35mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 900-BBGA, FCBGA | 31mm | 31mm | 900 | 10 Weeks | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z100 | 1.05V | 0.95V | 30 | S-PBGA-B900 | 212 | DMA | ARM | 256KB | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 444K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||
| XC6VLX75T-2FF784I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 100°C | -40°C | CMOS | RoHS Compliant | FCBGA | 1V | 784 | 784 | no | 3A991.D | e0 | TIN LEAD | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 784 | INDUSTRIAL | 1.05V | NOT SPECIFIED | Field Programmable Gate Arrays | Not Qualified | 360 | 702kB | 2 | 360 | 74496 | 5820 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU7CG-1FFVF1517E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1517-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 464 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XQ4VLX25-10SF363M | Xilinx |
Min: 1 Mult: 1 |
4 (72 Hours) | CMOS | 1.99mm | Non-RoHS Compliant | 17mm | 17mm | 363 | 3A001.A.2.C | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 1.2V | 0.8mm | 363 | MILITARY | 125°C | -55°C | 1.26V | 1.14V | Field Programmable Gate Arrays | 1.21.2/3.32.5V | Not Qualified | S-PBGA-B363 | 240 | 240 | 1028MHz | 2688 CLBS | FIELD PROGRAMMABLE GATE ARRAY | 24192 | 2688 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU9CG-L1FFVB1156I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Bulk | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1156-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1156 | 328 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC6VLX760-1FFG1760I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 42.5mm | 42.5mm | 1V | 1760 | yes | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 245 | 1V | INDUSTRIAL | 30 | Field Programmable Gate Arrays | Not Qualified | 1200 | 3.2MB | 1 | 758784 | 59280 | FIELD PROGRAMMABLE GATE ARRAY | 5.08 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU5EV-L2FBVB900E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 900 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B900 | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XA6SLX25-2FGG484I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 100°C | -40°C | RoHS Compliant | FBGA | 1.2V | 484 | 484 | 3A991.D | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 1mm | 30 | Field Programmable Gate Arrays | Not Qualified | AEC-Q100 | 266 | 117kB | 2 | 266 | 30064 | 24051 | 1879 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU7EG-2FFVF1517I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1517-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 464 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC3020-100PG84M | Xilinx |
Min: 1 Mult: 1 |
125°C | -55°C | CMOS | 4.318mm | Non-RoHS Compliant | 27.94mm | 27.94mm | 5V | 84 | 84 | 3A001.A.2.C | No | 8542.39.00.01 | e3 | MATTE TIN | NO | PERPENDICULAR | PIN/PEG | 5V | 2.54mm | 84 | MILITARY | Field Programmable Gate Arrays | 5V | 1.8kB | 100 | 64 | 256 | FIELD PROGRAMMABLE GATE ARRAY | 64 | 64 | 7 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU7EV-L2FFVC1156E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EV | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1156-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1156 | 360 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCV300-5PQ240CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU11EG-2FFVC1156I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1156-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 360 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC4VFX60-11FF1152CS1 | Xilinx |
Min: 1 Mult: 1 |
download | 4 (72 Hours) | 85°C | 0°C | CMOS | Non-RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/xilinx-xc4vfx6011ff1152cs1-datasheets-7189.pdf | FCBGA | 1.2V | no | 3A991.D | No | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1mm | Field Programmable Gate Arrays | 1.21.2/3.32.5V | 522kB | 11 | 576 | 576 | FIELD PROGRAMMABLE GATE ARRAY | 56880 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU17EG-2FFVB1517I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1517-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 644 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC6VCX75T-2FF784I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 100°C | -40°C | CMOS | 3.1mm | RoHS Compliant | FCBGA | 1V | 784 | no | 3A991.D | e0 | TIN LEAD | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 784 | 1.05V | NOT SPECIFIED | Field Programmable Gate Arrays | Not Qualified | S-PBGA-B784 | 360 | 702kB | 2 | 360 | 93120 | 360 | 1098MHz | 74496 | 5820 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU11EG-L2FFVC1760E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1760 | 512 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCV50-6HQ240C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 4.1mm | Non-RoHS Compliant | 32mm | 32mm | 240 | 8542.39.00.01 | e0 | TIN LEAD | YES | QUAD | GULL WING | 225 | 2.5V | 0.5mm | 240 | OTHER | 85°C | 2.625V | 2.375V | 30 | Not Qualified | S-PQFP-G240 | 333MHz | 384 CLBS, 57906 GATES | FIELD PROGRAMMABLE GATE ARRAY | 57906 | 384 | 0.6 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU17EG-3FFVE1924E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1924-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 668 | DMA, WDT | 256KB | MCU, FPGA | 600MHz, 667MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC5VLX155T-2FF1738I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 42.5mm | 42.5mm | 1.2V | 1738 | 668 | 3A991.D | No | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 1738 | 1.05V | 30 | Field Programmable Gate Arrays | 12.5V | S-PBGA-B1738 | 680 | 954kB | 10 | 680 | 1265MHz | 155648 | 12160 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU19EG-1FFVE1924I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1924-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 668 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7K70T-3FB484E | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 100°C | 0°C | CMOS | Non-RoHS Compliant | FCBGA | 1V | 484 | No | BOTTOM | BALL | 1mm | Field Programmable Gate Arrays | S-PBGA-B484 | 185 | 607.5kB | 3 | 90 ps | 185 | 82000 | 185 | 1818MHz | 65600 | 5125 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU15EG-L2FFVB1156E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1156-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1156 | 328 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7A35T-1CPG236CES9892 | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 85°C | 0°C | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/xilinx-xc7a35t1cpg236ces9892-datasheets-8585.pdf | 6 Weeks | 1.05V | 950mV | 236 | Copper, Silver, Tin | 2.3kB | 1 | 1.09 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z020-2CLG400I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 766MHz | 1.6mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 400-LFBGA, CSPBGA | 17mm | 1V | 400 | 10 Weeks | 400 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1V | 0.8mm | XC7Z020 | 1.05V | 30 | 130 | DMA | ARM | 256KB | 32b | -2 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 85K Logic Cells | ||||||||||||||||||||||||||||||||||||||||
| XC7V585T2FF1157C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 85°C | 0°C | CMOS | Non-RoHS Compliant | FCBGA | 1V | 1156 | No | BOTTOM | BALL | 1mm | Field Programmable Gate Arrays | 11.8V | S-PBGA-B1156 | 600 | 3.5MB | 2 | 100 ps | 600 | 728400 | 600 | 1818MHz | 582720 | 45525 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-2FFG676I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 800MHz | 3.24mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 27mm | 1V | 676 | 10 Weeks | 676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | yes | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z030 | 676 | 1.05V | 30 | Other uPs/uCs/Peripheral ICs | 11.8V | 130 | DMA | ARM | 256KB | 32b | -2 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | N | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | |||||||||||||||||||||||||||||||||||
| XC4VSX25-10FFG668CS2 | Xilinx |
Min: 1 Mult: 1 |
download | 4 (72 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/xilinx-xc4vsx2510ffg668cs2-datasheets-9296.pdf | FCBGA | 1.2V | 668 | yes | 3A991.D | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 250 | 1mm | 30 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | S-PBGA-B668 | 288kB | 10 | 320 | 320 | FIELD PROGRAMMABLE GATE ARRAY | 23040 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z100-2FFG900I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | Surface Mount | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 800MHz | 3.35mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4558.pdf | 900-BBGA, FCBGA | 31mm | 900 | 10 Weeks | 900 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z100 | 1.05V | 0.95V | 30 | 212 | DMA | ARM | 256KB | 32b | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 444K Logic Cells |
