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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Voltage | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min |
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| 7130LA25PFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.6mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130la25pfgi-datasheets-3225.pdf | TQFP | 14mm | 14mm | 5V | Lead Free | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 8 kb | yes | 1.4mm | 2 | EAR99 | No | 1 | 220mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 5V | 0.8mm | 64 | INDUSTRIAL | 30 | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 20b | 1KX8 | 0.004A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||
| 70T3319S133BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 1.5mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3319s133bc-datasheets-3201.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 4 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 370mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | COMMERCIAL | 20 | SRAMs | 512kB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 18b | 0.015A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||
| 7140SA100PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 70°C | 0°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7140sa100pf8-datasheets-3183.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 8 kb | 1.4mm | 2 | No | 155mA | RAM, SRAM | 100 ns | 10b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||
| IDT7164LS20Y8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt7164ls20y8-datasheets-3167.pdf | 28 | Parallel | RAM, SRAM - Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71016S15PHI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Rail/Tube | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71016s15phi-datasheets-3143.pdf | TSOP | 5V | 44 | 5.5V | 4.5V | 44 | Parallel | 1 Mb | no | 1 | EAR99 | 1 | 180mA | e0 | 5V | DUAL | GULL WING | 225 | 5V | 0.8mm | 44 | INDUSTRIAL | 20 | SRAMs | 5V | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 15 ns | 16b | 16 | 16b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||||
| 7034L20PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2001 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7034l20pf8-datasheets-3145.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 72 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 9kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 12b | 4KX18 | 0.0015A | 18b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||
| IDT71V3577YS80PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3577ys80pfi8-datasheets-3141.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.21mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 100MHz | 128KX36 | 36 | 4718592 bit | 0.035A | 8 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| 71024S12TYGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.759mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71024s12tygi-datasheets-3112.pdf | 21.95mm | 7.6mm | 5V | Lead Free | 32 | 7 Weeks | 5.5V | 4.5V | 32 | Parallel | 1 Mb | yes | 2.67mm | 1 | No | 1 | 160mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 5V | 32 | INDUSTRIAL | 30 | SRAMs | 5V | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 12 ns | 17b | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||||
| 7130LA20TFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130la20tfg8-datasheets-3100.pdf | TQFP | 10mm | 10mm | 5V | Lead Free | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 8 kb | 1.4mm | 2 | No | 200mA | 1kB | RAM, SDR, SRAM | 20 ns | 10b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||
| 71V3556SA166BGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3556sa166bgi8-datasheets-3097.pdf | BGA | 14mm | 2.15mm | 22mm | 3.3V | Contains Lead | 360mA | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | No | 1 | 360mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | INDUSTRIAL | 20 | SRAMs | 512kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.5 ns | 17b | 0.045A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||
| 71V256S12YG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 70°C | 0°C | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v256s12yg-datasheets-3079.pdf | 3.3V | 7 Weeks | 28 | Parallel | 256 kb | 1 | No | RAM, SRAM - Asynchronous | 15b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V3577YS80PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3577ys80pfi-datasheets-3076.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.21mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 100MHz | 128KX36 | 36 | 4718592 bit | 0.035A | 8 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||
| IDT7164LS20Y | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 70°C | 0°C | CMOS | 3.556mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt7164ls20y-datasheets-3037.pdf | 17.9324mm | 7.5184mm | 28 | 28 | Parallel | yes | EAR99 | 8542.32.00.41 | 1 | e3 | MATTE TIN | YES | DUAL | J BEND | 260 | 5V | 1.27mm | 28 | COMMERCIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.17mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 8KX8 | 8 | 65536 bit | 0.00006A | 19 ns | COMMON | 2V | |||||||||||||||||||||||||||||||||
| 70T3339S133BFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3339s133bfi-datasheets-3036.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 9 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 450mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | INDUSTRIAL | SRAMs | 1.1MB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 38b | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||||
| 7130LA20TFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130la20tfg-datasheets-3030.pdf | TQFP | 10mm | 10mm | 5V | Lead Free | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 8 kb | 1.4mm | 2 | No | 200mA | 1kB | RAM, SDR, SRAM | 20 ns | 20b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||
| 71V016SA15YGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v016sa15ygi8-datasheets-2994.pdf | 28.6mm | 10.2mm | 3.3V | Lead Free | 44 | 12 Weeks | 3.6V | 3V | 44 | Parallel | 1 Mb | yes | 2.9mm | 1 | No | 1 | 130mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 44 | INDUSTRIAL | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 15 ns | 16b | 16b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||||||
| 71V3577S75BGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | 117MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3577s75bgi-datasheets-2993.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | No | e0 | Tin/Lead (Sn63Pb37) | 225 | 119 | 512kB | RAM, SDR, SRAM | 117MHz | 7.5 ns | 17b | 36b | Synchronous | ||||||||||||||||||||||||||||||||||||||||
| 70V35L15PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v35l15pfg8-datasheets-2983.pdf | TQFP | 14mm | 14mm | 3.3V | Lead Free | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 144 kb | yes | 1.4mm | 2 | EAR99 | No | 1 | 185mA | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 100 | COMMERCIAL | 18kB | RAM, SDR, SRAM | 15 ns | 26b | 8KX18 | 18b | Asynchronous | ||||||||||||||||||||||||||||||
| IDT71124S12YGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71124s12ygi-datasheets-2978.pdf | 20.955mm | 10.16mm | 32 | 32 | Parallel | 3A991.B.2.B | unknown | 1 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | J BEND | 260 | 5V | 1.27mm | 32 | INDUSTRIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.16mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 128KX8 | 8 | 1048576 bit | 0.01A | 12 ns | COMMON | 4.5V | |||||||||||||||||||||||||||||||||
| 7025S55FB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 125°C | -55°C | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7025s55fb-datasheets-2954.pdf | 29.2mm | 29.21mm | 5V | Contains Lead | 10 Weeks | 5.5V | 4.5V | 84 | Parallel | 128 kb | 2.54mm | 2 | No | 300mA | RAM, SRAM | 55 ns | 26b | 16b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||
| IDT7164L35YGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.556mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt7164l35ygi8-datasheets-2936.pdf | 17.9324mm | 7.5184mm | 28 | 28 | Parallel | EAR99 | unknown | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | J BEND | 260 | 5V | 1.27mm | 28 | INDUSTRIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.08mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 8KX8 | 8 | 65536 bit | 0.00006A | 35 ns | COMMON | 2V | |||||||||||||||||||||||||||||||
| IDT71V3577YS80PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3577ys80pf8-datasheets-2933.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.2mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 100MHz | 128KX36 | 36 | 4718592 bit | 0.03A | 8 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| 71V30L35TFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v30l35tfgi-datasheets-2922.pdf | LQFP | 10mm | 10mm | 3.3V | Lead Free | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 8 kb | yes | 1.4mm | 2 | EAR99 | No | 1 | 145mA | e3 | Matte Tin (Sn) - annealed | QUAD | FLAT | 260 | 3.3V | 0.5mm | 64 | INDUSTRIAL | 30 | SRAMs | 1kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 20b | 1KX8 | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||
| 7140SA35JI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 4.57mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7140sa35ji-datasheets-2909.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 8 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 230mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | INDUSTRIAL | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 20b | 1KX8 | 0.08A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||
| 70V631S10BF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v631s10bf-datasheets-2888.pdf | 15mm | 15mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 4.5 Mb | no | 1.4mm | 2 | No | 1 | 500mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | COMMERCIAL | 20 | SRAMs | 512kB | RAM, SDR, SRAM | 3-STATE | 10 ns | 18b | 0.015A | 18b | Asynchronous | COMMON | ||||||||||||||||||||||||||||
| 7052L30GB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | 5.207mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7052l30gb-datasheets-2854.pdf | 30.48mm | 30.48mm | 5V | Contains Lead | 108 | 10 Weeks | 108 | Parallel | 16 kb | no | 3.68mm | 4 | 3A001.A.2.C | AUTOMATIC POWER-DOWN | No | 1 | e0 | Tin/Lead (Sn/Pb) | NO | PERPENDICULAR | PIN/PEG | 240 | 5V | 108 | MILITARY | SRAMs | 5V | 0.335mA | RAM, SRAM | 3-STATE | 11b | 2KX8 | 0.0018A | 30 ns | COMMON | 2V | |||||||||||||||||||||||||||||
| 7140LA100PDG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | 70°C | 0°C | CMOS | ASYNCHRONOUS | 5.08mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7140la100pdg-datasheets-2845.pdf | DIP | 61.7mm | 15.24mm | Lead Free | 48 | 7 Weeks | 48 | Parallel | yes | 3.8mm | 2 | EAR99 | 8542.32.00.41 | 1 | e3 | MATTE TIN | NO | DUAL | THROUGH-HOLE | 260 | 5V | 2.54mm | 48 | COMMERCIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.11mA | Not Qualified | RAM, SRAM | 3-STATE | 1KX8 | 8192 bit | 0.0015A | 100 ns | COMMON | 2V | ||||||||||||||||||||||||||
| IDT71P74804S167BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 167MHz | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p74804s167bq-datasheets-2842.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1.8V | 1mm | 165 | COMMERCIAL | 1.9V | 1.7V | 20 | SRAMs | 1.5/1.81.8V | 0.65mA | Not Qualified | QDR, RAM, SRAM | 3-STATE | 1MX18 | 18 | 18874368 bit | 0.3A | 0.5 ns | SEPARATE | 1.7V | |||||||||||||||||||||||||||||
| IDT71V67602S150BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 150MHz | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67602s150bq-datasheets-2829.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1mm | 165 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 2.53.3V | 0.325mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.05A | 3.8 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||
| 7164S25YG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.556mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7164s25yg8-datasheets-2796.pdf | 17.9mm | 7.6mm | 5V | Lead Free | 28 | 7 Weeks | 5.5V | 4.5V | 28 | Parallel | 64 kb | yes | 2.67mm | 1 | EAR99 | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | J BEND | 260 | 5V | 28 | COMMERCIAL | 8kB | RAM, SDR, SRAM - Asynchronous | 25 ns | 13b | 8KX8 |
