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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 71V547S100PFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 66.6MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v547s100pfgi-datasheets-3853.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | FLOW-THROUGH | 1 | 210mA | e3 | Matte Tin (Sn) - annealed | QUAD | FLAT | 260 | 3.3V | 0.635mm | 100 | INDUSTRIAL | 30 | SRAMs | Not Qualified | 576kB | RAM, SDR, SRAM | 66MHz | 3-STATE | 10 ns | 17b | 0.045A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| 70V07L25PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v07l25pfg-datasheets-3839.pdf | TQFP | 14mm | 14mm | 3.3V | Lead Free | 80 | 7 Weeks | 3.6V | 3V | 80 | Parallel | 256 kb | yes | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 140mA | e3 | Matte Tin (Sn) - annealed | QUAD | FLAT | 260 | 3.3V | 0.65mm | 80 | COMMERCIAL | 30 | SRAMs | 32kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 30b | 0.003A | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||
| 7130SA100J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 1997 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130sa100j-datasheets-3831.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 8 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 100 ns | 20b | 1KX8 | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||
| 71V2556SA133BGG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 2.36mm | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v2556sa133bgg-datasheets-3793.pdf | BGA | 22mm | 3.3V | 119 | 119 | Parallel | 4.5 Mb | yes | 1 | PIPELINED ARCHITECTURE | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 119 | COMMERCIAL | 3.465V | 30 | SRAMs | 0.3mA | RAM, SRAM | 3-STATE | 17b | 36 | 0.04A | 4.2 ns | COMMON | ||||||||||||||||||||||||||||||||
| 7133LA20J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7133la20j-datasheets-3774.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 32 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 280mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 22b | 0.0015A | 16b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||||
| 7130LA55PDGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 85°C | -40°C | CMOS | 5.08mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130la55pdgi-datasheets-3745.pdf | PDIP | 61.7mm | 15.24mm | 5V | Lead Free | 48 | 7 Weeks | 5.5V | 4.5V | 48 | Parallel | 8 kb | yes | 3.8mm | 2 | EAR99 | No | 1 | 140mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 5V | 48 | INDUSTRIAL | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 20b | 1KX8 | 0.004A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||
| 71V65703S75BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65703s75bq-datasheets-3713.pdf | 15mm | 13mm | 3.3V | Contains Lead | 165 | 7 Weeks | 3.465V | 3.135V | 165 | Parallel | 9 Mb | no | 1.2mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 275mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 165 | COMMERCIAL | 20 | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 7.5 ns | 18b | 256KX36 | 0.04A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||
| 70V3399S166BFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3399s166bfg8-datasheets-3711.pdf | 3.3V | 500mA | 208 | 16 Weeks | 3.45V | 3.15V | 208 | Parallel | 2.3 Mb | yes | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 208 | COMMERCIAL | 30 | SRAMs | 256kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.6 ns | 34b | 18 | 0.03A | COMMON | ||||||||||||||||||||||||||||||
| 70V25S25J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v25s25j-datasheets-3674.pdf | PLCC | 29.21mm | 29.21mm | 3.3V | Contains Lead | 84 | 7 Weeks | 3.6V | 3V | 84 | Parallel | 128 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 190mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 84 | COMMERCIAL | SRAMs | 16kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 26b | 8KX16 | 0.005A | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||
| 71V3559S80BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 95MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3559s80bg-datasheets-3611.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | No | 250mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | COMMERCIAL | SRAMs | 512kB | RAM, SDR, SRAM | 100MHz | 3-STATE | 8 ns | 18b | 0.04A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||||
| 7134SA55L48B | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 1999 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7134sa55l48b-datasheets-3586.pdf | LCC | 14.2mm | 14.22mm | 5V | Contains Lead | 48 | 5.5V | 4.5V | 48 | Parallel | 32 kb | no | 1.78mm | 2 | AUTOMATIC POWER-DOWN | No | 1 | 270mA | e0 | Tin/Lead (Sn/Pb) | QUAD | 240 | 5V | 1mm | 48 | MILITARY | SRAMs | 5V | 38535Q/M;38534H;883B | RAM, SRAM | 3-STATE | 55 ns | 24b | 4KX8 | 0.03A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||
| 70V3399S166BFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3399s166bfg-datasheets-3576.pdf | 15mm | 3.3V | 208 | 16 Weeks | 3.45V | 3.15V | 208 | Parallel | 2.3 Mb | yes | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 208 | COMMERCIAL | 30 | SRAMs | 0.5mA | 256kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.6 ns | 34b | 18 | 0.03A | COMMON | ||||||||||||||||||||||||||||
| 7130SA100PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130sa100pf8-datasheets-3570.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 8 kb | 1.4mm | 2 | No | 155mA | 1kB | RAM, SDR, SRAM | 100 ns | 10b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V3577YS85PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3577ys85pfi8-datasheets-3573.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.19mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 87MHz | 128KX36 | 36 | 4718592 bit | 0.035A | 8.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
| 71V3556SA150BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | 150MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3556sa150bq8-datasheets-3561.pdf | 15mm | 13mm | 3.3V | Contains Lead | 11 Weeks | 165 | Parallel | 4.5 Mb | no | 1.2mm | 1 | No | e0 | Tin/Lead (Sn/Pb) | 225 | 165 | RAM, SRAM | 17b | |||||||||||||||||||||||||||||||||||||||||||||||
| 71V256S10YG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 70°C | 0°C | RoHS Compliant | 3.3V | 7 Weeks | 28 | Parallel | 256 kb | 1 | No | RAM, SRAM - Asynchronous | 15b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71V432S6PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 83MHz | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v432s6pfg8-datasheets-3546.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 3.63V | 3.135V | 100 | Parallel | 1 Mb | yes | 1.4mm | 1 | No | 1 | 180mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM | 83MHz | 3-STATE | 6 ns | 15b | 32KX32 | 32b | Synchronous | COMMON | ||||||||||||||||||||||||||
| 70V07L35PFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v07l35pfgi-datasheets-3496.pdf | TQFP | 14mm | 14mm | 3.3V | Lead Free | 80 | 7 Weeks | 3.6V | 3V | 80 | Parallel | 256 kb | yes | 1.4mm | 2 | EAR99 | No | 1 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 3.3V | 0.635mm | 80 | INDUSTRIAL | SRAMs | 0.155mA | 32kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 15b | 0.003A | COMMON | 3V | |||||||||||||||||||||||||||
| 70V3399S133BFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | RoHS Compliant | 2014 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3399s133bfgi8-datasheets-3495.pdf | 3.3V | 208 | 208 | Parallel | 2.3 Mb | yes | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 0.8mm | INDUSTRIAL | 3.45V | 3.15V | 30 | SRAMs | 0.48mA | RAM, SRAM | 3-STATE | 34b | 18 | 0.04A | COMMON | 3.15V | ||||||||||||||||||||||||||||||||||
| IDT71V3577YS85PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3577ys85pfi-datasheets-3468.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.19mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 87MHz | 128KX36 | 36 | 4718592 bit | 0.035A | 8.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| 70T3519S166BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 50MHz | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3519s166bc-datasheets-3408.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 9 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 450mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | COMMERCIAL | 20 | SRAMs | 1.1MB | RAM, SDR, SRAM | 166MHz | 3-STATE | 12 ns | 36b | 0.015A | 36b | Synchronous | COMMON | |||||||||||||||||||||||
| 7130LA35P | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 70°C | 0°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130la35p-datasheets-3407.pdf | PDIP | 61.7mm | 15.24mm | 5V | Contains Lead | 5.5V | 4.5V | 48 | Parallel | 8 kb | 3.8mm | 2 | No | 120mA | 1kB | RAM, SDR, SRAM | 35 ns | 20b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V3577YS85PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | Non-RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3577ys85pf8-datasheets-3380.pdf | LQFP | 100 | Parallel | not_compliant | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 3.3V | 0.635mm | COMMERCIAL | SRAMs | 3.3V | 0.18mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 87MHz | 128KX36 | 36 | 4718592 bit | 0.03A | 8.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||||||
| 70V3399S133BFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 1.7mm | RoHS Compliant | 2014 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3399s133bfgi-datasheets-3357.pdf | 15mm | 3.3V | 208 | 16 Weeks | 208 | Parallel | 2.3 Mb | yes | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 208 | INDUSTRIAL | 3.45V | 3.15V | 30 | SRAMs | 0.48mA | RAM, SRAM | 3-STATE | 34b | 18 | 0.04A | COMMON | 3.15V | ||||||||||||||||||||||||||||||
| 7130LA25PFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 85°C | -40°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130la25pfgi8-datasheets-3294.pdf | TQFP | 14mm | 14mm | 5V | Lead Free | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 8 kb | 1.4mm | 2 | No | 1kB | RAM, SDR, SRAM | 25 ns | 20b | |||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V3577YS85PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3577ys85pf-datasheets-3264.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.18mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 87MHz | 128KX36 | 36 | 4718592 bit | 0.03A | 8.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| IDT7164S20TPI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt7164s20tpi-datasheets-3257.pdf | DIP | Parallel | RAM, SRAM - Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71256SA12YG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 70°C | 0°C | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71256sa12yg8-datasheets-3256.pdf | 17.9mm | 7.6mm | 5V | Lead Free | 12 Weeks | 5.5V | 4.5V | 28 | Parallel | 256 kb | 2.67mm | 1 | No | 160mA | 32kB | RAM, SDR, SRAM - Asynchronous | 12 ns | 15b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||
| 70P3519S166BCG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p3519s166bcg8-datasheets-3250.pdf | 17mm | 17mm | 1.8V | Lead Free | 256 | 256 | Parallel | 9 Mb | yes | 1.4mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 2.5V | 1mm | 256 | COMMERCIAL | RAM, SRAM | 18b | |||||||||||||||||||||||||||||||||||||
| 71256S70TDB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 125°C | -55°C | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71256s70tdb-datasheets-3239.pdf | CDIP | 37.72mm | 7.62mm | 5V | Contains Lead | 10 Weeks | 5.5V | 4.5V | 28 | Parallel | 256 kb | 3.56mm | 1 | No | 135mA | RAM, SRAM - Asynchronous | 70 ns | 15b | 8b | Asynchronous |
