Products
Manufacturer
RFQ
NEWS
ContactMemory(55331)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Programming Voltage | Address Bus Width | Organization | Memory Width | Memory Density | Alternate Memory Width | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | Data Polling | Toggle Bit | Number of Sectors/Size | Sector Size | Ready/Busy | Boot Block | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 71321LA20JG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71321la20jg-datasheets-4580.pdf | PLCC | 19mm | 19mm | 5V | Lead Free | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | yes | 3.63mm | 2 | EAR99 | AUTOMATIC POWER DOWN | No | 1 | 200mA | e3 | Matte Tin (Sn) - annealed | QUAD | J BEND | 260 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 2kB | SDR | 3-STATE | 20 ns | 22b | 0.0015A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||||||||||
| 71V3556SA150BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | 150MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3556sa150bq-datasheets-4569.pdf | 15mm | 1.2mm | 13mm | 3.3V | Contains Lead | 11 Weeks | 3.465V | 3.135V | 165 | Parallel | 4.5 Mb | no | 1.2mm | 1 | No | e0 | Tin/Lead (Sn63Pb37) | 225 | 165 | 512kB | RAM, SDR, SRAM | 150MHz | 17b | ||||||||||||||||||||||||||||||||||||||||||||||||||
| 71V3577S85BGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 87MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3577s85bgi8-datasheets-4561.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 190mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | INDUSTRIAL | 20 | SRAMs | 512kB | RAM, SDR, SRAM | 87MHz | 3-STATE | 8.5 ns | 17b | 0.035A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||||||
| 7008S35G | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008s35g-datasheets-4543.pdf | 27.94mm | 27.94mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 512 kb | no | 3.68mm | 2 | EAR99 | No | 1 | 295mA | e0 | TIN LEAD | PERPENDICULAR | PIN/PEG | 240 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 32b | 64KX8 | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||||
| IDT71V3578YS133PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3578ys133pf-datasheets-4514.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.25mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 256KX18 | 18 | 4718592 bit | 0.03A | 4.2 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||
| IDT7164S35YGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.556mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt7164s35ygi-datasheets-4511.pdf | 17.9324mm | 7.5184mm | 28 | 28 | Parallel | EAR99 | unknown | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | J BEND | 260 | 5V | 1.27mm | 28 | INDUSTRIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.09mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 8KX8 | 8 | 65536 bit | 0.015A | 35 ns | COMMON | 4.5V | ||||||||||||||||||||||||||||||||||||||
| 70V3589S133BCI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3589s133bci-datasheets-4508.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 2.3 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 480mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 3.3V | 1mm | 256 | INDUSTRIAL | SRAMs | 256kB | RAM, SRAM | 133MHz | 3-STATE | 4.2 ns | 32b | 64KX36 | 0.04A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||||||
| IDT71V35761S166PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v35761s166pfi-datasheets-4507.pdf | TQFP | 20mm | 3.3V | 100 | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | 1 | PIPELINED ARCHITECTURE | not_compliant | 1 | 330mA | e0 | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 20 | SRAMs | Not Qualified | RAM, SRAM | 3-STATE | 3.5 ns | 17b | 36 | 0.035A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||||||||||||
| 7034L15PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7034l15pf-datasheets-4505.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 72 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 260mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 9kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 12b | 4KX18 | 0.0015A | 18b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||||||
| IDT71V256SA20Y | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Rail/Tube | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.556mm | RoHS Compliant | 1997 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v256sa20y-datasheets-4497.pdf | 3.3V | 28 | 3.6V | 3V | 28 | Parallel | 256 kb | no | 1 | EAR99 | 1 | 85mA | e0 | DUAL | J BEND | 225 | 3.3V | 28 | COMMERCIAL | 30 | SRAMs | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 20 ns | 15b | 32KX8 | 8 | 0.002A | 8b | Asynchronous | COMMON | 3V | YES | |||||||||||||||||||||||||||||||||||||
| IDT71V416S12Y8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416s12y8-datasheets-4495.pdf | 28.575mm | 10.16mm | 44 | 44 | Parallel | no | 1 | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 44 | COMMERCIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.18mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 256KX16 | 16 | 4194304 bit | 0.02A | 12 ns | COMMON | 3V | YES | ||||||||||||||||||||||||||||||||||
| THGBMDG5D1LBAIT | Toshiba | $9.02 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 85°C | -25°C | 52MHz | RoHS Compliant | 2016 | https://pdf.utmel.com/r/datasheets/toshiba-thgbmdg5d1lbait-datasheets-4449.pdf | 131 Weeks | MMC | yes | FLASH, NAND | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71V35761SA200BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761sa200bg8-datasheets-4442.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 360mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | COMMERCIAL | 20 | SRAMs | 512kB | RAM, SDR, SRAM | 200MHz | 3-STATE | 3.1 ns | 17b | 0.03A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||||||
| MX29LV800CTTI-90G | Macronix |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | ASYNCHRONOUS | 1.2mm | RoHS Compliant | TFSOP | 8mm | 6mm | 48 | Parallel | yes | 3A991.B.1.A | 8542.32.00.51 | 1 | e6 | TIN BISMUTH | YES | BOTTOM | BALL | 260 | 3V | 0.8mm | 48 | INDUSTRIAL | 3.6V | 2.7V | 40 | Flash Memories | 3/3.3V | 0.03mA | Not Qualified | R-PBGA-B48 | FLASH, NOR | 3V | 8MX16 | 16 | 134217728 bit | 8 | 0.000005A | 90 ns | YES | YES | 12115 | 16K8K32K64K | YES | TOP | |||||||||||||||||||||||||||||||||
| 70V657S12BFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v657s12bfi-datasheets-4432.pdf | 15mm | 15mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 1.1 Mb | no | 1.4mm | 2 | No | 1 | 515mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | INDUSTRIAL | 20 | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 30b | 0.015A | 36b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||||||
| IDT7164S35YG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.556mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt7164s35yg8-datasheets-4427.pdf | 17.9324mm | 7.5184mm | 28 | 28 | Parallel | EAR99 | unknown | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | J BEND | 260 | 5V | 1.27mm | 28 | INDUSTRIAL | 5.5V | 4.5V | 40 | SRAMs | 5V | 0.09mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 8KX8 | 8 | 65536 bit | 0.015A | 35 ns | COMMON | 4.5V | |||||||||||||||||||||||||||||||||||||
| IDT71V416YS10PHI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Rail/Tube | 3 (168 Hours) | 85°C | -40°C | CMOS | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416ys10phi-datasheets-4411.pdf | TSOP | 3.3V | 44 | 3.6V | 3V | 44 | Parallel | 4 Mb | 1 | not_compliant | 200mA | e0 | DUAL | GULL WING | 3.3V | 0.8mm | INDUSTRIAL | SRAMs | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 10 ns | 18b | 16 | 0.02A | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||
| 71V2556S150PFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 85°C | -40°C | CMOS | 150MHz | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v2556s150pfgi8-datasheets-4412.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | FLAT | 260 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 30 | SRAMs | 0.335mA | 512kB | RAM, SDR, SRAM | 150MHz | 3-STATE | 3.8 ns | 17b | 0.045A | COMMON | |||||||||||||||||||||||||||||||||
| IDT71V3578S150PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 150MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3578s150pfi8-datasheets-4405.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.305mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 256KX18 | 18 | 4718592 bit | 0.035A | 3.8 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||
| 71V65803S133BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 2.36mm | RoHS Compliant | 2005 | /files/integrateddevicetechnology-71v65803s133bg8-datasheets-4398.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 9 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 300mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 4.2 ns | 19b | 0.04A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||||||||
| 7130SA55P | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 1 (Unlimited) | 70°C | 0°C | CMOS | 5.08mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130sa55p-datasheets-4399.pdf | PDIP | 61.7mm | 15.24mm | 5V | Contains Lead | 48 | 5.5V | 4.5V | 48 | Parallel | 8 kb | no | 3.8mm | 2 | EAR99 | No | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | DUAL | 245 | 5V | 48 | COMMERCIAL | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 20b | 1KX8 | 0.015A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||||||
| 7015L12JG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7015l12jg8-datasheets-4332.pdf | PLCC | 24mm | 24mm | 5V | Lead Free | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 72 kb | yes | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 275mA | e3 | MATTE TIN | QUAD | J BEND | 260 | 5V | 68 | COMMERCIAL | 9kB | RAM, SDR, SRAM | 12 ns | 13b | 8KX9 | 9b | Asynchronous | ||||||||||||||||||||||||||||||||||||
| 7007S20G | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7007s20g-datasheets-4333.pdf | 29.46mm | 29.46mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 256 kb | no | 3.68mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 315mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 240 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 32kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 30b | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||||
| 71V2556S150PFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 85°C | -40°C | CMOS | 150MHz | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v2556s150pfgi-datasheets-4320.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | FLAT | 260 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 30 | SRAMs | 0.335mA | 512kB | RAM, SDR, SRAM | 150MHz | 3-STATE | 3.8 ns | 17b | 0.045A | COMMON | |||||||||||||||||||||||||||||||||
| IDT71V3578S150PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 150MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3578s150pfi-datasheets-4302.pdf | LQFP | 20mm | 14mm | 100 | Parallel | no | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.305mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 256KX18 | 18 | 4718592 bit | 0.035A | 3.8 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||
| 7006S17PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7006s17pf-datasheets-4282.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 128 kb | 1.4mm | 2 | No | 310mA | 16kB | RAM, SDR, SRAM | 17 ns | 26b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71V65603S150BQG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 150MHz | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65603s150bqg8-datasheets-4232.pdf | 15mm | 13mm | 3.3V | Lead Free | 165 | 12 Weeks | 3.465V | 3.135V | 165 | Parallel | 9 Mb | yes | 1.2mm | 1 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 165 | COMMERCIAL | 30 | SRAMs | 0.325mA | 1.1MB | RAM, SDR, SRAM | 150MHz | 3-STATE | 6.7 ns | 18b | 256KX36 | 0.04A | COMMON | ||||||||||||||||||||||||||||||||||
| 70V3569S5BC8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | 1.5mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3569s5bc8-datasheets-4231.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 576 kb | no | 1.4mm | 2 | PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE | No | 1 | 360mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 5 ns | 28b | 16KX36 | 0.015A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||||||
| 71V124SA10PHGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v124sa10phgi-datasheets-4230.pdf | SOIC | 20.95mm | 10.16mm | 3.3V | Lead Free | 32 | 7 Weeks | 3.6V | 3.15V | 32 | Parallel | 1 Mb | yes | 1mm | 1 | 1 | 150mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 32 | INDUSTRIAL | 30 | SRAMs | Not Qualified | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 10 ns | 17b | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||||||||
| 70T631S12BCI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t631s12bci-datasheets-4226.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 4 Mb | no | 1.4mm | 2 | No | 1 | 395mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | INDUSTRIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 36b | 18b | Asynchronous | COMMON |
