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ContactTDK InvenSense(364)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Size / Dimension | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | Voltage - Rated | Technology | Operating Supply Current | Current - Supply | Voltage Range | Port Location | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Bandwidth | Shape | Number of Terminations | Factory Lead Time | REACH SVHC | Max Supply Voltage | Min Supply Voltage | Resistance | Number of Pins | Interface | Lifecycle Status | Impedance | Radiation Hardening | Number of Functions | Power Rating | Evaluation Kit | Tolerance | Feature | Case Code (Metric) | Case Code (Imperial) | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Supply Voltage | Terminal Pitch | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Analog IC - Other Type | JESD-30 Code | Sensitivity | Output Type | Function | Height (Max) | Frequency Range | Direction | Sensing Range | Sensor Type | Utilized IC / Part | Axis | Range °/s | Sensitivity (LSB/(°/s)) | Note | Primary Attributes | Supplied Contents | Embedded | S/N Ratio | Mfr |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| IAM-20380 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Digital | Automotive, AEC-Q100 | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 16-WFLGA Module | 27kHz | 16 Weeks | Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor | 1.71V~3.6V | I2C, SPI | X (Pitch), Y (Roll), Z (Yaw) | ±250, 500, 1000, 2000 | 16.4 ~ 131 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPU-9150EVB | TDK InvenSense |
Min: 1 Mult: 1 |
download | Box | 1 (Unlimited) | RoHS Compliant | 2012 | /files/tdkinvensense-mpu9150evb-datasheets-6599.pdf | I2C | Yes | 2.375V~3.465V | ±2g, 4g, 8g, 16g, ±250°/sec, ±500°/sec, ±1000°/sec, ±2000°/sec, ±1200μT | Accelerometer, Gyroscope, Magnetometer, 3 Axis | MPU-9150 | Board(s) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_ICG-20330 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Non-RoHS Compliant | 16 Weeks | I2C, SPI | 1.71V~3.45V | 1048LSB/°/s | ±31.25°/sec, ±62.5°/sec, ±125°/sec, ±250°/sec | Gyroscope, 3 Axis | ICG-20330 | Board(s) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPU-6000EVB | TDK InvenSense |
Min: 1 Mult: 1 |
download | Box | 1 (Unlimited) | ROHS3 Compliant | 2011 | /files/invensense-mpu6000evb-datasheets-6443.pdf | I2C, SPI | Yes | 2.375V~3.46V | ±2g, 4g, 8g, 16g, ±250°/sec, ±500°/sec, ±1000°/sec, ±2000°/sec | Accelerometer, Gyroscope, 3 Axis | MPU-6000 | Board(s) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ICM-20689 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 0.95mm | ROHS3 Compliant | 2014 | 24-VFQFN Module Exposed Pad | 4mm | 4mm | 24 | 16 Weeks | 1 | YES | QUAD | NO LEAD | 1.8V | 0.5mm | 3.45V | 1.71V | ANALOG CIRCUIT | S-XQCC-N24 | I2C, SPI | Accelerometer, Gyroscope, Temperature, 6 Axis | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_ICS-40619-FX | TDK InvenSense |
Min: 1 Mult: 1 |
download | Audio | 1 (Unlimited) | ROHS3 Compliant | 2016 | 16 Weeks | MEMS Omnidirectional Microphones | ICS-40619 | Analog Output | Board(s) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_INMP411-FX | TDK InvenSense |
Min: 1 Mult: 1 |
download | Audio | 1 (Unlimited) | ROHS3 Compliant | 2014 | 16 Weeks | Yes | MEMS Omnidirectional Microphones | INMP411 | Analog Output, 200Ohm Impedance | Board(s) | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 1428-1156-KIT | TDK InvenSense |
Min: 1 Mult: 1 |
download | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ICS-40720 | TDK InvenSense |
Min: 1 Mult: 1 |
download | MEMS (Silicon) | Tape & Reel (TR) | 0.157Lx0.118W 4.00mmx3.00mm | 1 (Unlimited) | Solder Pads | 375μA | 1.5V~3.63V | Bottom | ROHS3 Compliant | 2014 | Rectangular | 16 Weeks | PRODUCTION (Last Updated: 1 month ago) | -38dB ±2dB @ 94dB SPL | Analog | 0.051 1.30mm | 75Hz~20kHz | Omnidirectional | 70dB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| INMP521ACEZ-R7 | TDK InvenSense |
Min: 1 Mult: 1 |
download | MEMS (Silicon) | INMP521 | Solder | Tape & Reel (TR) | 0.157Lx0.118W 4.00mmx3.00mm | 3 (168 Hours) | Solder Pads | 1.2mA | 1.62V~3.63V | Bottom | ROHS3 Compliant | /files/invensense-inmp521acezr7-datasheets-2795.pdf | 1.1mm | Rectangular | -26dB ±3dB @ 94dB SPL | Digital, PDM | 100Hz~16kHz | Omnidirectional | 65dB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_IIM-42352 | TDK InvenSense |
Min: 1 Mult: 1 |
SmartIndustrial? | I2C, I3C, Serial, SPI | 1.71V ~ 3.6V | 16384LSB/g, 8192LSB/g, 4096LSB/g, 2048LSB/g | ±2g, ±4g, ±8g, ±16g | Accelerometer, 3 Axis | IIM-42352 | Board(s) | No | TDK InvenSense | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ICM-42688-V | TDK InvenSense |
Min: 1 Mult: 1 |
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| MPU-3050 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Digital | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | 5.9mA | ROHS3 Compliant | 2011 | 24-VFQFN Exposed Pad | 33kHz X 30kHz Y 27kHz Z | Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor | 2.1V~3.6V | I2C | X (Pitch), Y (Roll), Z (Yaw) | ±250, 500, 1000, 2000 | 16.4 ~ 131 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_MPU-3050 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Box | 1 (Unlimited) | ROHS3 Compliant | 2011 | I2C | Yes | 2.1V~3.6V | 131LSB/(°/s), 65.5LSB/(°/s), 32.8LSB/(°/s), 16.4LSB/(°/s) | ±250°/sec, ±500°/sec, ±1000°/sec, ±2000°/sec | Gyroscope, 3 Axis | MPU-3050 | Board(s) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_ICM-20649 | TDK InvenSense |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | 2016 | 16 Weeks | I2C, SPI | 1.71V~3.6V | ±4g, 8g, 16g, 30g ±100dps, 500dps, 2000dps, 4000dps | Accelerometer, Gyroscope, 3 Axis | ICM-20649 | Board(s) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DK-20789 | TDK InvenSense |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | ROHS3 Compliant | 16 Weeks | I2C, SPI | PRODUCTION (Last Updated: 2 months ago) | 5V USB | ±2g, 4g, 8g, 16g, ±250°/sec, ±500°/sec, ±1000°/sec, ±2000°/sec | Accelerometer, Gyroscope, Pressure | ICM-20789 | Board(s) | Yes, MCU, 32-Bit | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ICM-20601 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 0.8mm | ROHS3 Compliant | 2014 | 16-WFLGA Module | 3mm | 3mm | 16 | 17 Weeks | 1 | YES | BOTTOM | BUTT | 1.8V | 0.5mm | 3.45V | 1.71V | ANALOG CIRCUIT | S-XBGA-B16 | I2C, SPI | Accelerometer, Gyroscope, Temperature, 6 Axis | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_ICS-40300-FX | TDK InvenSense |
Min: 1 Mult: 1 |
download | Audio | 1 (Unlimited) | ROHS3 Compliant | 2015 | 16 Weeks | MEMS Omnidirectional Microphones | ICS-40300 | Analog Output | Board(s) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_INMP521-FX | TDK InvenSense | $53.68 |
Min: 1 Mult: 1 |
download | Audio | 1 (Unlimited) | ROHS3 Compliant | 2014 | /files/invensense-evinmp521fx-datasheets-5903.pdf | 18 Weeks | Yes | MEMS Omnidirectional Microphones | INMP521 | Digital Output | Board(s) | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| INMP441WACEZ-R7 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Tape & Reel (TR) | 1 (Unlimited) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| INMP522ACEZ-R7 | TDK InvenSense |
Min: 1 Mult: 1 |
download | MEMS (Silicon) | INMP522 | Tape & Reel (TR) | 0.157Lx0.118W 4.00mmx3.00mm | 1 (Unlimited) | Solder Pads | 85°C | -40°C | 3.63V | 1.4mA | 1.62V~3.63V | Bottom | ROHS3 Compliant | LGA | 1.1mm | Rectangular | No SVHC | 3.6V | -300mV | 5 | -26dB ±1dB @ 94dB SPL | Digital, PDM | 75Hz~20kHz | Omnidirectional | 65dB | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| ICS-40740 | TDK InvenSense |
Min: 1 Mult: 1 |
download | MEMS (Silicon) | ICS-40740 | Tape & Reel (TR) | 0.157Lx0.118W 4.00mmx3.00mm | 1 (Unlimited) | Solder Pads | 155μA | 1.5V~3.63V | Bottom | ROHS3 Compliant | Rectangular | 16 Weeks | 355Ohm | -37.5dB ±1dB @ 94dB SPL | Analog | 0.051 1.30mm | 77Hz~20kHz | Omnidirectional | 70dB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DK-10125 | TDK InvenSense |
Min: 1 Mult: 1 |
- | I2C, Serial | 1.71V ~ 1.89V | ±1Pa | 300 ~ 1100 hPa | Pressure | ICP-10125 | - | Board(s) | Yes, MCU, 32-Bit | TDK InvenSense | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CA-SDK BOARD | TDK InvenSense |
Min: 1 Mult: 1 |
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| ITG-1010 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Digital | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | 3.2mA | 3.2mA | ROHS3 Compliant | 2014 | 16-VFQFN Exposed Pad | 16kHz | Adjustable Bandwidth, Selectable Scale, Temperature Sensor | 1.71V~3.6V | I2C, SPI | X (Pitch), Y (Roll), Z (Yaw) | ±250, 500, 1000, 2000 | 16.4 ~ 131 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_MPU-9250 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Box | 1 (Unlimited) | RoHS Compliant | /files/invensense-evmpu9250-datasheets-4736.pdf | 16 Weeks | I2C, SPI | Yes | 2.4V~3.6V | ±2g, 4g, 8g, 16g, ±250°/sec, ±500°/sec, ±1000°/sec, ±2000°/sec | Accelerometer, Gyroscope, Magnetometer, 3 Axis | MPU-9250 | Board(s) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPU-3300EVB | TDK InvenSense |
Min: 1 Mult: 1 |
download | Box | 1 (Unlimited) | ROHS3 Compliant | No SVHC | I2C, SPI | Yes | I2C | 2.375V~3.46V | 145.6LSB/(°/s), 72.8LSB/(°/s) | ±225°/sec, ±450°/sec | Gyroscope, 3 Axis | MPU-3300 | Board(s) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DK-10101 | TDK InvenSense |
Min: 1 Mult: 1 |
download | SmartMotion® | Not Applicable | ROHS3 Compliant | /files/tdkinvensense-icp10110-datasheets-8425.pdf | 6 Weeks | I2C, USB | 5V USB | ±1,.5 hPA, ±0.4°C | 30 ~ 110 kPA, -40 ~ 85°C | Barometric Pressure, Temperature | ATSMG55, ICP-10101 | Board(s) | Yes, MCU, 32-Bit | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPU-6050 | TDK InvenSense |
Min: 1 Mult: 1 |
download | Surface Mount | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | 75V | ROHS3 Compliant | 2010 | 24-VFQFN Module Exposed Pad | 1.6mm | 450μm | 800μm | 16 Weeks | Yes | 3.6V | 2.5V | 5.6kOhm | 24 | No | 100mW | 1% | 1608 | 0603 | I2C | Accelerometer, Gyroscope, 6 Axis | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| EV_INMP621-FX | TDK InvenSense |
Min: 1 Mult: 1 |
download | Audio | 1 (Unlimited) | ROHS3 Compliant | 2014 | 19 Weeks | Yes | MEMS Omnidirectional Microphones | INMP621 | Digital Output | Board(s) | No |
