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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 71V256S12YG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel | 70°C | 0°C | RoHS Compliant | 3.3V | 7 Weeks | 28 | Parallel | 256 kb | 1 | No | RAM, SRAM - Asynchronous | 15b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V3399S133PRFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3399s133prfi8-datasheets-9570.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 128 | 16 Weeks | 3.45V | 3.15V | 128 | Parallel | 2.3 Mb | no | 1.4mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 480mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | INDUSTRIAL | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 17b | 0.04A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||
| 70V27S35PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v27s35pf8-datasheets-9569.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 7 Weeks | 3.6V | 3V | 100 | Parallel | 512 kb | 1.4mm | 2 | No | 235mA | 64kB | RAM, SDR, SRAM | 35 ns | 30b | 16b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 70V27S20PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v27s20pf8-datasheets-9565.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | No | 1 | 255mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 64kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 30b | 0.006A | 16b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||
| IDT71V35761S183BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | 183MHz | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v35761s183bq8-datasheets-2446.pdf | 165 | Parallel | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V3399S133PRFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 1.6mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3399s133prfi-datasheets-9306.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 128 | 16 Weeks | 3.45V | 3.15V | 128 | Parallel | 2.3 Mb | no | 1.4mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 480mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | INDUSTRIAL | SRAMs | 256kB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 34b | 0.04A | 18b | Synchronous | COMMON | |||||||||||||||||||||||
| IDT71V25761S183PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 183MHz | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v25761s183pfi-datasheets-2434.pdf | TQFP | 20mm | 3.3V | 100 | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | 1 | PIPELINED ARCHITECTURE | not_compliant | 1 | 350mA | e0 | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 20 | SRAMs | Not Qualified | RAM, SRAM | 3-STATE | 3.3 ns | 17b | 36 | 0.035A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||||
| 71V65703S80BQI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 95MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65703s80bqi-datasheets-9149.pdf | 15mm | 13mm | 3.3V | Contains Lead | 165 | 7 Weeks | 3.465V | 3.135V | 165 | Parallel | 9 Mb | no | 1.2mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 60mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 165 | INDUSTRIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 8 ns | 18b | 256KX36 | 0.06A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||
| 70T3589S133DRI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 4.1mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3589s133dri-datasheets-9119.pdf | PQFP | 28mm | 28mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 2.3 Mb | no | 3.5mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 450mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 2.5V | 0.5mm | 208 | INDUSTRIAL | 20 | SRAMs | 256kB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 32b | 64KX36 | 36b | Synchronous | COMMON | |||||||||||||||||||||
| IDT71V3579S80PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3579s80pf-datasheets-2355.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.2mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 100MHz | 256KX18 | 18 | 4718592 bit | 0.03A | 8 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
| 7005L25PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 85°C | -40°C | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005l25pfi8-datasheets-9061.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 64 kb | no | 1.4mm | 2 | EAR99 | No | e0 | TIN LEAD | 240 | 64 | 8kB | RAM, SDR, SRAM | 25 ns | 26b | ||||||||||||||||||||||||||||||||||||||||||
| IDT71V35761S183BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 183MHz | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v35761s183bq-datasheets-2329.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1mm | 165 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.34mA | Not Qualified | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.03A | 3.3 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| 70V631S12BC8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v631s12bc8-datasheets-8887.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 4.5 Mb | no | 1.4mm | 2 | No | 1 | 465mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 18b | 0.015A | 18b | Asynchronous | COMMON | |||||||||||||||||||||||||||
| CY7C199D-25SXET | Cypress Semiconductor |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel | 125°C | -40°C | RoHS Compliant | SOIC | 5V | Lead Free | 28 | Parallel | 256 kb | 1 | No | RAM, SRAM - Asynchronous | 15b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7143SA70GB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7143sa70gb-datasheets-8824.pdf | 29.46mm | 29.46mm | 5V | Contains Lead | 68 | 5.5V | 4.5V | 68 | Parallel | 32 kb | no | 3.68mm | 2 | No | 1 | 310mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 240 | 5V | 68 | MILITARY | 20 | SRAMs | 5V | MIL-PRF-38535 | RAM, SRAM | 3-STATE | 70 ns | 22b | 0.015A | 16b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||||
| 70V24L20JI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 85°C | -40°C | CMOS | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v24l20ji-datasheets-8803.pdf | PLCC | 29.21mm | 29.21mm | 3.3V | Contains Lead | 84 | 7 Weeks | 3.6V | 3V | 84 | Parallel | 64 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 195mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 84 | INDUSTRIAL | SRAMs | 8kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 24b | 4KX16 | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||
| 71256L25YG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.556mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71256l25yg-datasheets-8788.pdf | 17.9mm | 7.6mm | 5V | Lead Free | 28 | 7 Weeks | 5.5V | 4.5V | 28 | Parallel | 256 kb | yes | 2.67mm | 1 | EAR99 | No | 1 | 125mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 5V | 28 | COMMERCIAL | SRAMs | 5V | 32kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 25 ns | 15b | 32KX8 | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||
| 7134SA35P | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 70°C | 0°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7134sa35p-datasheets-8789.pdf | PDIP | 61.7mm | 15.24mm | 5V | Contains Lead | 5.5V | 4.5V | 48 | Parallel | 32 kb | 3.8mm | 2 | No | 260mA | 4kB | RAM, SDR, SRAM | 35 ns | 24b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 70V9099L9PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 40MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9099l9pf8-datasheets-8781.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 1 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 230mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 9 ns | 34b | 8b | Synchronous | COMMON | 3V | |||||||||||||||||||||||
| 7005L25PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 85°C | -40°C | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005l25pfi-datasheets-8780.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 64 kb | no | 1.4mm | 2 | EAR99 | No | e0 | TIN LEAD | 240 | 64 | 8kB | RAM, SDR, SRAM | 25 ns | 26b | |||||||||||||||||||||||||||||||||||||||||
| 70V28L15PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v28l15pfg-datasheets-8725.pdf | TQFP | 14mm | 14mm | 3.3V | Lead Free | 7 Weeks | 3.6V | 3V | 100 | Parallel | 1 Mb | 1.4mm | 2 | No | 235mA | 128kB | RAM, SDR, SRAM | 15 ns | 32b | 16b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 70V3399S133BFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3399s133bfi-datasheets-8622.pdf | 15mm | 15mm | 3.3V | Contains Lead | 208 | 16 Weeks | 3.45V | 3.15V | 208 | Parallel | 2.3 Mb | no | 1.4mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 480mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | INDUSTRIAL | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 17b | 0.04A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||
| 70V07S35J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v07s35j8-datasheets-8545.pdf | PLCC | 24mm | 24mm | 3.3V | Contains Lead | 68 | 7 Weeks | 3.6V | 3V | 68 | Parallel | 256 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 140mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 68 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 35 ns | 15b | 0.006A | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||
| 7132LA100P | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 70°C | 0°C | CMOS | 5.08mm | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7132la100p-datasheets-8530.pdf | PDIP | 61.7mm | 15.24mm | 5V | Contains Lead | 48 | 5.5V | 4.5V | 48 | Parallel | 16 kb | no | 3.8mm | 2 | EAR99 | AUTOMATIC POWER-DOWN; BATTERY BACKUP | No | 1 | 110mA | e0 | Tin/Lead (Sn85Pb15) | DUAL | 245 | 5V | 48 | COMMERCIAL | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 100 ns | 22b | 0.0015A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||
| 70125S55J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70125s55j8-datasheets-8529.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 18 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | NOT SPECIFIED | SRAMs | 5V | Not Qualified | RAM, SRAM | 3-STATE | 55 ns | 22b | 0.015A | 9b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||
| 7132LA35CB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 125°C | -55°C | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7132la35cb-datasheets-8482.pdf | DIP | 61.72mm | 15.24mm | 5V | Contains Lead | 5.5V | 4.5V | 48 | Parallel | 16 kb | 3.3mm | 2 | No | 170mA | 2kB | RAM, SDR, SRAM | 35 ns | 22b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 71V2556SA133BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 2.36mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v2556sa133bg-datasheets-8377.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | yes | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 300mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 119 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 17b | 0.04A | 36b | Synchronous | COMMON | |||||||||||||||||||||||
| IDT71V67602S133BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67602s133bq-datasheets-2045.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1mm | 165 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 2.53.3V | 0.28mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.07A | 4.2 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| IDT71V2576S133PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v2576s133pfi-datasheets-2010.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 2.53.3V | 0.26mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.035A | 4.2 ns | COMMON | 3.13V | ||||||||||||||||||||||||||
| TC58BVG2S0HTA00 | Toshiba |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | CMOS | ASYNCHRONOUS | 1.2mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/toshiba-tc58bvg2s0hta00-datasheets-1969.pdf | TFSOP | 18.4mm | 12mm | 3.3V | 48 | 16 Weeks | 3.6V | 2.7V | Parallel, Serial | 1 | DUAL | GULL WING | 3.3V | 0.5mm | 48 | COMMERCIAL | R-PDSO-G48 | EEPROM, NAND | 25 ns | 512MX8 | 8 | 4294967296 bit |
