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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Current Rating | Length | Height | Width | Lead Free | Factory Lead Time | Lead Pitch | Pbfree Code | Number of Positions | Number of Contacts | Contact Finish - Mating | Flammability Rating | ECCN Code | Additional Feature | Contact Material | Contact Plating | Housing Material | Lead Length | Insulation Resistance | JESD-609 Code | Feature | Terminal Pitch | Operating Temperature (Max) | Body Length or Diameter | Body Breadth | Number of Rows | Current Rating (Amps) | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | PCB Contact Row Spacing | Dielectric Withstanding Voltage | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 32-6556-40 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | 6556 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder Cup | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-24655620-datasheets-9089.pdf | 3A | 6 Weeks | yes | 32 | 32 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Gold, Tin | Polyphenylene Sulfide (PPS), Glass Filled | 4.572mm | e3 | Open Frame | 32 (2 x 16) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.180 4.57mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||
| 36-6556-40 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | 6556 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder Cup | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/arieselectronics-24655620-datasheets-9089.pdf | 3A | 6 Weeks | yes | 36 | 36 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Gold, Tin | Polyphenylene Sulfide (PPS), Glass Filled | 4.572mm | e3 | Open Frame | 36 (2 x 18) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.180 4.57mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||
| 40-6508-301 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | 508 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | /files/arieselectronics-143508301-datasheets-6498.pdf | 3A | 5 Weeks | 2.54mm | 40 | 40 | Gold | UL94 V-0 | EAR99 | STACKABLE | Polyamide (PA46), Nylon 4/6, Glass Filled | 9.144mm | Open Frame | 0.7 inch | 2 | RECTANGULAR | 0.19 inch | RND PIN-SKT | 0.1 inch | 0.6 mm | 40 (2 x 20) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.360 9.14mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||
| 40-6508-302 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | 508 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-143508301-datasheets-6498.pdf | 3A | 5 Weeks | 2.54mm | 40 | 40 | Gold | UL94 V-0 | EAR99 | STACKABLE | Polyamide (PA46), Nylon 4/6, Glass Filled | 9.144mm | Open Frame | 0.7 inch | 2 | RECTANGULAR | 0.19 inch | RND PIN-SKT | 0.1 inch | 0.6 mm | 40 (2 x 20) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.360 9.14mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||
| 42-6553-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf | 4 Weeks | yes | 42 | Gold | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | e3 | Closed Frame | 1A | 42 (2 x 21) | UL94 V-0 | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | |||||||||||||||||||||||||||||||||||
| 36-6556-11 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | 6556 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-24655620-datasheets-9089.pdf | 3A | 4 Weeks | 36 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS), Glass Filled | 3.302mm | Open Frame | 3A | 36 (2 x 18) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Gold | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||
| 18-3508-212 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | 508 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-143508301-datasheets-6498.pdf | 3A | 5 Weeks | 2.54mm | 18 | 18 | Gold | UL94 V-0 | EAR99 | STACKABLE | Polyamide (PA46), Nylon 4/6, Glass Filled | 12.7mm | Open Frame | 0.9 inch | 0.4 inch | 2 | RECTANGULAR | 0.19 inch | RND PIN-SKT | 0.1 inch | 0.3 mm | 18 (2 x 9) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.500 12.70mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||
| 34-0501-21 | Aries Electronics |
Min: 1 Mult: 1 |
download | SIP | 501 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | /files/arieselectronics-02050130-datasheets-3742.pdf | 1A | 7 Weeks | 2.54mm | yes | 34 | 34 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.668mm | e4 | 3.45 inch | 1 | RECTANGULAR | 0.26 inch | SQ PIN-SKT | 34 (1 x 34) | UL94 V-0 | 10.0μin 0.25μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.420 10.67mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||
| 18-822-90T | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.3 (7.62mm) Row Spacing | Vertisockets™ 800 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-0882390-datasheets-3547.pdf | 1.5A | 7 Weeks | yes | 18 | 18 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6 | 3.683mm | e3 | Closed Frame | 2.54mm | 0.95 inch | 0.4 inch | RECTANGULAR | 0.58 inch | SQ PIN-SKT | 0.1 inch | 0.2 mm | 18 (2 x 9) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.145 3.68mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||||
| 181-PGM15005-10 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA | PGM | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 3A | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||||||
| 32-3570-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | /files/arieselectronics-24657410-datasheets-8308.pdf | 1A | 5 Weeks | yes | 32 | 32 | Nickel Boron | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Nickel | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 32 (2 x 16) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||||||||
| 60-9503-31 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.9 (22.86mm) Row Spacing | 503 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-08250330-datasheets-7188.pdf | 3A | 5 Weeks | 2.54mm | 60 | 60 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 12.7mm | Closed Frame | 2 | 60 (2 x 30) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Phosphor Bronze | 0.100 2.54mm | 0.500 12.70mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||
| 40-6573-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/arieselectronics-24657410-datasheets-8308.pdf | 1A | 5 Weeks | 40 | Tin | UL94 V-0 | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 1A | 40 (2 x 20) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||
| 42-3573-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf | 1A | 5 Weeks | yes | 42 | 42 | Nickel Boron | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Nickel | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 42 (2 x 21) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||||||||
| 44-3570-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | /files/arieselectronics-24657410-datasheets-8308.pdf | 1A | 5 Weeks | yes | 44 | 44 | Nickel Boron | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Nickel | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 44 (2 x 22) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||||||||
| 44-6571-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | /files/arieselectronics-24657410-datasheets-8308.pdf | 1A | 5 Weeks | 44 | Nickel Boron | UL94 V-0 | Nickel | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 1A | 44 (2 x 22) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | |||||||||||||||||||||||||||||||
| 44-6556-40 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | 6556 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder Cup | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-24655620-datasheets-9089.pdf | 3A | 6 Weeks | yes | 44 | 44 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Gold, Tin | Polyphenylene Sulfide (PPS), Glass Filled | 4.572mm | e3 | Open Frame | 44 (2 x 22) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.180 4.57mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||
| 36-6553-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf | 6 Weeks | yes | 36 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyetheretherketone (PEEK), Glass Filled | Closed Frame | 1A | 36 (2 x 18) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||||||||||||
| 40-3551-16 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 55 | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf | 6 Weeks | yes | 40 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | Closed Frame | 1A | 40 (2 x 20) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | |||||||||||||||||||||||||||||||||
| 181-PRS15033-12 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||
| 209-PRS17020-12 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||
| 28-3574-18 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 6 Weeks | yes | 28 | 28 | Gold | UL94 V-0 | EAR99 | UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 28 (2 x 14) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||
| 28-6574-18 | Aries Electronics | $109.92 |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/aries-28657418-datasheets-3770.pdf | 1A | 6 Weeks | yes | 28 | 28 | Tin | UL94 V-0 | EAR99 | UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | 1000000000Ohm | Closed Frame | 2.54mm | 250°C | 1.99 inch | 0.9 inch | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 1000VAC V | 28 (2 x 14) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||
| 281-PRS19012-12 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||
| 257-PRS20018-12 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||
| 300-PRS20006-12 | Aries Electronics |
Min: 1 Mult: 1 |
download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | /files/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||
| 42-6552-18 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | yes | 42 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyetheretherketone (PEEK), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 2.69 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 42 (2 x 21) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | |||||||||||||||||||||||||
| 42-3552-18 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 55 | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | 42 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyetheretherketone (PEEK), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 2.69 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 42 (2 x 21) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||||||
| 44-3574-18 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 6 Weeks | yes | 44 | 44 | Tin | UL94 V-0 | EAR99 | UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 44 (2 x 22) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||
| C8124-04 | Aries Electronics |
Min: 1 Mult: 1 |
download | DIP, 0.6 (15.24mm) Row Spacing | Edge-Grip™, C81 | Wire | Through Hole | -55°C~105°C | Bulk | Not Applicable | Wire Wrap | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-c811804-datasheets-6015.pdf | 32.5mm | 7.11mm | 17.8mm | Contains Lead | 2.54mm | 24 | 24 | Tin | EAR99 | STANDARD: UL 94V-0 | Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | 1000000000Ohm | e3 | Closed Frame | 0.7 inch | 2 | 1.5A | RECTANGULAR | SQ PIN-SKT | 0.1 inch | 0.6 mm | 1000VAC V | 24 (2 x 12) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.675 17.15mm | 0.100 2.54mm | 200.0μin 5.08μm |
