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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Address Bus Width | Organization | Memory Width | Memory Density | Parallel/Serial | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 71V3558SA133BQGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3558sa133bqgi-datasheets-2885.pdf | 15mm | 13mm | 3.3V | Lead Free | 165 | 11 Weeks | 3.465V | 3.135V | 165 | Parallel | 4.5 Mb | yes | 1.2mm | 1 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 165 | INDUSTRIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 18b | 0.045A | COMMON | |||||||||||||||||||||||||||||
| 71V3557S85BGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 91MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3557s85bgi-datasheets-2870.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 235mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | INDUSTRIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 8.5 ns | 17b | 0.045A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||
| 70V9269S12PRFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 85°C | -40°C | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9269s12prfgi-datasheets-2857.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 7 Weeks | 3.6V | 3V | 128 | Parallel | 256 kb | yes | 1.4mm | 2 | EAR99 | No | e3 | MATTE TIN | 260 | 128 | 32kB | RAM, SDR, SRAM | 12 ns | 28b | |||||||||||||||||||||||||||||||||||||||||
| 71V2546S133PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v2546s133pfg8-datasheets-2777.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 300mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 4.2 ns | 17b | 0.04A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| 7007L15JG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7007l15jg8-datasheets-2773.pdf | PLCC | 24mm | 24mm | 5V | Lead Free | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 256 kb | yes | 3.63mm | 2 | EAR99 | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | J BEND | 260 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 32kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 30b | 0.005A | COMMON | |||||||||||||||||||||||||||||
| IDT71V2558S166BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | SYNCHRONOUS | 2.36mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v2558s166bg-datasheets-7886.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | COMMERCIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 2.53.3V | 0.35mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX18 | 18 | 4718592 bit | 0.04A | 3.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||
| IDT71V256SA10PZ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v256sa10pz-datasheets-7883.pdf | TSSOP | 11.8mm | 8mm | 28 | Parallel | 1 | EAR99 | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | GULL WING | 240 | 3.3V | 0.55mm | 28 | COMMERCIAL | 3.6V | 3V | 20 | SRAMs | 3.3V | 0.1mA | Not Qualified | R-PDSO-G28 | RAM, SRAM - Asynchronous | 3-STATE | 32KX8 | 8 | 262144 bit | 0.002A | 10 ns | COMMON | 3V | YES | |||||||||||||||||||||||||||
| 71V3557S80BGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 95MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3557s80bgi-datasheets-2598.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 260mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | INDUSTRIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 8 ns | 17b | 0.045A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||
| 70V9269L12PRFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | 33.3MHz | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9269l12prfgi8-datasheets-2578.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 7 Weeks | 3.6V | 3V | 128 | Parallel | 256 kb | yes | 1.4mm | 2 | EAR99 | No | e3 | MATTE TIN | 260 | 128 | 32kB | RAM, SDR, SRAM | 12 ns | 28b | 16b | Synchronous | ||||||||||||||||||||||||||||||||||||||
| 71V632S6PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 83MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v632s6pfg8-datasheets-2579.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 3.63V | 3.135V | 100 | Parallel | 2 Mb | yes | 1.4mm | 1 | ALSO REQUIRES 3.3V I/O SUPPLY | No | 1 | 180mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 6 ns | 16b | 64KX32 | 32b | Synchronous | COMMON | |||||||||||||||||||||||||
| IDT71V35761SA183BQI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 85°C | -40°C | 183MHz | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v35761sa183bqi8-datasheets-7782.pdf | 165 | Parallel | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V3319S133PRF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3319s133prf8-datasheets-2491.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 128 | 7 Weeks | 3.45V | 3.15V | 128 | Parallel | 4.5 Mb | no | 1.4mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 400mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 36b | 0.03A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||
| 7025S55JI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 85°C | -40°C | CMOS | 4.57mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7025s55ji-datasheets-2447.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 128 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 300mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | INDUSTRIAL | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 26b | 8KX16 | 0.03A | 16b | Asynchronous | COMMON | ||||||||||||||||||||||||
| 71V016SA15BFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v016sa15bfi-datasheets-2355.pdf | 7mm | 7mm | 3.3V | Contains Lead | 48 | 12 Weeks | 3.6V | 3.15V | 48 | Parallel | 1 Mb | no | 1.4mm | 1 | No | 1 | 130mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.75mm | 48 | INDUSTRIAL | 20 | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 15 ns | 16b | 16b | Asynchronous | COMMON | ||||||||||||||||||||||||||||
| IDT71V416L10Y | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416l10y-datasheets-7704.pdf | 28.575mm | 10.16mm | 44 | 44 | Parallel | no | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 44 | COMMERCIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.18mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 256KX16 | 16 | 4194304 bit | 0.01A | 10 ns | COMMON | 3V | |||||||||||||||||||||||||||||
| 71V65903S85BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 91MHz | 2.36mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65903s85bg-datasheets-2264.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 9 Mb | no | 2.15mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 225mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | COMMERCIAL | 20 | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 8.5 ns | 19b | 0.04A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||
| 7025S55J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7025s55j8-datasheets-2263.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 128 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE | No | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 26b | 8KX16 | 0.015A | 16b | Asynchronous | COMMON | ||||||||||||||||||||||
| IDT71V67602S133BQI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67602s133bqi-datasheets-7688.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1mm | 165 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 2.53.3V | 0.28mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.07A | 4.2 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| 7006L55PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7006l55pf8-datasheets-2241.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 128 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 210mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 14b | 16KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||
| 71V321L35TF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v321l35tf-datasheets-2185.pdf | LQFP | 10mm | 10mm | 3.3V | Contains Lead | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 95mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 64 | COMMERCIAL | 20 | SRAMs | 2kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 22b | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||
| 70V3319S133BCI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3319s133bci8-datasheets-2079.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 4.5 Mb | no | 1.4mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 480mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | INDUSTRIAL | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 18b | 0.04A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||
| 71V65603S150BQGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 150MHz | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65603s150bqgi-datasheets-2076.pdf | 15mm | 13mm | 3.3V | Lead Free | 165 | 12 Weeks | 3.465V | 3.135V | 165 | Parallel | 9 Mb | yes | 1.2mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 345mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 165 | INDUSTRIAL | 30 | SRAMs | 1.1MB | RAM, SDR, SRAM | 150MHz | 3-STATE | 6.7 ns | 18b | 256KX36 | 0.06A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| 70V9269L12PRFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 85°C | -40°C | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9269l12prfgi-datasheets-2019.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 7 Weeks | 3.6V | 3V | 128 | Parallel | 256 kb | 1.4mm | 2 | No | 32kB | RAM, SDR, SRAM | 12 ns | 28b | ||||||||||||||||||||||||||||||||||||||||||||||||
| 70V631S10BCG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v631s10bcg-datasheets-2018.pdf | 17mm | 17mm | 3.3V | Lead Free | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 4.5 Mb | yes | 1.4mm | 2 | No | 1 | 500mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 1mm | 256 | COMMERCIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 10 ns | 36b | 0.015A | 18b | Asynchronous | COMMON | |||||||||||||||||||||||||||
| 7025S25PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7025s25pf8-datasheets-1976.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 128 kb | 1.4mm | 2 | No | 265mA | 16kB | RAM, SDR, SRAM | 25 ns | 26b | 16b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| IDT71V35761SA183BQI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 183MHz | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v35761sa183bqi-datasheets-7571.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1mm | 165 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.35mA | Not Qualified | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.035A | 3.3 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| 70V05L35PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v05l35pf-datasheets-1898.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 64 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 8kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 26b | 8KX8 | 8b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||
| IDT71T75802S100PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75802s100pfg-datasheets-7475.pdf | TQFP | 20mm | 2.5V | 100 | 2.625V | 2.375V | 100 | Parallel | 18 Mb | 1 | PIPELINED ARCHITECTURE | 1 | 175mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | Not Qualified | RAM, SRAM | 3-STATE | 5 ns | 20b | 18 | 0.04A | 18b | Synchronous | COMMON | 2.38V | |||||||||||||||||||||||||||||
| 7007S35PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7007s35pf-datasheets-1712.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 80 | 7 Weeks | 5.5V | 4.5V | 80 | Parallel | 256 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 295mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.65mm | 80 | COMMERCIAL | 20 | SRAMs | 5V | 32kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 30b | 0.015A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||
| 70V7339S166BCGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v7339s166bcgi-datasheets-1554.pdf | 17mm | 17mm | 3.3V | Lead Free | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 9 Mb | yes | 1.4mm | 2 | PIPELINED ARCHITECTURE OR FLOW-THROUGH | No | 1 | 830mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 1mm | 256 | INDUSTRIAL | 30 | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 20 ns | 19b | SERIAL | 0.04A | 18b | Synchronous | COMMON |
