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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 71T75602S166BGI | Integrated Device Technology (IDT) | $38.97 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | 2.36mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75602s166bgi-datasheets-2982.pdf | BGA | 14mm | 22mm | 2.5V | Contains Lead | 119 | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 265mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 119 | INDUSTRIAL | SRAMs | 2.3MB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.5 ns | 19b | 0.06A | 36b | Synchronous | COMMON | 2.38V | |||||||||||||||||||||||
| IDT71V3559SA85BQGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 85°C | -40°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3559sa85bqgi8-datasheets-9892.pdf | 165 | Parallel | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7130LA35CB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 125°C | -55°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130la35cb-datasheets-2889.pdf | DIP | 61.72mm | 15.24mm | 5V | Contains Lead | 10 Weeks | 5.5V | 4.5V | 48 | Parallel | 8 kb | 3.3mm | 2 | No | 170mA | RAM, SRAM | 35 ns | 20b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||
| IDT71256SA15PZI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71256sa15pzi-datasheets-9874.pdf | TSSOP | 11.8mm | 8mm | 28 | Parallel | 1 | EAR99 | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | GULL WING | 240 | 5V | 0.55mm | 28 | INDUSTRIAL | 5.5V | 4.5V | 20 | SRAMs | 5V | 0.15mA | Not Qualified | R-PDSO-G28 | RAM, SRAM - Asynchronous | 3-STATE | 32KX8 | 8 | 262144 bit | 0.015A | 15 ns | COMMON | 4.5V | YES | ||||||||||||||||||||||||||||
| 71T75902S75BG | Integrated Device Technology (IDT) | $37.30 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | 2.36mm | RoHS Compliant | 2005 | /files/integrateddevicetechnology-71t75902s75bg-datasheets-2707.pdf | BGA | 14mm | 22mm | 2.5V | Contains Lead | 119 | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | no | 2.15mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 275mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 119 | COMMERCIAL | 20 | SRAMs | 2.3MB | RAM, SDR, SRAM | 100MHz | 3-STATE | 7.5 ns | 20b | 0.04A | 18b | Synchronous | COMMON | 2.38V | ||||||||||||||||||||||
| 70V5388S200BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v5388s200bc-datasheets-2623.pdf | 17mm | 1.4mm | 17mm | 3.3V | Contains Lead | 256 | 3.45V | 3.15V | 256 | Parallel | 1.1 Mb | no | 1.4mm | 4 | 3A991.B.2.A | PIPELINED ARCHITECTURE | No | 1 | 470mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 3 ns | 16b | 0.015A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||||
| 70V06L15J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v06l15j8-datasheets-2611.pdf | PLCC | 24mm | 24mm | 3.3V | Contains Lead | 68 | 7 Weeks | 3.6V | 3V | 68 | Parallel | 128 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 185mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 68 | COMMERCIAL | SRAMs | 16kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 28b | 16KX8 | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||||
| IDT71V632S7PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v632s7pfi-datasheets-9797.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.63V | 3.135V | 20 | SRAMs | 3.3V | 0.16mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 66MHz | 64KX32 | 32 | 2097152 bit | 0.015A | 7 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| 70T3509MS133BP | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3509ms133bp-datasheets-2602.pdf | BGA | 17mm | 17mm | 2.5V | Contains Lead | 256 | 14 Weeks | 2.6V | 2.4V | 256 | Parallel | 36 Mb | no | 1.76mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 1.12A | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | COMMERCIAL | 20 | SRAMs | 4.5MB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 40b | 1MX36 | 0.06A | 36b | Synchronous | COMMON | |||||||||||||||||||||||
| 70V25L15PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v25l15pf8-datasheets-2588.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 128 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 185mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 16kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 26b | 8KX16 | 16b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||
| IDT71V3559SA85BQGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 1.2mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3559sa85bqgi-datasheets-9777.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | unknown | 8542.32.00.41 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 1mm | 165 | INDUSTRIAL | 3.465V | 3.135V | 30 | SRAMs | 3.3V | 0.235mA | Not Qualified | RAM, SRAM | 3-STATE | 90MHz | 256KX18 | 18 | 4718592 bit | 0.045A | 8.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||
| 71421LA25J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71421la25j8-datasheets-9776.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 0.17mA | 2kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 22b | 0.0015A | COMMON | 2V | |||||||||||||||||||||||||||
| IDT6116SA25TP | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 70°C | 0°C | CMOS | 4.191mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt6116sa25tp-datasheets-9757.pdf | DIP | 31.75mm | 7.62mm | 24 | Parallel | 1 | EAR99 | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | NO | DUAL | THROUGH-HOLE | 225 | 5V | 2.54mm | 24 | COMMERCIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.12mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 2KX8 | 8 | 16384 bit | 0.002A | 25 ns | COMMON | 4.5V | YES | ||||||||||||||||||||||||||||||
| 70261S35PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70261s35pf-datasheets-2546.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 256 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | No | 1 | 295mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 32kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 28b | 16KX16 | 0.015A | 16b | Asynchronous | COMMON | ||||||||||||||||||||||
| 71V321L35PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v321l35pf-datasheets-2396.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 95mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 2kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 22b | 0.0015A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||
| IDT71V67602S133BGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67602s133bgi-datasheets-9687.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | INDUSTRIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 2.53.3V | 0.28mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.07A | 4.2 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||
| IDT71V416L12PH8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.2mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416l12ph8-datasheets-9678.pdf | TSOP | 18.41mm | 10.16mm | 44 | Parallel | no | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | GULL WING | 225 | 3.3V | 0.8mm | 44 | COMMERCIAL | 3.6V | 3V | 20 | SRAMs | 3.3V | 0.17mA | Not Qualified | R-PDSO-G44 | RAM, SRAM - Asynchronous | 3-STATE | 256KX16 | 16 | 4194304 bit | 0.01A | 12 ns | COMMON | 3V | ||||||||||||||||||||||||||||
| IDT71V67803S166PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67803s166pf-datasheets-9664.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.34mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 512KX18 | 18 | 9437184 bit | 0.05A | 3.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| 7134SA55JI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 4.57mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7134sa55ji-datasheets-2253.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 32 kb | no | 3.63mm | 2 | EAR99 | BATTERY BACK-UP OPERATION | No | 1 | 270mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | INDUSTRIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 24b | 4KX8 | 0.03A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||
| 71V124SA12TYG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.7592mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v124sa12tyg-datasheets-2150.pdf | 21.95mm | 7.6mm | 3.3V | Lead Free | 32 | 7 Weeks | 3.6V | 3V | 32 | Parallel | 1 Mb | yes | 2.67mm | 1 | No | 1 | 130mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 32 | COMMERCIAL | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 12 ns | 17b | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||||
| 71T75802S100BGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 100MHz | 2.36mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75802s100bgi-datasheets-2149.pdf | BGA | 14mm | 22mm | 2.5V | Contains Lead | 119 | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 195mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 119 | INDUSTRIAL | SRAMs | RAM, SRAM | 3-STATE | 5 ns | 20b | 0.045A | 18b | Synchronous | COMMON | 2.38V | ||||||||||||||||||||||||||
| IDT71P74604S200BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | 200MHz | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p74604s200bq8-datasheets-9586.pdf | 165 | Parallel | QDR, RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V7599S166DR | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 4.1mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v7599s166dr-datasheets-2062.pdf | PQFP | 28mm | 28mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 4.5 Mb | no | 3.5mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 790mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 208 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 34b | 0.03A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||
| IDT71V3559SA85BQG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3559sa85bqg8-datasheets-9583.pdf | 165 | Parallel | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7130SA20TF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130sa20tf8-datasheets-2057.pdf | LQFP | 10mm | 10mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 8 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 20b | 1KX8 | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||
| 70V639S12PRF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v639s12prf8-datasheets-2018.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 128 | 7 Weeks | 3.45V | 3.15V | 128 | Parallel | 2.3 Mb | no | 1.4mm | 2 | No | 1 | 465mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 34b | 0.015A | 18b | Asynchronous | COMMON | |||||||||||||||||||||||||||
| 71T75602S133BGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 2.36mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75602s133bgi-datasheets-1944.pdf | BGA | 14mm | 22mm | 2.5V | Contains Lead | 119 | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 215mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 119 | INDUSTRIAL | SRAMs | 2.3MB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 19b | 0.06A | 36b | Synchronous | COMMON | 2.38V | ||||||||||||||||||||||||
| 70V3589S133BFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3589s133bfi8-datasheets-1842.pdf | 15mm | 15mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 2.3 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 480mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 3.3V | 0.8mm | 208 | INDUSTRIAL | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 32b | 64KX36 | 0.04A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||
| IDT71V3579S65PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 70°C | 0°C | Non-RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3579s65pf-datasheets-9477.pdf | LQFP | Parallel | RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71V67703S80BQI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 100MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v67703s80bqi-datasheets-1758.pdf | 15mm | 13mm | 3.3V | Contains Lead | 165 | 7 Weeks | 3.465V | 3.135V | 165 | Parallel | 9 Mb | no | 1.2mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 230mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 165 | INDUSTRIAL | 20 | SRAMs | 1.1MB | RAM, SDR, SRAM | 100MHz | 3-STATE | 8 ns | 18b | 256KX36 | 0.07A | 36b | Synchronous | COMMON |
