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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Standby Current-Max | Word Size | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 70T3589S133BCI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 85°C | -40°C | 133MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3589s133bci8-datasheets-0569.pdf | 17mm | 17mm | 2.5V | Contains Lead | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 2.3 Mb | 1.4mm | 2 | No | 450mA | RAM, SRAM | 15 ns | 32b | 36b | Synchronous | |||||||||||||||||||||||||||||||||||||
| 70V3589S133DRG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3589s133drg8-datasheets-0570.pdf | PQFP | 28mm | 28mm | 3.3V | Lead Free | 208 | 3.45V | 3.15V | 208 | Parallel | 2.3 Mb | yes | 3.5mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 208 | COMMERCIAL | 30 | SRAMs | 0.4mA | 256kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 16b | 64KX36 | 0.03A | COMMON | ||||||||||||||||||
| 70V9369L6PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 52.6MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9369l6pf8-datasheets-0527.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 288 kb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 350mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 14b | 16KX18 | 0.005A | 18b | Synchronous | COMMON | 3V | |||||||||||||
| 7142LA55J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7142la55j8-datasheets-0481.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | 3.63mm | 2 | No | 110mA | 2kB | RAM, SDR, SRAM | 55 ns | 22b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||
| 70V35S20PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v35s20pf-datasheets-0477.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 144 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 18kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 26b | 8KX18 | 0.005A | 18b | Asynchronous | COMMON | 3V | ||||||||||||||
| IDT6116LA45TPG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Through Hole | Rail/Tube | 70°C | 0°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt6116la45tpg-datasheets-6936.pdf | PDIP | 5V | 24 | 5.5V | 4.5V | 24 | Parallel | 16 kb | 1 | EAR99 | 1 | 95mA | e3 | MATTE TIN | DUAL | 260 | 5V | 2.54mm | 24 | COMMERCIAL | 30 | SRAMs | 5V | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 45 ns | 11b | 2KX8 | 8 | 0.00002A | 8b | Asynchronous | COMMON | 2V | YES | |||||||||||||||||||||
| 70V3589S133DRG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 4.1mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3589s133drg-datasheets-0376.pdf | PQFP | 28mm | 28mm | 3.3V | Lead Free | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 2.3 Mb | yes | 3.5mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 400mA | e3 | Matte Tin (Sn) | QUAD | GULL WING | 3.3V | 0.5mm | 208 | COMMERCIAL | SRAMs | 256kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 32b | 64KX36 | 0.03A | 36b | Synchronous | COMMON | |||||||||||||||
| 71V65803S100PFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 100MHz | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65803s100pfgi-datasheets-0375.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 8 Weeks | 3.465V | 3.135V | 100 | Parallel | 9 Mb | yes | 1.4mm | 1 | BURST COUNTER | No | 1 | 270mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 30 | SRAMs | 1.1MB | RAM, SDR, SRAM | 100MHz | 3-STATE | 5 ns | 19b | 0.06A | 18b | Synchronous | COMMON | |||||||||||||||
| 70T3339S166BF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3339s166bf8-datasheets-0332.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 9 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 450mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 19b | 0.015A | 18b | Synchronous | COMMON | ||||||||||||||||||
| 71T75802S150PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 150MHz | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75802s150pfg-datasheets-0310.pdf | TQFP | 20mm | 14mm | 2.5V | Lead Free | 100 | 8 Weeks | 2.625V | 2.375V | 100 | Parallel | 18 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 215mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 2.3MB | RAM, SDR, SRAM | 150MHz | 3-STATE | 3.8 ns | 20b | 0.04A | 18b | Synchronous | COMMON | 2.38V | ||||||||||||||
| 70V9359L7PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 45.45MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9359l7pf-datasheets-0233.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 144 kb | no | 1.4mm | 2 | EAR99 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 280mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 18kB | RAM, SDR, SRAM | 3-STATE | 7 ns | 26b | 8KX18 | 0.003A | 18b | Synchronous | COMMON | 3V | |||||||||||||
| 70T3339S133BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 1.5mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3339s133bc-datasheets-0206.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 9 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 370mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | COMMERCIAL | 20 | SRAMs | 1.1MB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 19b | 0.015A | 18b | Synchronous | COMMON | ||||||||||||||
| 7143LA25J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7143la25j8-datasheets-0193.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 32 kb | no | 3.63mm | 2 | EAR99 | No | 270mA | 68 | 4kB | RAM, SDR, SRAM | 25 ns | 22b | 16b | Asynchronous | ||||||||||||||||||||||||||||||||||
| 709269L12PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 33.3MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-709269l12pfi8-datasheets-0188.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 256 kb | no | 1.4mm | 2 | EAR99 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 340mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | INDUSTRIAL | 20 | SRAMs | 5V | RAM, SRAM | 3-STATE | 25 ns | 28b | 16KX16 | 0.005A | 16b | Synchronous | COMMON | ||||||||||||
| 70V9279L7PRFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | 83.3MHz | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9279l7prfi-datasheets-0186.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 128 | 7 Weeks | 3.6V | 3V | 128 | Parallel | 512 kb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 335mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | INDUSTRIAL | SRAMs | 64kB | RAM, SDR, SRAM | 3-STATE | 7 ns | 15b | 0.015A | 16b | Synchronous | COMMON | 3V | ||||||||||||||
| 71V3558S133PFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3558s133pfgi-datasheets-0176.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | No | 1 | 310mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 18b | 0.045A | 18b | Synchronous | COMMON | ||||||||||||||||
| 70V3579S6BCI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 4 (72 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2014 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3579s6bci8-datasheets-9994.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 1.1 Mb | no | 1.4mm | 2 | No | 1 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | 225 | 3.3V | 256 | INDUSTRIAL | 128kB | RAM, SDR, SRAM | 12 ns | 30b | |||||||||||||||||||||||||||
| 7006S35PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7006s35pf8-datasheets-9945.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 128 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 28b | 16KX8 | 0.015A | 8b | Asynchronous | COMMON | ||||||||||||
| 71321LA25J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71321la25j-datasheets-9937.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP | No | 1 | 170mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 22b | 0.0015A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||
| 7130LA35PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130la35pf8-datasheets-9915.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 8 kb | 1.4mm | 2 | No | 120mA | 1kB | RAM, SDR, SRAM | 35 ns | 10b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||
| 7140LA20PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7140la20pf8-datasheets-9916.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 8 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 20b | 1KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||
| 71V65803S133BQI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65803s133bqi-datasheets-9912.pdf | 15mm | 13mm | 3.3V | Contains Lead | 165 | 7 Weeks | 3.465V | 3.135V | 165 | Parallel | 9 Mb | no | 1.2mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 320mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 165 | INDUSTRIAL | 20 | SRAMs | 1.1MB | RAM, SDR, SRAM | 133MHz | 3-STATE | 7.5 ns | 19b | 0.06A | 18b | Synchronous | COMMON | |||||||||||||||||
| 70V3379S4PRFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3379s4prfg-datasheets-9864.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 128 | 7 Weeks | 3.45V | 3.15V | 128 | Parallel | 576 kb | yes | 1.4mm | 2 | PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 128 | COMMERCIAL | 30 | SRAMs | 0.46mA | 72kB | RAM, SDR, SRAM | 3-STATE | 4.2 ns | 133MHz | 15b | 0.015A | COMMON | ||||||||||||||||
| 7142SA55J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7142sa55j8-datasheets-9854.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | 3.63mm | 2 | No | 155mA | 2kB | RAM, SDR, SRAM | 55 ns | 22b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||
| 71V016SA12BFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v016sa12bfgi8-datasheets-9807.pdf | 7mm | 7mm | 3.3V | Lead Free | 48 | 12 Weeks | 3.6V | 3V | 48 | Parallel | 1 Mb | yes | 1.4mm | 1 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 0.75mm | 48 | INDUSTRIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 12 ns | 16b | COMMON | 3V | |||||||||||||||||||||
| 71421SA55J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71421sa55j-datasheets-9803.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | No | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 22b | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||
| 71V67703S75BGG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 117MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v67703s75bgg-datasheets-9785.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 9 Mb | yes | 2.15mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 265mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 119 | COMMERCIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 7.5 ns | 18b | 256KX36 | 0.05A | 36b | Synchronous | COMMON | ||||||||||||||||
| 70T659S10BFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.5mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t659s10bfi-datasheets-9726.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 4.5 Mb | no | 1.4mm | 2 | No | 1 | 445mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | INDUSTRIAL | SRAMs | 512kB | RAM, SDR, SRAM | 3-STATE | 10 ns | 17b | 36b | Asynchronous | COMMON | |||||||||||||||||||
| 71V432S6PFG | Integrated Device Technology (IDT) | $3.86 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 83MHz | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v432s6pfg-datasheets-9716.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 3.63V | 3.135V | 100 | Parallel | 1 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 180mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM | 83MHz | 3-STATE | 6 ns | 15b | 32KX32 | 32b | Synchronous | COMMON | |||||||||||||||
| 70V08S25PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v08s25pf8-datasheets-9713.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | EAR99 | SEMAPHORE | No | 1 | 205mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 64kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 32b | 64KX8 | 0.006A | 8b | Asynchronous | COMMON | 3V |
