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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Voltage - Rated DC | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Voltage | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min |
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| 70V05S20J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v05s20j8-datasheets-8800.pdf | PLCC | 24mm | 24mm | 3.3V | Contains Lead | 68 | 7 Weeks | 3.6V | 3V | 68 | Parallel | 64 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 68 | COMMERCIAL | SRAMs | 8kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 26b | 8KX8 | 0.005A | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||
| 709269L9PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 70°C | 0°C | 40MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-709269l9pf-datasheets-8797.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 256 kb | 1.4mm | 2 | No | 350mA | 32kB | RAM, SDR, SRAM | 9 ns | 28b | 16b | Synchronous | |||||||||||||||||||||||||||||||||||||||||||
| 71321SA35TFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 1999 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71321sa35tfg8-datasheets-8785.pdf | LQFP | 10mm | 10mm | 5V | Lead Free | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 16 kb | yes | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | No | 1 | 165mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 5V | 0.5mm | 64 | COMMERCIAL | 30 | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 11b | 0.015A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||
| 7130LA20JG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130la20jg8-datasheets-8777.pdf | PLCC | 19mm | 19mm | 5V | Lead Free | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 8 kb | yes | 3.63mm | 2 | EAR99 | No | 1 | 200mA | e3 | Matte Tin (Sn) - annealed | QUAD | J BEND | 260 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 20b | 1KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||
| 6116LA25TPG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-6116la25tpg-datasheets-8767.pdf | PDIP | 31.75mm | 7.62mm | 5V | Lead Free | 24 | 7 Weeks | 5.5V | 4.5V | 24 | Parallel | 16 kb | yes | 3.3mm | 1 | EAR99 | No | 1 | 95mA | e3 | MATTE TIN | DUAL | 260 | 5V | 2.54mm | 24 | COMMERCIAL | SRAMs | 5V | 2kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 25 ns | 11b | 2KX8 | 0.00003A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||
| 71V3577S75BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 117MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3577s75bq-datasheets-8763.pdf | FBGA | 15mm | 13mm | 3.3V | Contains Lead | 165 | 11 Weeks | 3.465V | 3.135V | 165 | Parallel | 4.5 Mb | no | 1.2mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 255mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 165 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 7.5 ns | 17b | 0.03A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||
| 70V3589S133DRGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Through Hole | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 4.1mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3589s133drgi8-datasheets-8756.pdf | PQFP | 28mm | 28mm | 3.3V | Lead Free | 208 | 3.45V | 3.15V | 208 | Parallel | 2.3 Mb | yes | 3.5mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 208 | INDUSTRIAL | 30 | SRAMs | 0.48mA | 256kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 32b | 64KX36 | 0.04A | COMMON | ||||||||||||||||||||||||||
| 71V35761S166BGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 85°C | -40°C | 166MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761s166bgi8-datasheets-8700.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | No | 330mA | 119 | 512kB | RAM, SDR, SRAM | 166MHz | 3.5 ns | 17b | 36b | Synchronous | ||||||||||||||||||||||||||||||||||||||||||
| 71421SA55PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71421sa55pf-datasheets-8701.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | No | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 22b | 0.015A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||
| IDT71V35761SA200BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v35761sa200bq-datasheets-8695.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1mm | 165 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.36mA | Not Qualified | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.03A | 3.1 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| IDT71V2556S133PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v2556s133pfi-datasheets-8691.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 2.53.3V | 0.31mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.045A | 4.2 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
| 7024S25J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7024s25j-datasheets-8688.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 64 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 265mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 24b | 4KX16 | 0.015A | 16b | Asynchronous | COMMON | |||||||||||||||||||||||
| MT29F8G08ABACAM71M3WC1 | Micron |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | 70°C | 0°C | RoHS Compliant | 3.3V | Parallel | 8 Gb | 3.3V | NOT SPECIFIED | NOT SPECIFIED | FLASH, NAND | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 6116SA20SOG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-6116sa20sog-datasheets-8659.pdf | SOIC | 15.4mm | 7.6mm | 5V | Lead Free | 24 | 7 Weeks | 5.5V | 4.5V | 24 | Parallel | 16 kb | yes | 2.34mm | 1 | EAR99 | No | 1 | 105mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 5V | 24 | COMMERCIAL | 30 | SRAMs | 5V | 2kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 20 ns | 11b | 2KX8 | 0.002A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||
| 71V67803S166PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v67803s166pfg8-datasheets-8656.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 8 Weeks | 3.465V | 3.135V | 100 | Parallel | 9 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 340mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 3.5 ns | 19b | 0.05A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||
| 70T651S12BF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t651s12bf8-datasheets-8645.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 9 Mb | no | 1.4mm | 2 | No | 1 | 355mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 18b | 0.01A | 36b | Asynchronous | COMMON | |||||||||||||||||||||||||||
| 70125S35J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | ASYNCHRONOUS | 4.57mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70125s35j8-datasheets-4580.pdf | LCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 52 | Parallel | 18 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | NOT SPECIFIED | SRAMs | 5V | Not Qualified | RAM, SRAM | 3-STATE | 22b | 0.015A | 35 ns | COMMON | 2V | ||||||||||||||||||||||||||
| 71321SA35TFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71321sa35tfg-datasheets-4563.pdf | TQFP | 10mm | 10mm | 5V | Lead Free | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 16 kb | yes | 1.4mm | 2 | EAR99 | AUTOMATIC POWER DOWN | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | GULL WING | 260 | 5V | 0.5mm | 64 | COMMERCIAL | 30 | SRAMs | 5V | 0.165mA | 2kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 22b | 0.015A | COMMON | |||||||||||||||||||||||
| 7008S15J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008s15j8-datasheets-4566.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 512 kb | no | 3.63mm | 2 | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 0.365mA | 64kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 32b | 64KX8 | 0.015A | COMMON | |||||||||||||||||||||||||||
| 71T75602S166PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75602s166pfg8-datasheets-4558.pdf | TQFP | 20mm | 14mm | 2.5V | Lead Free | 100 | 8 Weeks | 2.625V | 2.375V | 100 | Parallel | 18 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 245mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 100 | INDUSTRIAL | 30 | SRAMs | 2.3MB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.5 ns | 19b | 0.04A | 36b | Synchronous | COMMON | 2.38V | ||||||||||||||||||||||
| 7130LA20J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130la20j8-datasheets-4533.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 8 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 20b | 1KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||
| 71321LA55TFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71321la55tfg8-datasheets-4400.pdf | LQFP | 10mm | 10mm | 5V | Lead Free | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 16 kb | yes | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | GULL WING | 260 | 5V | 0.5mm | 64 | COMMERCIAL | 30 | SRAMs | 5V | 0.11mA | 2kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 22b | 0.0015A | COMMON | 2V | |||||||||||||||||||||||
| 7027L35PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7027l35pf8-datasheets-4334.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | No | 1 | 255mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 15b | 0.015A | 16b | Asynchronous | COMMON | ||||||||||||||||||||||
| 71T75902S85BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 91MHz | 2.36mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75902s85bg8-datasheets-4286.pdf | BGA | 14mm | 22mm | 2.5V | Contains Lead | 119 | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | no | 2.15mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 225mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 119 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 8.5 ns | 20b | 0.04A | 18b | Synchronous | COMMON | 2.38V | |||||||||||||||||||||||
| 71321LA55TFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71321la55tfg-datasheets-4270.pdf | TQFP | 10mm | 10mm | 5V | Lead Free | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 16 kb | yes | 1.4mm | 2 | EAR99 | AUTOMATIC POWER DOWN | No | 1 | 110mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 5V | 0.5mm | 64 | COMMERCIAL | 30 | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 22b | 0.0015A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||
| 70T631S10BCI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.5mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t631s10bci8-datasheets-4158.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 4 Mb | no | 1.4mm | 2 | No | 1 | 445mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | INDUSTRIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 10 ns | 36b | 18b | Asynchronous | COMMON | |||||||||||||||||||||||||||
| 71V124SA12YGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v124sa12ygi8-datasheets-4136.pdf | 20.9mm | 10.2mm | 3.3V | Lead Free | 32 | 7 Weeks | 3.6V | 3V | 32 | Parallel | 1 Mb | yes | 2.2mm | 1 | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | J BEND | 260 | 3.3V | 32 | INDUSTRIAL | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 12 ns | 17b | COMMON | 3V | |||||||||||||||||||||||||||||||
| 7008L25PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008l25pf8-datasheets-4067.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | No | 1 | 265mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 32b | 64KX8 | 0.005A | 8b | Asynchronous | COMMON | |||||||||||||||||||||
| 7164L20TPG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Through Hole | Bulk | 70°C | 0°C | CMOS | 4.572mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7164l20tpg-datasheets-4052.pdf | PDIP | 5V | 28 | 5.5V | 4.5V | 28 | Parallel | 64 kb | yes | 1 | EAR99 | No | 1 | 90mA | e3 | Matte Tin (Sn) - annealed | DUAL | 5V | 2.54mm | 28 | COMMERCIAL | SRAMs | 5V | RAM, SRAM - Asynchronous | 3-STATE | 20 ns | 13b | 8KX8 | 8 | 0.00006A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||||||||
| 7024S20J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7024s20j-datasheets-4045.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 64 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 290mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 24b | 4KX16 | 0.015A | 16b | Asynchronous | COMMON |
