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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Current Rating | Package / Case | Length | Height | Color | Lead Free | Material | Factory Lead Time | REACH SVHC | Number of Pins | Lead Pitch | Accessory Type | Pbfree Code | Number of Positions | Number of Contacts | Contact Finish - Mating | Flammability Rating | ECCN Code | Additional Feature | Contact Material | Contact Plating | Housing Material | Lead Length | Reach Compliance Code | Insulation Resistance | JESD-609 Code | Feature | Terminal Pitch | Operating Temperature (Max) | Pitch | Connector Support Type | Body Length or Diameter | Body Breadth | Number of Rows | Row Spacing | Device Socket Type | Current Rating (Amps) | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | PCB Contact Row Spacing | Dielectric Withstanding Voltage | Number of Positions or Pins (Grid) | Material Flammability Rating | Convert From (Adapter End) | Convert To (Adapter End) | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Board Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 121-PLS13013-12 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA, ZIF (ZIP) | PLS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | 121 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||||||
| 02-0518-11H | Aries Electronics | $0.74 |
Min: 1 Mult: 1 |
download | SIP | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-10051810-datasheets-2521.pdf | 3A | 5 Weeks | 2 | 2.54mm | yes | 2 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e4 | Open Frame | 1 | RECTANGULAR | RND PIN-SKT | 2 (1 x 2) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||||
| 80-PRL15072-12 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA, ZIF (ZIP) | PRL | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||||||||||
| 22-0513-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 0513 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-07051310-datasheets-2771.pdf | 3A | 5 Weeks | 2.54mm | yes | 22 | 22 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | 2.2 inch | 1 | RECTANGULAR | RND PIN-SKT | 22 (1 x 22) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||||
| 100-PRS17048-12 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | /files/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | 100 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||||||
| 30-0518-10T | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-10051810-datasheets-2521.pdf | 3A | Lead Free | 5 Weeks | 30 | 2.54mm | yes | 30 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Open Frame | 1 | 30 (1 x 30) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||
| 163-PRS15065-12 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | /files/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||||||||||
| 34-0518-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-10051810-datasheets-2521.pdf | 3A | 5 Weeks | 34 | 2.54mm | yes | 34 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Open Frame | 3.4 inch | 1 | RECTANGULAR | RND PIN-SKT | 34 (1 x 34) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||
| 14-655-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | 655 | Bulk | Not Applicable | ROHS3 Compliant | 2006 | /files/arieselectronics-0665810-datasheets-2816.pdf | Red | Lead Free | 5 Weeks | 14 | 2.54mm | Cap (Cover) | 14 | Tin | 2.54mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 14-81000-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-14840010-datasheets-7181.pdf | 1A | 7 Weeks | yes | 14 | 14 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 2.54mm | 0.75 inch | 0.395 inch | RECTANGULAR | 1.04 inch | SQ PIN-SKT | 0.1 inch | 0.3 mm | 14 (2 x 7) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||
| 14-650-40 | Aries Electronics |
Min: 1 Mult: 1 |
download | 650 | Bulk | Solder | ROHS3 Compliant | 2007 | /files/arieselectronics-1465010-datasheets-1163.pdf | 22.9mm | Lead Free | 4 Weeks | No SVHC | Cap (Cover) | yes | 14 | UL94 V-0 | Nylon | CONNECTOR ACCESSORY | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 14-8870-10WR | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-14840010-datasheets-7181.pdf | 1A | 7 Weeks | yes | 14 | 14 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 2.54mm | 0.75 inch | 0.395 inch | RECTANGULAR | SQ PIN-SKT | 0.1 inch | 0.3 mm | 14 (2 x 7) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||
| 1106396-28 | Aries Electronics |
Min: 1 Mult: 1 |
download | Correct-A-Chip® 1106396 | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-110639628-datasheets-0009.pdf | 35.6mm | 2.29mm | Lead Free | 5 Weeks | No SVHC | 2.54mm | yes | 28 | 28 | Gold | EAR99 | SOCKET ADAPTER | Copper | Gold, Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | e3 | 2 | 7.62 mm | IC SOCKET | 3A | RECTANGULAR | RND PIN-SKT | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||
| 14-8770-10WR | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-14840010-datasheets-7181.pdf | 1A | 7 Weeks | yes | 14 | 14 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 2.54mm | 0.75 inch | 0.395 inch | RECTANGULAR | 0.77 inch | SQ PIN-SKT | 0.1 inch | 0.3 mm | 14 (2 x 7) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||
| 1109522 | Aries Electronics |
Min: 1 Mult: 1 |
download | Correct-A-Chip® 1109522 | Through Hole | Through Hole | 1 (Unlimited) | Solder | 105°C | -55°C | Non-RoHS Compliant | 2006 | /files/arieselectronics-1109523-datasheets-0101.pdf | 3A | TO-8 | 6 Weeks | 8 | 2.54mm | 8 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e0 | 2 | IC SOCKET | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | JEDEC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||
| 14-C195-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | EJECT-A-DIP™ | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-32c18210-datasheets-3591.pdf | 3A | Lead Free | 5 Weeks | 14 | 2.54mm | yes | 14 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | 1000000000Ohm | e3 | Closed Frame | 0.95 inch | 0.4 inch | 2 | RECTANGULAR | RND PIN-SKT | 0.1 inch | 0.3 mm | 1000VAC V | 14 (2 x 7) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||
| 08-305479-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | Correct-A-Chip® 305479 | Through Hole | Through Hole | Box | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2009 | /files/arieselectronics-1109814-datasheets-1511.pdf | Lead Free | 5 Weeks | 8 | 8 | EAR99 | 3.175mm | e3 | IC SOCKET | SOIC | JEDEC | Brass | 0.050 1.27mm | 0.125 3.18mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||||||||||
| 33-0518-10T | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-10051810-datasheets-2521.pdf | 3A | 5 Weeks | 33 | 2.54mm | yes | 33 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Open Frame | 1 | 33 (1 x 33) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||||||
| 16-307349-11-RC-P (170 UP) | Aries Electronics |
Min: 1 Mult: 1 |
download | Correct-A-Chip® 307349 | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | /files/arieselectronics-1630734911rcp170up-datasheets-0307.pdf | 5 Weeks | 16 | Gold | PLCC | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 38-1518-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.2 (5.08mm) Row Spacing | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-10051810-datasheets-2521.pdf | 3A | 5 Weeks | 38 | 2.54mm | yes | 38 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Open Frame | 105°C | 1.9 inch | 2 | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 38 (2 x 19) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||
| 28-665000-00 | Aries Electronics |
Min: 1 Mult: 1 |
download | Correct-A-Chip® 665000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-1666500000-datasheets-0505.pdf | 5 Weeks | 28 | 28 | EAR99 | SOCKET ADAPTER | 787.4μm | e3 | IC SOCKET | SOIC-W | SOIC | Brass | 0.050 1.27mm | 0.031 0.80mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||||||||||
| 05-0503-21 | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 0503 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-25050330-datasheets-3568.pdf | 3A | 5 Weeks | 2.54mm | 5 | Gold | UL94 HB | Polyamide (PA), Nylon, Glass Filled | 9.144mm | unknown | 1 | 5 (1 x 5) | UL94 HB | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.360 9.14mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||||||||||||
| 14-354000-20 | Aries Electronics |
Min: 1 Mult: 1 |
download | Correct-A-Chip® 354000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2006 | /files/arieselectronics-1435400010-datasheets-0450.pdf | 3A | 5 Weeks | 14 | 14 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Gold, Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | e3 | 2 | 7.62 mm | IC SOCKET | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.050 1.27mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||||||||
| 12-6513-10H | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | Lo-PRO®file, 513 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-08251310-datasheets-2619.pdf | 3A | 5 Weeks | 2.54mm | yes | 12 | 12 | Gold | UL94 V-0 | EAR99 | LOW PROFILE; UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Closed Frame | 0.7 inch | 2 | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.6 mm | 12 (2 x 6) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||
| 20-354W00-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | Correct-A-Chip® 354W00 | Through Hole | 105°C | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | /files/arieselectronics-16354w0010-datasheets-0511.pdf | 25.4mm | 1.58mm | Lead Free | 5 Weeks | 20 | 20 | Gold | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | e0 | IC SOCKET | 3A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOWIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||||||||||
| 10-3513-11 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | Lo-PRO®file, 513 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-08251310-datasheets-2619.pdf | 3A | Lead Free | 5 Weeks | 10 | yes | 10 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e4 | Closed Frame | 2.54mm | 1 inch | 0.4 inch | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.3 mm | 10 (2 x 5) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||
| 20-354000-11-RC | Aries Electronics |
Min: 1 Mult: 1 |
download | Correct-A-Chip® 354000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | ROHS3 Compliant | 2009 | /files/arieselectronics-1835400021rc-datasheets-0533.pdf | 3A | Glass, Polyester, Thermoplastic | 5 Weeks | No SVHC | 20 | 2.54mm | yes | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Copper | Polyamide (PA46), Nylon 4/6, Glass Filled | 762μm | e4 | 7.62 mm | IC SOCKET | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.030 0.76mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||||
| 10-1518-11H | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.2 (5.08mm) Row Spacing | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-10051810-datasheets-2521.pdf | 3A | 5 Weeks | 10 | 2.54mm | yes | 10 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e4 | Open Frame | 0.5 inch | 2 | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 10 (2 x 5) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||
| 95-132I25 | Aries Electronics |
Min: 1 Mult: 1 |
download | Correct-A-Chip® 95-132I25 | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-95132i25-datasheets-0669.pdf | 34.3mm | 2.39mm | Contains Lead | 5 Weeks | 132 | 95 | 132 | Tin | EAR99 | SOCKET ADAPTER | e3 | IC SOCKET | QFP | PGA | Copper | Brass | 0.025 0.64mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||||||
| 16-1518-11H | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.2 (5.08mm) Row Spacing | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | /files/arieselectronics-10051810-datasheets-2521.pdf | 3A | 5 Weeks | 16 | 2.54mm | yes | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e4 | Open Frame | 0.8 inch | 2 | RECTANGULAR | RND PIN-SKT | 0.1 inch | 0.1 mm | 16 (2 x 8) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm |
