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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | Page Size | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 71V3556S166PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3556s166pfg8-datasheets-1903.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | No | 1 | 350mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.5 ns | 17b | 0.04A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||
| TC58NVG2S0HTAI0 | Toshiba | $4.78 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 85°C | -40°C | CMOS | 1.2mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/toshiba-tc58nvg2s0htai0-datasheets-1949.pdf | TFSOP | 18.4mm | 12mm | 3.3V | 48 | 12 Weeks | 48 | Parallel, Serial | 4 Gb | No | 1 | YES | DUAL | GULL WING | 3.3V | 0.5mm | 48 | INDUSTRIAL | 3.6V | 2.7V | EEPROM, NAND, SLC NAND | 512MX8 | 8 | 4kB | ||||||||||||||||||||||||||||||||||||||||||||
| 70V24S25PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v24s25pf8-datasheets-1850.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 64 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 0.19mA | 8kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 24b | 4KX16 | 0.005A | COMMON | 3V | |||||||||||||||||||||||||||
| 7142LA100J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7142la100j8-datasheets-1825.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | 3.63mm | 2 | No | 110mA | 2kB | RAM, SDR, SRAM | 100 ns | 22b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V016SA15PH8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.2mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v016sa15ph8-datasheets-1920.pdf | TSOP | 18.41mm | 10.16mm | 44 | Parallel | 1 | 3A991.B.2.B | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | GULL WING | 225 | 3.3V | 0.8mm | 44 | COMMERCIAL | 3.6V | 3V | 20 | SRAMs | 3.3V | 0.13mA | Not Qualified | R-PDSO-G44 | RAM, SRAM - Asynchronous | 3-STATE | 64KX16 | 16 | 1048576 bit | 0.01A | 15 ns | COMMON | 3.15V | YES | ||||||||||||||||||||||||||||||
| IDT7164L35YG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt7164l35yg-datasheets-1914.pdf | 28 | 28 | Parallel | yes | unknown | e3 | Matte Tin (Sn) - annealed | YES | DUAL | J BEND | 260 | 5V | 1.27mm | COMMERCIAL | NOT SPECIFIED | SRAMs | 5V | 0.09mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 8KX8 | 8 | 65536 bit | 0.00006A | 35 ns | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||
| TC58NVG2S0HTA00 | Toshiba | $2.22 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 70°C | 0°C | CMOS | 1.2mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/toshiba-tc58nvg2s0hta00-datasheets-1872.pdf | TFSOP | 18.4mm | 12mm | 3.3V | 48 | 48 | Parallel, Serial | 4 Gb | No | 1 | YES | DUAL | GULL WING | 3.3V | 0.5mm | 48 | COMMERCIAL | 3.6V | 2.7V | EEPROM, NAND, SLC NAND | 512MX8 | 8 | 4kB | |||||||||||||||||||||||||||||||||||||||||||||
| 71T75602S150BGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 85°C | -40°C | 150MHz | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75602s150bgi8-datasheets-1623.pdf | BGA | 14mm | 22mm | 2.5V | Contains Lead | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | 2.15mm | 1 | No | 235mA | RAM, SRAM | 3.8 ns | 19b | 36b | Synchronous | ||||||||||||||||||||||||||||||||||||||||||||||||
| 70V9279L7PRF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 83.3MHz | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9279l7prf-datasheets-1549.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 128 | 7 Weeks | 3.6V | 3V | 128 | Parallel | 512 kb | no | 1.4mm | 2 | No | 290mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | COMMERCIAL | SRAMs | 64kB | RAM, SDR, SRAM | 3-STATE | 7 ns | 30b | 0.003A | 16b | Synchronous | COMMON | 3V | |||||||||||||||||||||||||||||
| IDT71V547S80PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v547s80pf8-datasheets-1828.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.25mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 95MHz | 128KX36 | 36 | 4718592 bit | 0.04A | 8 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||
| 7132LA20J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7132la20j-datasheets-1532.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | no | 3.63mm | 2 | EAR99 | AUTOMATIC POWER-DOWN; BATTERY BACKUP | No | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 22b | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||||
| IDT71V3558S133PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3558s133pfi8-datasheets-1824.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.31mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 256KX18 | 18 | 4718592 bit | 0.045A | 4.2 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||
| 7130SA55JI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 4.57mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130sa55ji8-datasheets-1523.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 8 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 190mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | INDUSTRIAL | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 20b | 1KX8 | 0.03A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||||
| TC58BYG2S0HBAI6 | Toshiba |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 85°C | -40°C | CMOS | ASYNCHRONOUS | 1mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/toshiba-tc58byg2s0hbai6-datasheets-1797.pdf | BGA | 8mm | 6.5mm | 67 | 67 | Parallel | 1 | YES | BOTTOM | BALL | 1.8V | 0.8mm | 67 | INDUSTRIAL | 1.95V | 1.7V | EEPROM, NAND | 1.8V | 512MX8 | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||
| 70V3319S133BFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3319s133bfi-datasheets-1372.pdf | 15mm | 1.4mm | 15mm | 3.3V | Contains Lead | 480mA | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 4.5 Mb | no | 1.4mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 480mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | INDUSTRIAL | SRAMs | 512kB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 18b | 0.04A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||
| 71V2546S133BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v2546s133bg-datasheets-1369.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 300mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | OTHER | 20 | SRAMs | 512kB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 17b | 0.04A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||
| 70V9099L9PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 40MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9099l9pfi8-datasheets-1308.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 1 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | INDUSTRIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 20 ns | 17b | 8b | Synchronous | COMMON | 3V | |||||||||||||||||||||||||||
| 7050L35PQF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 70°C | 0°C | Non-RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7050l35pqf-datasheets-1273.pdf | PQFP | 24.13mm | 24.13mm | Contains Lead | 132 | Parallel | no | 3.55mm | No | e0 | Tin/Lead (Sn/Pb) | 132 | 1kB | RAM, SDR, SRAM | 35 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V3569S6BF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 83.3MHz | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3569s6bf8-datasheets-1142.pdf | 15mm | 15mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 576 kb | no | 1.4mm | 2 | PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE | No | 1 | 310mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 6 ns | 14b | 16KX36 | 0.015A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||
| 70V631S12BCI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v631s12bci-datasheets-1114.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 4.5 Mb | no | 1.4mm | 2 | No | 1 | 515mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | INDUSTRIAL | SRAMs | 512kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 18b | 0.015A | 18b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||
| 7164S85TDB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 125°C | -55°C | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7164s85tdb-datasheets-1049.pdf | CDIP | 37.72mm | 7.62mm | 5V | Contains Lead | 5.5V | 4.5V | 28 | Parallel | 64 kb | 3.56mm | 1 | No | 100mA | RAM, SRAM - Asynchronous | 85 ns | 13b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||
| 71V65703S85BGG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 91MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65703s85bgg8-datasheets-1042.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 9 Mb | yes | 2.15mm | 1 | FLOW-THROUGH | No | 1 | 225mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 119 | COMMERCIAL | 30 | 1.1MB | RAM, SDR, SRAM | 8.5 ns | 18b | 256KX36 | 36b | Synchronous | ||||||||||||||||||||||||||||||||
| IDT70825S25G | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Through Hole | 70°C | 0°C | CMOS | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt70825s25g-datasheets-1617.pdf | 5V | 84 | 5.5V | 4.5V | 84 | Parallel | 128 kb | 2 | EAR99 | AUTOMATIC POWER-DOWN | not_compliant | 1 | 360mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | NOT SPECIFIED | 5V | 84 | COMMERCIAL | NOT SPECIFIED | Other Memory ICs | 5V | Not Qualified | RAM | 25 ns | 26b | 8KX16 | 16 | 0.015A | 16b | Asynchronous | |||||||||||||||||||||||||||||||||||||
| IDT71V2576YS150PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 150MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | /files/integrateddevicetechnology-idt71v2576ys150pf8-datasheets-1615.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 2.53.3V | 0.295mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.03A | 3.8 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||
| TC58BYG1S3HBAI6 | Toshiba |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 85°C | -40°C | CMOS | 1mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/toshiba-tc58byg1s3hbai6-datasheets-1568.pdf | 8mm | 6.5mm | 1.8V | 67 | 1.95V | 1.7V | 67 | Parallel, Serial | 2 Gb | No | 1 | BOTTOM | BALL | 1.8V | 0.8mm | 67 | INDUSTRIAL | EEPROM, NAND, SLC NAND | 256MX8 | 8 | 2kB | |||||||||||||||||||||||||||||||||||||||||||||||
| 71256SA15PZGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71256sa15pzgi8-datasheets-0856.pdf | TSOP | 8mm | 11.8mm | 5V | Lead Free | 28 | 7 Weeks | 5.5V | 4.5V | 28 | Parallel | 256 kb | yes | 1mm | 1 | EAR99 | No | 1 | 150mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 5V | 0.55mm | 28 | INDUSTRIAL | 30 | SRAMs | 5V | 32kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 15 ns | 15b | 32KX8 | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||||
| 70V7519S200BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v7519s200bc-datasheets-0815.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 9 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 950mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 15 ns | 18b | 0.03A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||||
| IDT71V3558S133BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | SYNCHRONOUS | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3558s133bq8-datasheets-1532.pdf | 165 | 165 | Parallel | not_compliant | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 3.3V | 1mm | COMMERCIAL | SRAMs | 3.3V | 0.3mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX18 | 18 | 4718592 bit | 0.04A | 4.2 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||||||||||
| 7130SA100PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130sa100pf-datasheets-0799.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 8 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 100 ns | 10b | 1KX8 | 0.015A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||
| 7132SA35C | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 70°C | 0°C | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7132sa35c-datasheets-0636.pdf | DIP | 61.72mm | 15.24mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 48 | Parallel | 16 kb | 3.3mm | 2 | No | 165mA | 2kB | RAM, SDR, SRAM | 35 ns | 22b | 8b | Asynchronous |
