Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min |
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IDT71V35761S166BQGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | 166MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v35761s166bqgi-datasheets-1199.pdf | 165 | Parallel | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
7037L20PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7037l20pf-datasheets-6162.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 576 kb | no | 1.4mm | 2 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | No | 1 | 300mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 72kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 15b | 0.003A | 18b | Asynchronous | COMMON | |||||||||||||||||||||||||
7006L55G | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7006l55g-datasheets-6160.pdf | 29.46mm | 29.46mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 128 kb | no | 3.68mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 210mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 240 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 28b | 16KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||||
70V3399S166PRF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3399s166prf-datasheets-6149.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 128 | 16 Weeks | 3.45V | 3.15V | 128 | Parallel | 2.3 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 500mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.635mm | 128 | COMMERCIAL | SRAMs | 256kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.6 ns | 34b | 0.03A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||||
71V3558SA100BQG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3558sa100bqg8-datasheets-6007.pdf | 15mm | 13mm | 3.3V | Lead Free | 165 | 11 Weeks | 3.465V | 3.135V | 165 | Parallel | 4.5 Mb | yes | 1.2mm | 1 | No | 1 | 250mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 165 | COMMERCIAL | RAM, SRAM | 5 ns | 18b | 18b | Synchronous | |||||||||||||||||||||||||||||||||||
7130LA20PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130la20pf-datasheets-5954.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 8 kb | 1.4mm | 2 | No | 200mA | 1kB | RAM, SDR, SRAM | 20 ns | 10b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||
IDT71V35761S166BQG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | 166MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v35761s166bqg8-datasheets-1113.pdf | 165 | Parallel | RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
71V321S55TF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v321s55tf8-datasheets-5919.pdf | LQFP | 10mm | 10mm | 3.3V | Contains Lead | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | BATTERY BACKUP;AUTOMATIC POWER DOWN | No | 1 | 115mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 64 | COMMERCIAL | 20 | SRAMs | 2kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 22b | 0.005A | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||
7140LA20J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7140la20j8-datasheets-5909.pdf | PLCC | 19mm | 3.63mm | 19mm | 5V | Contains Lead | 110mA | 52 | 7 Weeks | 2.96261g | 5.5V | 4.5V | 52 | Parallel | 8 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 20b | 1KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||
70V9369L7PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 45.45MHz | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9369l7pfi-datasheets-5902.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 288 kb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 335mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 18 ns | 28b | 16KX18 | 0.015A | 18b | Synchronous | COMMON | 3V | |||||||||||||||||||||||||
IDT71V3557S75BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3557s75bq-datasheets-1085.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1mm | 165 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.275mA | Not Qualified | RAM, SRAM | 3-STATE | 100MHz | 128KX36 | 36 | 4718592 bit | 0.04A | 7.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||
7164L35DB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7164l35db-datasheets-5870.pdf | CDIP | 37.2mm | 15.24mm | 5V | Contains Lead | 28 | 28 | Parallel | 64 kb | no | 1.65mm | 1 | No | 1 | e0 | Tin/Lead (Sn63Pb37) | NO | DUAL | THROUGH-HOLE | 240 | 5V | 2.54mm | 28 | MILITARY | SRAMs | 5V | MIL-STD-883 Class B | RAM, SRAM - Asynchronous | 3-STATE | 13b | 8KX8 | 0.0002A | 35 ns | COMMON | 2V | ||||||||||||||||||||||||||||||||
71V3557S85PFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3557s85pfgi8-datasheets-5800.pdf | LQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 30 | SRAMs | 0.235mA | RAM, SRAM | 3-STATE | 90MHz | 17b | 0.045A | 8.5 ns | COMMON | ||||||||||||||||||||||||||||||
7005L55JI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | 85°C | -40°C | CMOS | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005l55ji-datasheets-5778.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 64 kb | no | 3.63mm | 2 | EAR99 | No | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | J BEND | 225 | 5V | 68 | INDUSTRIAL | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 26b | 8KX8 | 0.004A | COMMON | 2V | |||||||||||||||||||||||||||||||
IDT71V35761S166BQG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 70°C | 0°C | 166MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v35761s166bqg-datasheets-0995.pdf | 165 | Parallel | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IDT71P72804S167BQG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 167MHz | SYNCHRONOUS | 1.2mm | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p72804s167bqg-datasheets-0978.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | 8542.32.00.41 | 1 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 1.8V | 1mm | 165 | COMMERCIAL | 1.9V | 1.7V | 30 | Not Qualified | QDR, RAM, SRAM | 1MX18 | 18 | 18874368 bit | 0.5 ns | ||||||||||||||||||||||||||||||||||||||
71V3559S85BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 91MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3559s85bq-datasheets-5572.pdf | 15mm | 13mm | 3.3V | Contains Lead | 165 | 11 Weeks | 3.465V | 3.135V | 165 | Parallel | 4.5 Mb | no | 1.2mm | 1 | No | 225mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 165 | COMMERCIAL | 20 | SRAMs | 512kB | RAM, SDR, SRAM | 100MHz | 3-STATE | 8.5 ns | 18b | 0.04A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||||||
IDT71V67602S133BGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67602s133bgi8-datasheets-0922.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | INDUSTRIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 2.53.3V | 0.28mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.07A | 4.2 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||
71V3577S85BQG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3577s85bqg-datasheets-0904.pdf | FBGA | 15mm | 13mm | 3.3V | Lead Free | 165 | 11 Weeks | 165 | Parallel | 4.5 Mb | yes | 1.2mm | 1 | FLOW THROUGH ARCHITECTURE | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 165 | COMMERCIAL | 3.465V | 30 | SRAMs | RAM, SRAM | 3-STATE | 87MHz | 17b | 0.03A | 8.5 ns | COMMON | |||||||||||||||||||||||||||||||||
70T631S12BF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t631s12bf8-datasheets-5441.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 4 Mb | no | 1.4mm | 2 | No | 1 | 355mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 36b | 0.01A | 18b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||
71V016SA12YG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v016sa12yg8-datasheets-5372.pdf | 28.6mm | 10.2mm | 3.3V | Lead Free | 44 | 12 Weeks | 3.6V | 3V | 44 | Parallel | 1 Mb | yes | 2.9mm | 1 | No | 1 | 150mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 44 | COMMERCIAL | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 12 ns | 16b | 16b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||||||
71V3556SA166BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3556sa166bq8-datasheets-5263.pdf | 15mm | 13mm | 3.3V | Contains Lead | 165 | 11 Weeks | 3.465V | 3.135V | 165 | Parallel | 4.5 Mb | no | 1.2mm | 1 | No | 1 | 350mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 165 | COMMERCIAL | RAM, SRAM | 3.5 ns | 17b | 36b | Synchronous | |||||||||||||||||||||||||||||||||||
7005L70GB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 125°C | -55°C | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005l70gb-datasheets-5216.pdf | 29.46mm | 29.46mm | 5V | Contains Lead | 5.5V | 4.5V | 68 | Parallel | 64 kb | 3.68mm | 2 | No | 250mA | RAM, SRAM | 70 ns | 26b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||
IDT71V3558S100PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 100MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3558s100pfi8-datasheets-0815.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.255mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 256KX18 | 18 | 4718592 bit | 0.045A | 5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||
71321SA55PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71321sa55pf8-datasheets-5187.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | No | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 22b | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||
IDT70824L25PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | ASYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt70824l25pfi-datasheets-0797.pdf | LQFP | 14mm | 14mm | 80 | Parallel | EAR99 | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 5V | 0.65mm | 80 | INDUSTRIAL | 5.5V | 4.5V | 20 | Not Qualified | S-PQFP-G80 | RAM | 4KX16 | 16 | 65536 bit | 25 ns | ||||||||||||||||||||||||||||||||||||||
70V3389S6BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 83.3MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3389s6bc-datasheets-5186.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 1.1 Mb | no | 1.4mm | 2 | PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE | No | 1 | 310mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 6 ns | 16b | 64KX18 | 0.015A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||||
IDT71V25761YSA166BQI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 85°C | -40°C | 166MHz | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v25761ysa166bqi8-datasheets-0789.pdf | 165 | Parallel | RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
70914S15PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 50MHz | 1.6mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70914s15pf-datasheets-5159.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 80 | 7 Weeks | 5.5V | 4.5V | 80 | Parallel | 36 kb | yes | 1.4mm | 2 | EAR99 | 1 | 300mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 5V | 0.635mm | 80 | COMMERCIAL | 30 | SRAMs | 5V | Not Qualified | 4.5kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 24b | 4KX9 | 0.015A | 9b | Synchronous | COMMON | ||||||||||||||||||||||||
7025L15J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7025l15j-datasheets-4969.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 128 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 260mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 26b | 8KX16 | 0.0015A | 16b | Asynchronous | COMMON | 2V |
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