Products
Manufacturer
RFQ
NEWS
ContactMemory(55331)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| IDT71V35761S200BQG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | 200MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v35761s200bqg8-datasheets-3961.pdf | 165 | Parallel | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V25S55J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v25s55j-datasheets-3056.pdf | PLCC | 29.21mm | 29.21mm | 3.3V | Contains Lead | 84 | 7 Weeks | 3.6V | 3V | 84 | Parallel | 128 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 180mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 84 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 55 ns | 26b | 8KX16 | 0.005A | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||
| IDT71V2556S166PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v2556s166pfi-datasheets-3936.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 2.53.3V | 0.36mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.045A | 3.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
| 70T3539MS133BCG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 70°C | 0°C | 133MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3539ms133bcg-datasheets-3026.pdf | 17mm | 17mm | 2.5V | Lead Free | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 18 Mb | 1.4mm | 2 | No | 2.3MB | RAM, SDR, SRAM | 133MHz | 4.2 ns | 38b | |||||||||||||||||||||||||||||||||||||||||||||||
| 71V67803S133BQI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v67803s133bqi-datasheets-2969.pdf | 15mm | 13mm | 3.3V | Contains Lead | 165 | 7 Weeks | 3.465V | 3.135V | 165 | Parallel | 9 Mb | no | 1.2mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 280mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 165 | INDUSTRIAL | 20 | SRAMs | 1.1MB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 19b | 0.07A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||
| 71V3557S80BGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 95MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3557s80bgi8-datasheets-2930.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 260mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | INDUSTRIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 8 ns | 17b | 0.045A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| 70V7339S166BC8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 1.5mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v7339s166bc8-datasheets-2928.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 9 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 790mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 20 ns | 38b | 0.03A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||
| 7024S55PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2000 | /files/integrateddevicetechnology-7024s55pf-datasheets-2813.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 64 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 24b | 4KX16 | 0.015A | 16b | Asynchronous | COMMON | |||||||||||||||||||||
| IDT71V35761S200BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | 200MHz | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v35761s200bq8-datasheets-3818.pdf | 165 | Parallel | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70T3519S166BCGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 85°C | -40°C | 166MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3519s166bcgi-datasheets-2716.pdf | 17mm | 17mm | 2.5V | Lead Free | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 9 Mb | 1.4mm | 2 | No | 510mA | 1.1MB | RAM, SDR, SRAM | 166MHz | 3.6 ns | 36b | 36b | Synchronous | |||||||||||||||||||||||||||||||||||||||||||
| 70T3319S166BF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3319s166bf8-datasheets-2695.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 4 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 450mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 18b | 0.015A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||
| 7052L35GB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 125°C | -55°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7052l35gb-datasheets-2654.pdf | 30.48mm | 30.48mm | 5V | Contains Lead | 5.5V | 4.5V | 108 | Parallel | 16 kb | 3.68mm | 4 | No | 300mA | RAM, SRAM | 35 ns | 11b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||
| 71V3556SA133BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3556sa133bq8-datasheets-2651.pdf | 15mm | 13mm | 3.3V | Contains Lead | 165 | 11 Weeks | 3.465V | 3.135V | 165 | Parallel | 4.5 Mb | no | 1.2mm | 1 | No | 1 | 300mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 165 | COMMERCIAL | 512kB | RAM, SDR, SRAM | 133MHz | 4.2 ns | 17b | 36b | Synchronous | |||||||||||||||||||||||||||||||
| IDT71V35761S200BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v35761s200bq-datasheets-3717.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1mm | 165 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.36mA | Not Qualified | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.03A | 3.1 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| 71V3557S80BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 95MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3557s80bg8-datasheets-2479.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 250mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 8 ns | 17b | 0.04A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| 7052L25PFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 85°C | -40°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7052l25pfgi8-datasheets-2377.pdf | TQFP | 14mm | 14mm | 5V | Lead Free | 7 Weeks | 5.5V | 4.5V | 120 | Parallel | 16 kb | 1.4mm | 4 | No | 300mA | RAM, SRAM | 25 ns | 11b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 7007S15J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 70°C | 0°C | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7007s15j-datasheets-2375.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 256 kb | 3.63mm | 2 | No | 325mA | 32kB | RAM, SDR, SRAM | 15 ns | 30b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||
| 7164L25YGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.556mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7164l25ygi-datasheets-2346.pdf | 17.9mm | 7.6mm | 5V | Lead Free | 28 | 7 Weeks | 5.5V | 4.5V | 28 | Parallel | 64 kb | yes | 2.67mm | 1 | EAR99 | No | 1 | 100mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 5V | 28 | INDUSTRIAL | SRAMs | 5V | 8kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 25 ns | 13b | 8KX8 | 0.00006A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||
| 7052L25PFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 85°C | -40°C | RoHS Compliant | 2001 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7052l25pfgi-datasheets-2340.pdf | TQFP | 14mm | 14mm | 5V | Lead Free | 7 Weeks | 5.5V | 4.5V | 120 | Parallel | 16 kb | 1.4mm | 4 | No | 300mA | RAM, SRAM | 25 ns | 11b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 70261L25PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70261l25pf-datasheets-2256.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 256 kb | 1.4mm | 2 | No | 265mA | 32kB | RAM, SDR, SRAM | 25 ns | 28b | 16b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| IDT71V416S10PHI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.2mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416s10phi-datasheets-3592.pdf | TSOP | 18.41mm | 10.16mm | 44 | Parallel | no | 3A991.B.2.A | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | GULL WING | 225 | 3.3V | 0.8mm | 44 | INDUSTRIAL | 3.6V | 3V | 20 | SRAMs | 3.3V | 0.2mA | Not Qualified | R-PDSO-G44 | RAM, SRAM - Asynchronous | 3-STATE | 256KX16 | 16 | 4194304 bit | 0.02A | 10 ns | COMMON | 3V | |||||||||||||||||||||||||||||
| 7133SA20PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7133sa20pf-datasheets-2197.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 32 kb | 1.4mm | 2 | 310mA | 4kB | RAM, SDR, SRAM | 20 ns | 22b | 16b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||
| 71V3577S75BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 117MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3577s75bq8-datasheets-3590.pdf | FBGA | 15mm | 13mm | 3.3V | Contains Lead | 165 | 11 Weeks | 3.465V | 3.135V | 165 | Parallel | 4.5 Mb | no | 1.2mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 255mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 165 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 7.5 ns | 17b | 0.03A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||
| 70T3339S166BC8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 1.5mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3339s166bc8-datasheets-2170.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 9 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 450mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 38b | 0.015A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||
| 70P3519S166BCGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p3519s166bcgi-datasheets-3557.pdf | 17mm | 17mm | 1.8V | Lead Free | 256 | 256 | Parallel | 9 Mb | yes | 1.4mm | 2 | 3A991 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 1.8V | 1mm | 256 | INDUSTRIAL | 1.9V | 1.7V | 30 | RAM, SRAM | 18b | |||||||||||||||||||||||||||||||||
| 71V65703S80BQGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 95MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65703s80bqgi8-datasheets-2097.pdf | 15mm | 13mm | 3.3V | Lead Free | 165 | 7 Weeks | 3.465V | 3.135V | 165 | Parallel | 9 Mb | yes | 1.2mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 60mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 165 | INDUSTRIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 8 ns | 18b | 256KX36 | 0.06A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||
| IDT71P72604S200BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | Non-RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p72604s200bq-datasheets-3545.pdf | 15mm | 1.8V | 165 | 1.9V | 1.7V | 165 | Parallel | 18 Mb | 2 | not_compliant | 1 | 950mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1.8V | 1mm | 165 | COMMERCIAL | 20 | SRAMs | Not Qualified | QDR, RAM, SRAM | 3-STATE | 450 ps | 18b | 36 | 36b | Synchronous | SEPARATE | ||||||||||||||||||||||||||||||||
| 7008S35J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008s35j8-datasheets-2079.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 512 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | No | 1 | 295mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 32b | 64KX8 | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||
| 7025S70GB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7025s70gb-datasheets-2019.pdf | 27.94mm | 27.94mm | 5V | Contains Lead | 84 | 10 Weeks | 84 | Parallel | 128 kb | no | 3.68mm | 2 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP | No | 1 | e0 | Tin/Lead (Sn/Pb) | NO | PERPENDICULAR | PIN/PEG | 5V | 84 | MILITARY | MIL-PRF-38535 | RAM, SRAM | 3-STATE | 26b | 8KX16 | 0.015A | 70 ns | COMMON | YES | ||||||||||||||||||||||||||||||||
| 70V7339S133BFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v7339s133bfi-datasheets-2012.pdf | 15mm | 15mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 9 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 675mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | INDUSTRIAL | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 19b | 0.04A | 18b | Synchronous | COMMON |
