Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Memory Type | Output Characteristics | Access Time | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
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7025S17J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7025s17j8-datasheets-6220.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 128 kb | 3.63mm | 2 | No | 310mA | 16kB | RAM, SDR, SRAM | 17 ns | 26b | 16b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||
IDT71124S20Y8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71124s20y8-datasheets-3536.pdf | 20.955mm | 10.16mm | 32 | 32 | Parallel | 1 | 3A991.B.2.B | not_compliant | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 5V | 1.27mm | 32 | COMMERCIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.14mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 128KX8 | 8 | 1048576 bit | 0.01A | 20 ns | COMMON | 4.5V | YES | |||||||||||||||||||||||||||
TH58BVG2S3HTAI0 | Toshiba |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 85°C | -40°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/toshiba-th58bvg2s3htai0-datasheets-3489.pdf | TFSOP | 16 Weeks | Parallel | yes | unknown | EEPROM, NAND | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
71V3557S85BGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 91MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3557s85bgi8-datasheets-6018.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 235mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | INDUSTRIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 8.5 ns | 17b | 0.045A | 36b | Synchronous | COMMON | |||||||||||||||||||||||
71V321S25PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v321s25pf-datasheets-5956.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | BATTERY BACKUP OPERATION | No | 1 | 130mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.8mm | 64 | INDUSTRIAL | 20 | SRAMs | 2kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 22b | 0.005A | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||
IDT71V3558SA133BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | SYNCHRONOUS | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3558sa133bq8-datasheets-3444.pdf | 165 | 165 | Parallel | not_compliant | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 3.3V | 1mm | COMMERCIAL | SRAMs | 3.3V | 0.3mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX18 | 18 | 4718592 bit | 0.04A | 4.2 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||
70T633S10BCGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.7mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t633s10bcgi-datasheets-5946.pdf | 17mm | 17mm | 2.5V | Lead Free | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 9 Mb | yes | 1.4mm | 2 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 2.5V | 1mm | 256 | INDUSTRIAL | 30 | SRAMs | 0.445mA | 1.1MB | RAM, SDR, SRAM | 3-STATE | 10 ns | 38b | COMMON | |||||||||||||||||||||||||||
7008L35J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008l35j8-datasheets-5942.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 512 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | No | 1 | 255mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 32b | 64KX8 | 0.005A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||
7008S15PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008s15pf-datasheets-5934.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | No | 1 | 365mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 32b | 64KX8 | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||
7133SA25J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7133sa25j8-datasheets-5929.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 32 kb | 3.63mm | 2 | No | 300mA | 4kB | RAM, SDR, SRAM | 25 ns | 22b | 16b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||
70V3579S6DR | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 83MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3579s6dr-datasheets-5928.pdf | PQFP | 28mm | 28mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 1.1 Mb | no | 3.5mm | 2 | No | 1 | 310mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 208 | COMMERCIAL | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 15b | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||
IDT71V124SA20PHGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Rail/Tube | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v124sa20phgi-datasheets-3431.pdf | SOIC | 20.95mm | 3.3V | 32 | 3.6V | 3V | 32 | Parallel | 1 Mb | 1 | unknown | 1 | 115mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 32 | INDUSTRIAL | 30 | SRAMs | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 20 ns | 17b | 8 | 8b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||||||
7025S35J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7025s35j-datasheets-5924.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 128 kb | 3.63mm | 2 | No | 250mA | 16kB | RAM, SDR, SRAM | 35 ns | 26b | 16b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||
TH58BVG2S3HTA00 | Toshiba |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 70°C | 0°C | RoHS Compliant | 2014 | https://pdf.utmel.com/r/datasheets/toshiba-th58bvg2s3hta00-datasheets-3410.pdf | TFSOP | Parallel | yes | unknown | EEPROM, NAND | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
71V124SA12PHG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v124sa12phg-datasheets-5814.pdf | SOIC | 20.95mm | 10.16mm | 3.3V | Lead Free | 32 | 7 Weeks | 3.6V | 3V | 32 | Parallel | 1 Mb | yes | 1mm | 1 | No | 1 | 130mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 32 | COMMERCIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 12 ns | 17b | 8b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||
7005L20FB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 125°C | -55°C | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005l20fb-datasheets-5687.pdf | 24mm | 24mm | 5V | Contains Lead | 5.5V | 4.5V | 68 | Parallel | 64 kb | 2mm | 2 | No | 320mA | 8kB | RAM, SDR, SRAM | 20 ns | 26b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||
IDT71V3558SA133BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2007 | /files/integrateddevicetechnology-idt71v3558sa133bg8-datasheets-3350.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | COMMERCIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 3.3V | 0.3mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX18 | 18 | 4718592 bit | 0.04A | 4.2 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
IDT71V547S100PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 66.6MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v547s100pfi-datasheets-3333.pdf | TQFP | 20mm | 3.3V | 100 | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | 1 | FLOW-THROUGH ARCHITECTURE | 1 | 210mA | e0 | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 20 | SRAMs | Not Qualified | RAM, SRAM | 3-STATE | 10 ns | 17b | 36 | 0.045A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||||
7133LA45J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7133la45j-datasheets-5640.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 32 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 45 ns | 22b | 0.0015A | 16b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||
IDT71124S12YI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71124s12yi8-datasheets-3319.pdf | 20.955mm | 10.16mm | 32 | 32 | Parallel | 3A991.B.2.B | not_compliant | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 5V | 1.27mm | 32 | INDUSTRIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.16mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 128KX8 | 8 | 1048576 bit | 0.01A | 12 ns | COMMON | 4.5V | |||||||||||||||||||||||||||||
7008L20J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008l20j-datasheets-5637.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 512 kb | no | 3.63mm | 2 | No | 1 | 285mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 32b | 64KX8 | 0.005A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||
71342SA25PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71342sa25pf-datasheets-5638.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 32 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 280mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 24b | 4KX8 | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||
7133LA25J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7133la25j-datasheets-5629.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 32 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 270mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 22b | 0.0015A | 16b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||
71V016SA12YGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v016sa12ygi-datasheets-5620.pdf | 28.6mm | 10.2mm | 3.3V | Lead Free | 44 | 12 Weeks | 3.6V | 3V | 44 | Parallel | 1 Mb | yes | 2.9mm | 1 | No | 1 | 160mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 44 | INDUSTRIAL | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 12 ns | 16b | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||
IDT71V424L15PH | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v424l15ph-datasheets-3301.pdf | TSOP | 18.41mm | 10.16mm | 44 | Parallel | no | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | GULL WING | 225 | 3.3V | 0.8mm | 44 | COMMERCIAL | 3.6V | 3V | 20 | SRAMs | 3.3V | 0.145mA | Not Qualified | R-PDSO-G44 | RAM, SRAM - Asynchronous | 3-STATE | 512KX8 | 8 | 4194304 bit | 0.01A | 15 ns | COMMON | 3V | |||||||||||||||||||||||||||
71V65903S85BGG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 70°C | 0°C | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65903s85bgg-datasheets-5532.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 7 Weeks | 119 | Parallel | 9 Mb | 2.15mm | 1 | No | RAM, SRAM | 19b | ||||||||||||||||||||||||||||||||||||||||||||||||||||
70V38L15PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v38l15pfg-datasheets-5493.pdf | TQFP | 14mm | 14mm | 3.3V | Lead Free | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 1.1 Mb | yes | 1.4mm | 2 | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 100 | COMMERCIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 32b | 64KX18 | 0.003A | COMMON | 3V | |||||||||||||||||||||||||
71T75802S200BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | 2.36mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75802s200bg8-datasheets-5441.pdf | BGA | 14mm | 22mm | 2.5V | Contains Lead | 119 | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 275mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 119 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 3.2 ns | 20b | 0.04A | 18b | Synchronous | COMMON | 2.38V | |||||||||||||||||||||||
7164L55TDB | Integrated Device Technology (IDT) | $26.95 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7164l55tdb-datasheets-5338.pdf | CDIP | 37.72mm | 7.62mm | 5V | Contains Lead | 28 | 10 Weeks | 5.5V | 4.5V | 28 | Parallel | 64 kb | no | 3.56mm | 1 | No | 1 | e0 | Tin/Lead (Sn/Pb) | NO | DUAL | THROUGH-HOLE | 240 | 5V | 2.54mm | 28 | MILITARY | SRAMs | 5V | MIL-STD-883 Class B | 8kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 55 ns | 13b | 8KX8 | 0.0002A | COMMON | 2V | ||||||||||||||||||||||||
71T75602S150BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 150MHz | 2.36mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75602s150bg8-datasheets-5240.pdf | BGA | 14mm | 22mm | 2.5V | Contains Lead | 119 | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 215mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 119 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 3.8 ns | 19b | 0.04A | 36b | Synchronous | COMMON | 2.38V |
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