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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Alternate Memory Width | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | Data Polling | Toggle Bit | Number of Sectors/Size | Sector Size | Ready/Busy | Boot Block | I/O Type | Standby Voltage-Min |
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| 7024L25J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7024l25j8-datasheets-2114.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 64 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 24b | 4KX16 | 0.0015A | COMMON | 2V | |||||||||||||||||||||||||||||||||
| 7025L35PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7025l35pf-datasheets-2101.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 128 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 210mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 26b | 8KX16 | 0.0015A | 16b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||||||
| IDT71V424L10PHI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v424l10phi-datasheets-2086.pdf | TSOP | Parallel | RAM, SRAM - Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7024S55GB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2000 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7024s55gb-datasheets-2075.pdf | 27.94mm | 27.94mm | 5V | Contains Lead | 84 | 10 Weeks | 5.5V | 4.5V | 84 | Parallel | 64 kb | no | 3.68mm | 2 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | e0 | Tin/Lead (Sn/Pb) | NO | PERPENDICULAR | PIN/PEG | 240 | 5V | 84 | MILITARY | 20 | SRAMs | 5V | 0.3mA | 38535Q/M;38534H;883B | 8kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 24b | 4KX16 | 0.03A | COMMON | |||||||||||||||||||||||||||||||||
| 70V7599S133BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v7599s133bc-datasheets-2066.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 4.5 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 645mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | 512kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 17b | 0.03A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||||||
| 70T659S12BFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t659s12bfi-datasheets-2062.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 4.5 Mb | no | 1.4mm | 2 | No | 1 | 395mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | INDUSTRIAL | SRAMs | 512kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 34b | 36b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||||||||
| 70T659S10BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t659s10bc-datasheets-2006.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 4.5 Mb | no | 1.4mm | 2 | No | 1 | 405mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 10 ns | 34b | 0.01A | 36b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||||||
| IDT71V3577SA85BQI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3577sa85bqi8-datasheets-1995.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 3.3V | 1mm | 165 | INDUSTRIAL | 3.465V | 3.135V | SRAMs | 3.3V | 0.19mA | Not Qualified | RAM, SRAM | 3-STATE | 87MHz | 128KX36 | 36 | 4718592 bit | 0.035A | 8.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||||
| 70T659S12BFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t659s12bfi8-datasheets-1956.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 4.5 Mb | no | 1.4mm | 2 | No | 1 | 395mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | INDUSTRIAL | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 34b | 36b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||||||||
| MX29SL800CTTI-90G | Macronix |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | CMOS | ASYNCHRONOUS | 1.2mm | RoHS Compliant | TFSOP | 18.4mm | 12mm | 1.8V | Lead Free | 48 | Parallel | 8 Mb | EAR99 | unknown | 8542.32.00.51 | 1 | YES | DUAL | GULL WING | NOT SPECIFIED | 1.8V | 0.5mm | 48 | INDUSTRIAL | 2.2V | 1.65V | NOT SPECIFIED | Flash Memories | 1.8/2V | 0.025mA | Not Qualified | R-PDSO-G48 | FLASH, NOR | 90 ns | 512KX16 | 16 | 8 | 0.000005A | YES | YES | 12115 | 16K8K32K64K | YES | TOP | |||||||||||||||||||||||||||||||||||
| IDT7164L20TPI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt7164l20tpi-datasheets-1937.pdf | DIP | Parallel | RAM, SRAM - Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7006S55GB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7006s55gb-datasheets-1916.pdf | 29.46mm | 29.46mm | 5V | Contains Lead | 68 | 5.5V | 4.5V | 68 | Parallel | 128 kb | no | 3.68mm | 2 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 300mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 240 | 5V | 68 | MILITARY | SRAMs | 5V | MIL-PRF-38535 | 16kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 28b | 16KX8 | 0.03A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||||
| 70T633S12BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t633s12bc-datasheets-1913.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 9 Mb | no | 1.4mm | 2 | No | 1 | 355mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | COMMERCIAL | 20 | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 12 ns | 38b | 0.01A | 18b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||||
| IDT71V3577SA85BQI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3577sa85bqi-datasheets-1910.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1mm | 165 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.19mA | Not Qualified | RAM, SRAM | 3-STATE | 87MHz | 128KX36 | 36 | 4718592 bit | 0.035A | 8.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||
| 71V2546S133BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v2546s133bg8-datasheets-1848.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 300mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 4.2 ns | 17b | 0.04A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||||||
| 7005L15PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005l15pf-datasheets-1810.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 64 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 26b | 8KX8 | 0.0015A | COMMON | 2V | |||||||||||||||||||||||||||||||
| 7005L25GB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 125°C | -55°C | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005l25gb-datasheets-1804.pdf | 29.46mm | 29.46mm | 5V | Contains Lead | 10 Weeks | 5.5V | 4.5V | 68 | Parallel | 64 kb | 3.68mm | 2 | No | 8kB | RAM, SDR, SRAM | 25 ns | 26b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V3577SA85BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3577sa85bq8-datasheets-1803.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 3.3V | 1mm | 165 | COMMERCIAL | 3.465V | 3.135V | SRAMs | 3.3V | 0.18mA | Not Qualified | RAM, SRAM | 3-STATE | 87MHz | 128KX36 | 36 | 4718592 bit | 0.03A | 8.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||||
| 7140LA35J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7140la35j-datasheets-1789.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 8 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 120mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 20b | 1KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||||||||
| 7132LA100PDG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | 70°C | 0°C | CMOS | ASYNCHRONOUS | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7132la100pdg-datasheets-1755.pdf | DIP | 61.7mm | 15.24mm | Lead Free | 48 | 7 Weeks | 48 | Parallel | yes | 3.8mm | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) | NO | DUAL | THROUGH-HOLE | 260 | 5V | 48 | COMMERCIAL | 5.5V | 4.5V | NOT SPECIFIED | RAM, SRAM | 2KX8 | 16384 bit | 100 ns | ||||||||||||||||||||||||||||||||||||||||||||
| 7133LA25PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7133la25pfi-datasheets-1747.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 32 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 300mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | INDUSTRIAL | 20 | SRAMs | 5V | 4kB | SDR | 3-STATE | 25 ns | 22b | 0.004A | 16b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||||||||
| 71V35761SA183BQG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 183MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761sa183bqg-datasheets-1727.pdf | FBGA | 15mm | 13mm | 3.3V | Lead Free | 165 | 11 Weeks | 3.465V | 3.135V | 165 | Parallel | 4.5 Mb | yes | 1.2mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 340mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 165 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 183MHz | 3-STATE | 3.3 ns | 17b | 0.03A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||||||
| IDT71V424S10YI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Rail/Tube | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v424s10yi-datasheets-1698.pdf | 23.495mm | 3.3V | 36 | 3.6V | 3V | 36 | Parallel | 4 Mb | 1 | not_compliant | 1 | 180mA | e0 | DUAL | J BEND | 225 | 3.3V | 36 | INDUSTRIAL | 30 | SRAMs | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 10 ns | 19b | 8 | 0.02A | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||
| IDT70V7339S166DDI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 4 (72 Hours) | 85°C | -40°C | CMOS | 166MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt70v7339s166ddi-datasheets-1688.pdf | TQFP | 20mm | 20mm | 144 | Parallel | 2 | 3A991.B.2.A | FLOW-THROUGH OR PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 144 | INDUSTRIAL | 3.45V | 3.15V | 30 | SRAMs | 2.5/3.33.3V | 0.83mA | Not Qualified | S-PQFP-G144 | RAM, SRAM | 3-STATE | 512KX18 | 18 | 9437184 bit | 0.04A | 12 ns | COMMON | 3.15V | |||||||||||||||||||||||||||||||||
| IDT71V67602S150BGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 150MHz | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67602s150bgi8-datasheets-1683.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | INDUSTRIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 2.53.3V | 0.325mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.05A | 3.8 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||
| 70V5388S100BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v5388s100bg-datasheets-1612.pdf | BGA | 27mm | 27mm | 3.3V | Contains Lead | 272 | 3.45V | 3.15V | 272 | Parallel | 1.1 Mb | no | 2mm | 4 | 3A991.B.2.A | PIPELINED ARCHITECTURE | No | 1 | 240mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 272 | INDUSTRIAL | 20 | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 10 ns | 16b | 0.015A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||||||||||
| IDT71V3577SA85BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3577sa85bq-datasheets-1598.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1mm | 165 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.18mA | Not Qualified | RAM, SRAM | 3-STATE | 87MHz | 128KX36 | 36 | 4718592 bit | 0.03A | 8.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||
| THGBMHG9C4LBAIR | Toshiba |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 85°C | -25°C | CMOS | 52MHz | RoHS Compliant | 2016 | https://pdf.utmel.com/r/datasheets/toshiba-thgbmhg9c4lbair-datasheets-1565.pdf | 1mm | 3.3V | 153 | 145 Weeks | 3.6V | 1.7V | 153 | MMC | 64 Gb | yes | 1 | BOTTOM | BALL | OTHER | 64GB | FLASH, NAND | 64GX8 | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71V416L15BE | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 (72 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2014 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v416l15be-datasheets-1530.pdf | TFBGA | 9mm | 9mm | 3.3V | Contains Lead | 48 | 12 Weeks | 3.6V | 3V | 48 | Parallel | 4 Mb | no | 1.2mm | 1 | No | 1 | 160mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.75mm | 48 | COMMERCIAL | 20 | SRAMs | 512kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 15 ns | 18b | 16b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||||||||||
| IDT71V3577SA85BGG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | CMOS | SYNCHRONOUS | 2.36mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3577sa85bgg8-datasheets-1489.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | 8542.32.00.41 | 1 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 3.3V | 1.27mm | 119 | COMMERCIAL | 3.465V | 3.135V | Not Qualified | RAM, SRAM | 128KX36 | 36 | 4718592 bit | 8.5 ns |
