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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
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| IDT71V124SA15PH8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.2mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v124sa15ph8-datasheets-4465.pdf | SOIC | 20.95mm | 10.16mm | 32 | Parallel | no | 3A991.B.2.B | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | GULL WING | 225 | 3.3V | 1.27mm | 32 | COMMERCIAL | 3.6V | 3.15V | 30 | SRAMs | 3.3V | 0.1mA | Not Qualified | R-PDSO-G32 | RAM, SRAM - Asynchronous | 3-STATE | 128KX8 | 8 | 1048576 bit | 0.01A | 15 ns | COMMON | 3V | ||||||||||||||||||||||||||||
| 71V35761SA200BQGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 200MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761sa200bqgi-datasheets-4459.pdf | FBGA | 15mm | 13mm | 3.3V | Lead Free | 165 | 3.465V | 3.135V | 165 | Parallel | 4.5 Mb | yes | 1.2mm | 1 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 165 | INDUSTRIAL | 30 | 512kB | RAM, SDR, SRAM | 200MHz | 3.1 ns | 17b | 36b | Synchronous | ||||||||||||||||||||||||||||||||
| IDT71V35761S200BQI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 200MHz | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v35761s200bqi-datasheets-4391.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1mm | 165 | INDUSTRIAL | 3.465V | 3.135V | 20 | Not Qualified | RAM, SRAM | 128KX36 | 36 | 4718592 bit | 3.1 ns | ||||||||||||||||||||||||||||||||||||
| 71V321L35PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v321l35pf8-datasheets-4075.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | BATTERY BACKUP;AUTOMATIC POWER DOWN | No | 1 | 95mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 2kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 22b | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||
| 70T633S12BFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.7mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t633s12bfgi-datasheets-4080.pdf | 15mm | 15mm | 2.5V | Lead Free | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 9 Mb | yes | 1.4mm | 2 | No | 1 | 395mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 0.8mm | 208 | INDUSTRIAL | 30 | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 12 ns | 38b | 18b | Asynchronous | COMMON | |||||||||||||||||||||||||||
| 71V016SA15PHGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v016sa15phgi-datasheets-4017.pdf | TSOP | 18.41mm | 10.16mm | 3.3V | Lead Free | 130mA | 44 | 12 Weeks | 3.6V | 3V | 44 | Parallel | 1 Mb | yes | 1mm | 1 | 1 | 130mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 0.8mm | 44 | INDUSTRIAL | 30 | SRAMs | Not Qualified | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 15 ns | 16b | 16b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||
| 7164L55DB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7164l55db-datasheets-3981.pdf | CDIP | 37.2mm | 15.24mm | 5V | Contains Lead | 28 | 10 Weeks | 5.5V | 4.5V | 28 | Parallel | 64 kb | no | 1.65mm | 1 | No | 1 | 90mA | e0 | Tin/Lead (Sn63Pb37) | DUAL | 240 | 5V | 2.54mm | 28 | MILITARY | SRAMs | 5V | MIL-STD-883 Class B | 8kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 55 ns | 13b | 8KX8 | 0.0002A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||
| IDT6116SA35SO | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 1 (Unlimited) | 70°C | 0°C | CMOS | 2.65mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt6116sa35so-datasheets-4331.pdf | SOIC | 15.4mm | 7.5mm | 24 | Parallel | 1 | EAR99 | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | YES | DUAL | GULL WING | 225 | 5V | 1.27mm | 24 | COMMERCIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.1mA | Not Qualified | R-PDSO-G24 | RAM, SRAM - Asynchronous | 3-STATE | 2KX8 | 8 | 16384 bit | 0.002A | 35 ns | COMMON | 4.5V | YES | ||||||||||||||||||||||||||||
| IDT71V67602S133BQG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | 133MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67602s133bqg8-datasheets-4305.pdf | 165 | Parallel | RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V016SA12PH8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.2mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v016sa12ph8-datasheets-4272.pdf | TSOP | 18.41mm | 10.16mm | 44 | Parallel | 1 | 3A991.B.2.B | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | GULL WING | 225 | 3.3V | 0.8mm | 44 | COMMERCIAL | 3.6V | 3V | 20 | SRAMs | 3.3V | 0.15mA | Not Qualified | R-PDSO-G44 | RAM, SRAM - Asynchronous | 3-STATE | 64KX16 | 16 | 1048576 bit | 0.01A | 12 ns | COMMON | 3.15V | YES | |||||||||||||||||||||||||||
| 70V3589S133BF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3589s133bf-datasheets-3840.pdf | 15mm | 15mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 2.3 Mb | no | 1.4mm | 2 | No | 1 | 400mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 3.3V | 0.8mm | 208 | COMMERCIAL | SRAMs | 256kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 16b | 64KX36 | 0.03A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||
| 70V35S15PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v35s15pf-datasheets-3830.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 144 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 215mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 18kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 26b | 8KX18 | 0.005A | 18b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||
| IDT71P72604S200BQI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | 200MHz | Non-RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p72604s200bqi-datasheets-4268.pdf | 165 | Parallel | QDR, RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70T3519S133DRI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 85°C | -40°C | 133MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3519s133dri-datasheets-3768.pdf | PQFP | 28mm | 28mm | 2.5V | Contains Lead | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 9 Mb | 3.5mm | 2 | No | 450mA | 1.1MB | RAM, SDR, SRAM | 133MHz | 4.2 ns | 36b | 36b | Synchronous | ||||||||||||||||||||||||||||||||||||||||||||
| 71V632S6PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 83MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v632s6pfg-datasheets-3705.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 3.63V | 3.135V | 100 | Parallel | 2 Mb | yes | 1.4mm | 1 | ALSO REQUIRES 3.3V I/O SUPPLY | No | 1 | 180mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 30 | SRAMs | 256kB | RAM, SDR, SRAM | 83MHz | 3-STATE | 6 ns | 16b | 64KX32 | 32b | Synchronous | COMMON | |||||||||||||||||||||||||
| 71V016SA10BFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v016sa10bfg8-datasheets-3670.pdf | 7mm | 7mm | 3.3V | Lead Free | 48 | 12 Weeks | 3.6V | 3.15V | 48 | Parallel | 1 Mb | yes | 1.4mm | 1 | No | 1 | 160mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 0.75mm | 48 | COMMERCIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 10 ns | 16b | 16b | Asynchronous | COMMON | |||||||||||||||||||||||||||||
| IDT71V35761S200BQGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 85°C | -40°C | 200MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v35761s200bqgi8-datasheets-4182.pdf | 165 | Parallel | RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71T75802S133BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 70°C | 0°C | 133MHz | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75802s133bg8-datasheets-4168.pdf | BGA | 14mm | 22mm | 2.5V | Contains Lead | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | 2.15mm | 1 | No | 195mA | RAM, SRAM | 4.2 ns | 20b | 18b | Synchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 70T633S10BFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t633s10bfg8-datasheets-3600.pdf | 15mm | 15mm | 2.5V | Lead Free | 208 | 2.6V | 2.4V | 208 | Parallel | 9 Mb | yes | 1.4mm | 2 | 3A991 | No | 1 | 405mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 0.8mm | 208 | COMMERCIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 10 ns | 38b | 0.01A | 18b | Asynchronous | COMMON | |||||||||||||||||||||||||||||
| 71V3559S75PFGI | Integrated Device Technology (IDT) | $2.41 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | 100MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3559s75pfgi-datasheets-3581.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | No | e3 | MATTE TIN | 260 | 100 | 512kB | RAM, SDR, SRAM | 100MHz | 7.5 ns | 18b | 18b | Synchronous | |||||||||||||||||||||||||||||||||||||||
| IDT71P72804S200BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p72804s200bq-datasheets-4153.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1.8V | 1mm | 165 | COMMERCIAL | 1.9V | 1.7V | 20 | SRAMs | 1.5/1.81.8V | Not Qualified | QDR, RAM, SRAM | 3-STATE | 1MX18 | 18 | 18874368 bit | 0.45 ns | SEPARATE | 1.7V | |||||||||||||||||||||||||||||||
| IDT71V35761S200BQGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | 200MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v35761s200bqgi-datasheets-4091.pdf | 165 | Parallel | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V9169L6PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 52.6MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9169l6pf8-datasheets-3370.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 144 kb | no | 1.4mm | 2 | EAR99 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 330mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 14b | 16KX9 | 0.003A | 9b | Synchronous | COMMON | 3V | |||||||||||||||||||||
| 70T633S10BFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.7mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t633s10bfg-datasheets-3356.pdf | 15mm | 15mm | 2.5V | Lead Free | 208 | 2.6V | 2.4V | 208 | Parallel | 9 Mb | yes | 1.4mm | 2 | 3A991 | No | 1 | 405mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 0.8mm | 208 | COMMERCIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 10 ns | 38b | 0.01A | 18b | Asynchronous | COMMON | ||||||||||||||||||||||||||||
| 7130LA25JI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 85°C | -40°C | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130la25ji-datasheets-3357.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 8 kb | 3.63mm | 2 | No | 220mA | 1kB | RAM, SDR, SRAM | 25 ns | 20b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||
| 7025L35GB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7025l35gb-datasheets-3352.pdf | 27.94mm | 27.94mm | 5V | Contains Lead | 84 | 10 Weeks | 5.5V | 4.5V | 84 | Parallel | 128 kb | no | 3.68mm | 2 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP | No | 1 | 250mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 5V | 84 | MILITARY | MIL-PRF-38535 | 16kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 26b | 8KX16 | 0.004A | 16b | Asynchronous | COMMON | YES | |||||||||||||||||||||||||||
| 7052L25PQFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 85°C | -40°C | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7052l25pqfi-datasheets-3328.pdf | PQFP | 24.13mm | 24.13mm | 5V | Contains Lead | 5.5V | 4.5V | 132 | Parallel | 16 kb | 3.55mm | 4 | No | 300mA | 2kB | RAM, SDR, SRAM | 25 ns | 11b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||
| 70V05L20PFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v05l20pfgi8-datasheets-3244.pdf | TQFP | 14mm | 14mm | 3.3V | Lead Free | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 64 kb | yes | 1.4mm | 2 | EAR99 | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | GULL WING | 260 | 3.3V | 0.8mm | 64 | INDUSTRIAL | 30 | SRAMs | 0.195mA | 8kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 26b | 8KX8 | 0.005A | COMMON | 3V | |||||||||||||||||||||||||
| 70T3599S133BCI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3599s133bci8-datasheets-3181.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 4.5 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 450mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | INDUSTRIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 34b | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||
| 70T3539MS133BCGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 85°C | -40°C | 133MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3539ms133bcgi-datasheets-3155.pdf | 17mm | 17mm | 2.5V | Lead Free | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 18 Mb | 1.4mm | 2 | No | 900mA | 2.3MB | RAM, SDR, SRAM | 133MHz | 4.2 ns | 19b | 36b | Synchronous |
